Data Sheet
1.5V Drive Pch + Pch MOSFET
TT8J13
Structure Silicon P-channel MOSFET Dimensions (Unit : mm)
TSST8
(8)
(7)
(6)
(5)
Features 1) Low On-resistance. 2) Small high power package. 3) Low voltage drive(1.5V drive).
(1)
(2)
(3)
(4)
Abbreviated symbol : J13
Application Switching
Inner circuit
(8) (7) (6) (5)
Packaging specifications Type TT8J13 Package Code Basic ordering unit (pieces) Taping TCR 3000
(1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain
∗2 ∗2
∗1
∗1
(1)
(2)
(3)
(4)
Absolute maximum ratings (Ta = 25 C) Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Power dissipation Channel temperature Range of storage temperature
*1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board.
∗1 ESD PROTECTION DIODE ∗2 BODY DIODE
Symbol VDSS VGSS
Limits 12 0 to 8 2.5
Unit V V A A A A W / TOTAL W / ELEMENT C C
Continuous Pulsed Continuous Pulsed
ID IDP Is Isp PD Tch Tstg
*1
5 0.8 5 1.25 1 150 55 to 150
*1 *2
Thermal resistance Parameter Channel to Ambient
* Mounted on a ceramic board.
Symbol Rth (ch-a)
*
Limits 100 125
Unit ˚C / W /TOTAL ˚C / W /ELEMENT
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2011.03 - Rev.A
TT8J13
Electrical characteristics (Ta = 25 C) Parameter Gate-source leakage Zero gate voltage drain current Gate threshold voltage Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge
*Pulsed
Data Sheet
Symbol IGSS IDSS VGS (th)
Min. 12 0.3 3.5 -
Typ. 44 55 75 90 2000 130 120 11 40 160 60 16 2.4 2.2
Max. 10 10 1.0 62 77 110 180 -
Unit A V A V
Conditions VGS=8V, VDS=0V ID=1mA, VGS=0V VDS=12V, VGS=0V VDS=6V, ID=1mA ID=2.5A, VGS=4.5V ID=1.2A, VGS=2.5V ID=1.2A, VGS=1.8V ID=0.5A, VGS=1.5V ID=2.5A, VDS=6V VDS=6V VGS=0V f=1MHz ID=1.2A, VDD 6V VGS=4.5V RL=5 RG=10 ID=2.5A VDD 6V VGS=4.5V
Drain-source breakdown voltage V (BR)DSS
RDS (on)
m
l Yfs l* Ciss Coss Crss td(on) * tr * td(off) * tf * Qg * Qgs * Qgd *
S pF pF pF ns ns ns ns nC nC nC
Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Forward Voltage
*Pulsed
Symbol VSD *
Min. -
Typ. -
Max. 1.2
Unit V
Conditions Is=2.5A, VGS=0V
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2011.03 - Rev.A
TT8J13
Electrical characteristic curves (Ta=25C)
Fig.1 Typical output characteristics(Ⅰ) 2.5 VGS= -4.5V VGS= -2.5V VGS= -1.8V VGS= -1.5V Ta=25°C pulsed
Data Sheet
Fig.2 Typical output characteristics(Ⅱ) 2.5 Ta=25°C pulsed
2 DRAIN CURRENT : -ID[A]
2 DRAIN CURRENT : -ID[A]
VGS= -1.2V
1.5 VGS= -1.2V 1
1.5 VGS= -4.5V VGS= -2.5V VGS= -1.8V VGS= -1.5V
1
0.5 VGS= -1.0V 0 0 0.2 0.4 0.6 0.8 1 DRAIN-SOURCE VOLTAGE : -VDS[V]
0.5 VGS= -1.0V 0 0 2 4 6 8 10 DRAIN-SOURCE VOLTAGE : -VDS[V]
Fig.3 Typical Transfer Characteristics 10 VDS= -6V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ] 1 DRAIN CURRENT : -ID[A] Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 1000
Fig.4 Static Drain-Source On-State Resistance vs. Drain Current(Ⅰ) Ta=25°C pulsed VGS= -1.5V VGS= -1.8V VGS= -2.5V VGS= -4.5V 100
0.1
0.01
0.001 0 0.5 1 1.5 GATE-SOURCE VOLTAGE : -VGS[V] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current(Ⅱ) 1000 VGS= -4.5V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ]
10 0.1 1 DRAIN-CURRENT : -ID[A] 10
Fig.6 Static Drain-Source On-State Resistance vs. Drain Current(Ⅲ) 1000 VGS= -2.5V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ]
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 100
100
10 0.1 1 DRAIN-CURRENT : -ID[A] 10
10 0.1 1 DRAIN-CURRENT : -ID[A] 10
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2011.03 - Rev.A
TT8J13
Fig.7 Static Drain-Source On-State Resistance vs. Drain Current(Ⅳ) Fig.8 Static Drain-Source On-State Resistance vs. Drain Current(Ⅴ) 1000 VGS= -1.8V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta=-25°C VGS= -1.5V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta=-25°C 100
Data Sheet
1000
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ]
100
10 0.1 1 DRAIN-CURRENT : -ID[A] 10
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ]
10 0.1 1 DRAIN-CURRENT : -ID[A] 10
Fig.9 Forward Transfer Admittance vs. Drain Current 100 FORWARD TRANSFER ADMITTANCE : |Yfs| VDS= -6V Pulsed 10 VGS=0V Pulsed REVERSE DRAIN CURRENT : -Is [A] 1
Fig.10 Reverse Drain Current vs. Sourse-Drain Voltage
10
0.1
1
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
Ta=125°C Ta=75°C Ta=25°C Ta=-25°C
0.01
0.1 0.1 1 DRAIN-CURRENT : -ID[A] Fig.11 Static Drain-Source On-State Resistance vs. Gate Source Voltage 150 Ta=25°C pulsed SWITCHING TIME : t [ns] ID= -1.25A 100 ID= -2.5A 10
0.001 0 0.5 1 1.5 SOURCE-DRAIN VOLTAGE : -VSD [V]
Fig.12 Switching Characteristics 1000 td(off) Ta=25°C VDD= -6V VGS=-4.5V RG=10W Pulsed
STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS(ON)[mΩ]
100
tf 10
50
td(on) tr 0 0 2 4 6 8 GATE-SOURCE VOLTAGE : -VGS[V] 1 0.01 0.1 1 10 100 DRAIN-CURRENT : -ID[A]
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2011.03 - Rev.A
TT8J13
Fig.14 Typical Capacitance vs. Drain-Source Voltage 10000 Ciss
Data Sheet
Fig.13 Dynamic Input Characteristics 5
GATE-SOURCE VOLTAGE : -VGS [V]
4 CAPACITANCE : C [pF] 1000
3
2 Ta=25°C VDD= -6V ID= -2.5A Pulsed
100
Coss Crss Ta=25°C f=1MHz VGS=0V 1 10 100
1
0 0 5 10 15 20 TOTAL GATE CHARGE : Qg [nC]
10 0.01 0.1 DRAIN-SOURCE VOLTAGE : -VDS[V]
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5/6
2011.03 - Rev.A
TT8J13
Measurement circuits
Data Sheet
Pulse Width
VGS
ID RL D.U.T.
VDS
VGS
10% 50% 10%
90%
50% 10% 90%
RG VDD
VDS td(on) ton 90% tr td(off) toff tf
Fig.1-1 Switching Time Measurement Circuit
Fig.1-2 Switching Waveforms
VG
ID VGS RL IG(Const.) D.U.T. VDD VDS
Qg VGS Qgs Qgd
Charge
Fig.2-1 Gate Charge Measurement Circuit
Fig.2-2 Gate Charge Waveform
Notice This product might cause chip aging and breakdown under the large electrified environment. Please consider to design ESD protection circuit.
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6/6
2011.03 - Rev.A
Notice
Notes
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