UFZV4.3B
Zener Diode
Data sheet
● Outline
PD
500
mW
● Feature
● Inner Circuit
High reliability
Small mold type
● Application
● Packaging Specification
Voltage regulation
Packing
Reel Size(mm)
Taping Width(mm)
Basic Ordering Unit(pcs)
Taping Code
Marking
● Structure
Silicon Epitaxial Planar
Embossed Tape
180
8
3000
TE-17
8B
● Absolute Maximum Rating (Ta = 25℃)
Parameter
Symbol
Limits
Unit
PD
Tj
Tstg
500
150
-55 ~ 150
mW
Power dissipation*
Junction temperature
Storage temperature
℃
℃
* Mounting on FR-5board (3.5×1.5[inches])
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2019/02/19_Rev.004
Data sheet
UFZV Series
● Characteristic (Ta = 25ºC)
Symbol
Zener Voltage:V Z(V)
P/N
UFZV 3.6B
UFZV 3.9B
UFZV 4.3B
UFZV 4.7B
UFZV 5.1B
UFZV 5.6B
UFZV 6.2B
UFZV 6.8B
UFZV 7.5B
UFZV 8.2B
UFZV 9.1B
UFZV 10B
UFZV 11B
UFZV 12B
UFZV 13B
UFZV 15B
UFZV 16B
UFZV 18B
UFZV 20B
UFZV 22B
UFZV 24B
UFZV 27B
UFZV 30B
UFZV 33B
UFZV 36B
UFZV 39B
Dynamic Impedance:ZZ(Ω) Reverse Current:IR(μA)
MIN.
MAX.
Iz(mA)
MAX.
Iz(mA)
MAX.
VR(V)
3.580
3.870
4.151
4.534
4.940
5.450
5.976
6.525
7.104
7.827
8.635
9.497
10.550
11.510
12.640
14.000
15.390
17.000
18.870
20.770
22.780
25.190
27.980
30.660
33.230
35.880
3.836
4.151
4.423
4.795
5.200
5.730
6.307
6.865
7.509
8.265
9.106
10.050
11.160
12.160
13.340
14.790
16.240
17.950
19.890
21.920
24.020
26.560
29.500
32.320
35.010
37.790
20
20
20
20
20
20
20
20
20
20
20
20
10
10
10
10
10
10
10
5
5
5
5
5
5
5
60
50
40
25
20
13
10
8
8
8
8
8
10
12
14
16
18
23
28
30
35
45
55
65
75
85
20
20
20
20
20
20
20
20
20
20
20
20
10
10
10
10
10
10
10
5
5
5
5
5
5
5
10.0
5.0
5.0
5.0
5.0
5.0
5.0
2.0
0.5
0.5
0.5
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
1.0
1.0
1.0
1.0
1.5
2.5
3.0
3.5
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
15.0
17.0
19.0
21.0
23.0
25.0
27.0
30.0
(1) Zener voltage (VZ) is measured by applying current with 40ms pulse.
(2) Dynamic resistance (ZZ) is measured by applying small current (AC) and specifiedcurrent (IZ) simultaneously.
● Marking
P/N
Marking
P/N
Marking
UFZV 3.6B
UFZV 3.9B
UFZV 4.3B
UFZV 4.7B
UFZV 5.1B
UFZV 5.6B
UFZV 6.2B
UFZV 6.8B
UFZV 7.5B
UFZV 8.2B
UFZV 9.1B
UFZV 10B
UFZV 11B
6B
7B
8B
9B
AB
BB
CB
DB
EB
FB
GB
HB
JB
UFZV 12B
UFZV 13B
UFZV 15B
UFZV 16B
UFZV 18B
UFZV 20B
UFZV 22B
UFZV 24B
UFZV 27B
UFZV 30B
UFZV 33B
UFZV 36B
UFZV 39B
KB
LB
MB
NB
PB
QB
RB
SB
TB
UB
VB
WB
XB
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2019/02/19_Rev.004
UFZV4.3B
Data sheet
● Characteristic Curves
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2019/02/19_Rev.004
UFZV4.3B
Data sheet
● Characteristic Curves
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2019/02/19_Rev.004
UFZV4.3B
Data sheet
● Dimensions (SOD-323FL SC-90A UMD2)
●Taping (Unit:mm)
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© 2019 ROHM Co., Ltd. All rights reserved.
2019/02/19_Rev.004
Notice
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5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
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Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
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please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Rev.004
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Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
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Datasheet
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