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CX1HGSM5

CX1HGSM5

  • 厂商:

    RSG

  • 封装:

  • 描述:

    CX1HGSM5 - 8 MHz to 250 MHz High Shock Miniature Surface Mount AT Quartz Crystal - RSG Electronic Co...

  • 详情介绍
  • 数据手册
  • 价格&库存
CX1HGSM5 数据手册
CX1HGSM AT CRYSTAL 8 MHz to 250 MHz High Shock Miniature Surface Mount AT Quartz Crystal ™ Fundamental Mode: 8 MHz - 250 MHz Third Overtone Mode: 48 MHz - 160 MHz DESCRIPTION actual size STATEK’s miniature CX1HGSM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These rugged crystals are designed for applications requiring exceptional shock and vibration survival. FEATURES glass lid XX SXX ceramic lid side view High shock and vibration resistance Designed for surface mount applications using infrared, vapor phase, or epoxy mount techniques Low profile hermetically sealed ceramic package Available with glass or ceramic lid Custom designs available Full military testing available Designed and manufactured in the USA APPLICATIONS PACKAGE DIMENSIONS D A TOP BOTTOM E D B E C Industrial Down-hole Data Recorder Process Control Environmental Control Engine Control Telemetry Ruggedized Instrumentation Automotive Control Military & Aerospace Smart Munitions Timing Devices (Fuzes) Surveillance Devices Missile Telemetry Ruggedized Communications Aviation Equipment SM1 SM2/SM4 SM3/SM5 DIM A B C D E TYPICAL inches 0.315 0.140 0.045 0.060 mm 8.00 3.56 1.14 1.52 MAXIMUM inches 0.330 0.155 0.055 0.070 mm 8.38 3.94 1.40 1.78 see below THICKNESS (DIM C) MAXIMUM GLASS LID inches 0.065 0.067 0.070 mm 1.65 1.70 1.78 CERAMIC LID inches 0.070 0.072 0.075 mm 1.78 1.83 1.90 10108 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90 SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency 10 MHz 32 MHz 155.52 MHz Motional Resistance R1 (Ω) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Calibration Tolerance Load Capacitance2 Drive Level Frequency-Temperature Stability1,3 1 30 5.5 100 2.2 + _ 25 6.2 30 2.3 15 4.0 30 2.3 Designation SM1 SM2 SM3 SM4 SM5 Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) 260OC for 20 sec. 100 ppm, or tighter as required Max Process Temperature 20 pF for f ≤ 50 MHz 10 pF for f > 50 MHz 500 µW MAX for f ≤ 50 MHz 200 µW MAX for f > 50 MHz + _ + _ + _ SUGGESTED LAND PATTERN 0.070 (1.78) 50 ppm to 100 ppm to 100 ppm to + _ + _ + _ 10 ppm (Commercial) 20 ppm (Industrial) 30 ppm (Military) inches (mm) 0.160 (4.06) Aging, first year4 Shock, survival 5 10 ppm MAX 10,000 g, 0.2 ms, 1/2 sine 6 0.270 (6.86) Vibration, survival 50 g, 10-2,000 Hz swept sine -10 C to +70 C (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC. 260OC for 20 sec. O O EQUIVALENT CIRCUIT Operating Temp. Range C0 1 L1 C1 R1 2 Storage Temp. Range Max Process Temperature 1. Other tolerances available. Contact factory. 2. Unless specified otherwise. 3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 5. Up to 100,000 g. Contact factory. 6. Per MIL-STD-202G, Method 204D, Condition E. Random vibration testing also available. R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance PACKAGING OPTIONS • Tray Pack • 16mm tape, 7” or 13” reels Per EIA 481 (see Tape and Reel data sheet 10109) HOW TO ORDER CX1HGSM AT CRYSTALS CX1 “S” if special or custom design. Blank if Std. S HG O.T. = 3RD O.T. Mode Blank = Fundamental Mode C C = Ceramic Lid Blank = Glass Lid SM1 – 32.0M , Frequency M = MHz 100 Calibration Tolerance @ 25OC (in ppm) / 100 / — / I Frequency Stability over Temp. Range (in ppm) SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified OR — — 200 Total Frequency Tolerance (in ppm) I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 10108 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90
CX1HGSM5
1. 物料型号: - 型号为CX1HGSM AT晶体。

2. 器件简介: - STATEK的CX1HGSM AT晶体是设计用于在印刷电路板或混合基板上表面贴装的无引脚陶瓷封装晶体。这些坚固的晶体设计用于需要承受特殊冲击和振动的应用。

3. 引脚分配: - 提供了不同封装类型的引脚终止,包括Gold Plated (Lead Free)、Solder Plated、Solder Dipped等。

4. 参数特性: - 基本频率:10 MHz、32 MHz、155.52 MHz。 - 负载电容:对于f ≤ 50 MHz为20 pF,对于f > 50 MHz为10 pF。 - 驱动电平:500 µW MAX对于f ≤ 50 MHz,200 µW MAX对于f > 50 MHz。 - 频率温度稳定性:商业级为50 ppm,工业级为20 ppm,军用级为10 ppm。 - 老化:第一年最大10 ppm(对于40 MHz以下频率)。 - 冲击和振动:能够承受高达100,000 g的冲击和随机振动测试。

5. 功能详解: - 这些晶体具有高冲击和振动抗性,适用于红外、蒸汽相或环氧树脂贴装技术。 - 提供玻璃或陶瓷盖的低轮廓密封陶瓷封装。 - 可定制设计,并提供全面的军事测试。

6. 应用信息: - 应用于工业、井下数据记录器、过程控制、环境控制、引擎控制、遥测、坚固仪器、汽车控制、军事和航空、智能弹药、计时装置(引信)、监视装置、导弹遥测、坚固通信、航空设备等领域。

7. 封装信息: - 提供了详细的封装尺寸和厚度信息,包括玻璃盖和陶瓷盖的最大厚度。 - 提供了封装的典型最大尺寸,包括长度、宽度和高度。
CX1HGSM5 价格&库存

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