US6M1

US6M1 Transistors Small switching US6M1 Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small and Surface Mount Package (TUMT6). External dimensions (Unit : mm) TUMT6 0.2 2.0±0.1 0.3 +0.1 −0.05 (6) (5) (4) 2.1±0.1 1.7±0.1 0.2 Application Power switching, DC / DC converter. 0~0.1 (1) (2) (3) 1pin mark 0.65 0.65 1.3±0.1 0.17±0.05 Each lead has same dimensions Abbreviated symbol : M01 Absolute maximum ratings (Ta=25°C) Parameter Drain-source voltage Gate-source voltage Continuous Pulsed Continuous Source current (Body diode) Pulsed Total power dissipation (TC=25°C) Channel temperature Storage temperature Drain current Symbol VDSS VGSS ID IDP IS ISP PD Tch Tstg Limits Tr1 : Nchannel Tr2 : Pchannel 30 −20 20 −12 ±1 ±1.4 ±4 ±5.6 0.6 −0.4 5.6 −4 1 1 150 150 −55 to +150 −55 to +150 Unit V V A A A A W °C °C Equivalent circuit (6) (5) ∗2 (4) (6) (5) (4) ∗1 ∗1 ∗2 ∗1 ∗1 (1) ∗2 (2) (3) 0.2MAX (1) Tr1 (Nch) Source (2) Tr1 (Nch) Gate (3) Tr2 (Pch) Drain (4) Tr2 (Pch) Source (5) Tr2 (Pch) Gate (6) Tr1 (Nch) Drain 0.85MAX 0.77±0.05 (1) (2) (3) ∗1 Pw≤10µs, Duty cycle≤1% ∗2 With each pin mounted on the recommended lands. ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE Thermal resistance (Ta=25°C) Parameter Channel to ambient Symbol Rth (ch-A) Limits 125 Unit °C / W 1/7 US6M1 Transistors Electrical characteristics (Ta=25°C) Parameter Symbol IGSS Gate-source leakage Drain-source breakdown voltage V(BR) DSS Zero gate voltage drain current IDSS Gate threshold voltage VGS (th) Static drain-source on-state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge ∗Pulsed RDS (on) ∗ Yfs ∗ Ciss Coss Crss td (on) ∗ tr ∗ td (off) ∗ tf ∗ Qg ∗ Qgs ∗ Qgd ∗ Min. − 30 − 1.0 − − − 1.0 − − − − − − − − − − Typ. − − − − 170 250 270 − 70 15 12 6 6 13 8 1.4 0.6 0.3 Max. 10 − 1 2.5 240 350 380 − − − − − − − − 2.0 − − Unit µA V µA V mΩ S pF pF pF ns ns ns ns nC nC nC Conditions VGS=20V, VDS=0V ID=1mA, VGS=0V VDS=30V, VGS=0V VDS=10V, ID=1mA ID=1.4A, VGS=10V ID=1.4A, VGS=4.5V ID=1.4A, VGS=4V ID=1.4A, VDS=10V VDS=10V VGS=0V f=1MHz ID=0.7A, VDD 15V VGS=10V RL=21Ω RGS=10Ω VDD 15V RL 10.7Ω VGS=5V RGS=10Ω ID=1.4A Body diode characteristics (Source-Drain) (Ta=25°C) Parameter Forward voltage ∗Pulsed Symbol VSD ∗ Min. − Typ. − Max. 1.2 Unit V Test Conditions IS=1.4A, VGS=0V 2/7 US6M1 Transistors Electrical characteristics (Ta=25°C) Parameter Symbol Min. IGSS − Gate-source leakage Drain-source breakdown voltage V(BR) DSS −20 Zero gate voltage drain current − IDSS Gate threshold voltage VGS (th) −0.7 − ∗ Static drain-source on-state − RDS (on) resistance − Yfs ∗ 0.7 Forward transfer admittance − Input capacitance Ciss Output capacitance − Coss Reverse transfer capacitance − Crss Turn-on delay time − td (on) ∗ Rise time − tr ∗ Turn-off delay time − td (off) ∗ Fall time − tf ∗ Total gate charge − Qg ∗ Gate-source charge − Qgs ∗ Gate-drain charge − Qgd ∗ ∗Pulsed Typ. − − − − 280 310 570 − 150 20 20 9 8 25 10 2.1 0.5 0.5 Max. 10 − −1 −2.0 390 430 800 − − − − − − − − − − − Unit µA V µA V mΩ S pF pF pF ns ns ns ns nC nC nC Conditions VGS=12V, VDS=0V ID= −1mA, VGS=0V VDS= −20V, VGS=0V VDS= −10V, ID= −1mA ID= −1A, VGS= −4.5V ID= −1A, VGS= −4V ID= −0.5A, VGS= −2.5V ID= −0.5A, VDS= −10V VDS= −10V VGS=0V f=1MHz ID= −0.5A, VDD −15V VGS= −4.5V RL=30Ω RGS=10Ω VDD −15V RL=15Ω VGS= −4.5V RGS=10Ω ID= −1A Body diode characteristics (Source-Drain) (Ta=25°C) Parameter Forward voltage ∗Pulsed Symbol VSD ∗ Min. − Typ. − Max. −1.2 Unit V Test Conditions IS= −0.4A, VGS=0V 3/7 US6M1 Transistors N-ch Electrical characteristic curves 1000 100 Crss Coss Ciss SWITCHING TIME : t (ns) CAPACITANCE : C (pF) tf 100 td (off) 10 GATE-SOURCE VOLTAGE : VGS (V) Ta=25°C f=1MHz VGS=0V 1000 Ta=25°C VDD=15V VGS=4.5V RG=10Ω Pulsed 6 Ta=25°C VDD=15V 5 ID=1.5A RG=10Ω Pulsed 4 3 2 1 0 10 td (on) tr 1 0.01 0.1 1 10 100 1 0.01 0.1 1 10 0 0.5 1 1.5 2 DRAIN-SOURCE VOLTAGE : VDS (A) DRAIN CURRENT : ID (A) TOTAL GATE CHARGE : Qg (nC) Fig.1 Typical Capacitance vs. Drain-Source Voltage Fig.2 Switching Characteristics Fig.3 Dynamic Input Characteristics 10 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (Ω) VDS=10V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 7 ID=1.5A ID=0.75A Ta=25°C Pulsed 10 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C VGS=0V Pulsed 1 SOURCE CURRENT : Is (A) DRAIN CURRENT : ID (A) 1 0.1 0.1 0.01 0.001 0.0 0.5 1.0 1.5 2.0 2.5 8 9 10 0.01 0.0 0.5 1.0 1.5 GATE-SOURCE VOLTAGE : VGS (V) GATE-SOURCE VOLTAGE : VGS (V) SOURCE-DRAIN VOLTAGE : VSD (V) Fig.4 Typical Transfer Characteristics Fig.5 Static Drain-Source On-State Resistance vs. Gate-Source Voltage Fig.6 Source Current vs. Source-Drain Voltage 10 STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (Ω) 1 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (Ω) STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (Ω) VGS=4.5V Pulsed 10 VGS=4.0V Pulsed 10 VGS=2.5V Pulsed 1 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 0.1 0.01 0.1 1 10 0.1 0.01 0.1 1 10 0.1 0.01 0.1 1 10 DRAIN CURRENT : ID (A) DRAIN CURRENT : ID (A) DRAIN CURRENT : ID (A) Fig.7 Static Drain-Source On-State Resistance vs. Drain Current (Ι) Fig.8 Static Drain-Source On-State Resistance vs. Drain Current (ΙΙ) Fig.9 Static Drain-Source On-State Resistance vs. Drain Current (ΙΙΙ) 4/7 US6M1 Transistors P-ch Electrical characteristic curves 1000 GATE-SOURCE VOLTAGE : −VGS (V) SWITCHING TIME : t (ns) Ta=25°C f=1MHz VGS=0V 10000 CAPACITANCE : C (pF) 1000 Ta=25°C VDD= −15V VGS= −4.5V RG=10Ω Pulsed 8 7 6 5 4 3 2 1 0 0 0.5 1 1.5 2 Ta=25°C VDD= −15V ID= −1A RG=10Ω Pulsed tf 100 Ciss 100 td (off) td (on) tr 10 Crss Coss 10 0.01 0.1 1 10 100 1 0.01 0.1 1 10 2.5 3 DRAIN-SOURCE VOLTAGE : −VDS (V) DRAIN CURRENT : −ID (A) TOTAL GATE CHARGE : Qg (nC) Fig.1 Typical Capacitance vs. Drain-Source Voltage Fig.2 Switching Characteristics Fig.3 Dynamic Input Characteristics STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) Ta=25°C Pulsed 1 750 ID= −1A ID= −0.5A REVERSE DRAIN CURRENT : −IS (A) 10 DRAIN CURRENT : −ID (A) Ta=25°C VDS= −10V Pulsed 1000 10 VGS=0V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1 0.1 500 0.1 0.01 250 0.001 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 0 0 2 4 6 8 10 12 0.01 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 GATE-SOURCE VOLTAGE : −VGS (V) GATE-SOURCE VOLTAGE : −VGS (V) SOURCE-DRAIN VOLTAGE : −VSD (V) Fig.4 Typical Transfer Characteristics Fig.5 Static Drain-Source On-State Resistance vs. Gate-Source Voltage Fig.6 Source Current vs. Source-Drain Voltage STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) VGS= −4.5V Pulsed VGS= −4V Pulsed STATIC DRAIN-SOURCE ON-STATE RESISTANCE : RDS (on) (mΩ) 10000 10000 10000 VGS= −2.5V Pulsed Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1000 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1000 Ta=125°C Ta=75°C Ta=25°C Ta= −25°C 1000 100 0.01 0.1 1 10 100 0.01 0.1 1 10 100 0.01 0.1 1 10 DRAIN CURRENT : −ID (A) DRAIN CURRENT : −ID (A) DRAIN CURRENT : −ID (A) Fig.7 Static Drain-Source On-State Resistance vs. Drain Current (Ι) Fig.8 Static Drain-Source On-State Resistance vs. Drain Current (ΙΙ) Fig.9 Static Drain-Source On-State Resistance vs. Drain Current (ΙΙΙ) 5/7 US6M1 Transistors N-ch Measurement circuit Pulse Width VGS ID RL D.U.T. RG VDD VDS VGS VDS 50% 10% 10% 90% td(on) ton tr 90% 50% 10% 90% td(off) toff tf Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms VG VGS ID RL IG(Const.) D.U.T. RG VDD VDS Qg VGS Qgs Qgd Charge Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform 6/7 US6M1 Transistors P-ch Measurement circuit Pulse Width VGS ID RL D.U.T. RG VDD VDS VGS 10% 50% 10% 90% 50% 10% 90% VDS 90% td(on) ton tr td(off) toff tf Fig.3-1 Switching Time Measurement Circuit Fig.3-2 Switching Waveforms VG VGS ID RL IG(Const.) D.U.T. RG VDD VDS Qg VGS Qgs Qgd Charge Fig.4-1 Gate Charge Measurement Circuit Fig.4-2 Gate Charge Waveform 7/7 Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document use silicon as a basic material. Products listed in this document are no antiradiation design. The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction. Appendix1-Rev1.0