CX-7-SM3

CX-7-SM CRYSTAL 20 MHz to 50 MHz ™ Ultra-Miniature, Low Profile AT -Cut Surface Mount Crystal actual size DESCRIPTION side view STATEK’s ultra-miniature, low profile CX-7-SM AT-cut crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid circuits. These crystals are low profile and have a very small land pattern. Maximum process temperature should not exceed 260OC. PACKAGE DIMENSIONS FEATURES Designed for surface mount applications using infrared, vapor phase, wave solder or epoxy mount techniques Low profile (less than 1.2mm) hermeitcally sealed ceraminc package Excellent aging characteristics Available with glass or ceramic lid High shock and vibration resistance Custom designs available Full military testing available Designed and manufactured in the USA DIM A APPLICATIONS A TOP BOTTOM D B C TYP. INCHES .157 .072 .035 INCHES .045 .046 .048 GLASS LID mm 1.14 1.17 1.22 mm 4.00 1.83 0.89 .162 .085 .045 INCHES .050 .051 .053 MAX. INCHES mm 4.11 2.16 1.14 mm 1.27 1.30 1.35 B C D DIM “C” MAX SM1 SM2 SM3 see below CERAMIC LID Industrial, Computer & Communications General purpose clock oscillator PCMCIA Fax, Modem and LAN Smart card PDA and notebook computers Handheld instrumentation Cellular PCS Military & Aerospace Airborne hybrid computer Military high speed modem MCM SUGGESTED LAND PATTERN GRID COURTYARD .177[4.50] .121[3.07] .092 [2.34] .055[1.40] .067[1.70] 10155 - Rev A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany www.rsg-electronic.de SPECIFICATIONS TERMINATIONS Specifications are typical at 25oC unless otherwise noted. Specifications are subject to change without notice. 49 MHz Motional Resistance R1(k ) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance Co (pF) Calibration Tolerance* 14 2.4 100 0.8 _ _ A + 0.01% ( + 100ppm) _ B + 0.1% _ C + 1.0% 10pF (unless specified by customer) Designation SM1 SM2 SM3 Termination Gold Plated Nickel, Solder Plated Nickel, Solder Plated and Solder Dipped PACKAGING CX-7-SM -Tray Pack (Standard) -16mm tape, 7” or 13” reels (Optional) Per EIA 481 (see data sheet 10109) Load Capacitance Drive Level Frequency-Temperature Stability** 200 W MAX. -10OC to +70OC from -40 C to +85 C from -55OC to +125OC from 5ppm MAX. 5,000g peak 0.3 msec., 1/2 sine 20g rms, 10-2,000 Hz random -10OC to +70OC Commercial -40OC to +85OC Industrial -55OC to +125OC Military -55OC to +125OC R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance O O + _ + _ + _ 10ppm 35ppm 50ppm EQUIVALENT CIRCUIT C0 1 L1 C1 R1 2 Aging, first year Shock, survival*** Vibration, survival Operating Temperature Storage Temperature Max Process Temperature 260OC for 20 sec. CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT Rf Note: The characteristics of the frequency temperature stability follow that of AT-Cut thickness-shear mode. RA BUFFER OSC Freq (fO) Contact factory for design guidelines _ * Tighter tolerances available as low as + 5 ppm ** Does not include calibration tolerance *** Higher shock version available AMPLIFIER CS CG CX-7 CX-1 CD HOW TO ORDER CX-7-SM CRYSTALS CX-7 “S” if special or custom design. C=Ceramic Lid Blank=Glass Lid SM1 SM1 SM2 SM3 49 MHz Frequency ( 50 *Calibration Tolerance @25OC (A) (B) (C) / 50 / 100 / I ) *Frequency Total Frequency Temp. Range: Stability over Tolerance C = Commercial Temp. Range I = Industrial M = Military S = Specify *Other calibration fill in ppm. 10155 - Rev A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de