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CX1SHGCSM3

CX1SHGCSM3

  • 厂商:

    RSG

  • 封装:

  • 描述:

    CX1SHGCSM3 - 8 MHz to 250 MHz High Shock Miniature Surface Mount AT Quartz Crystal - RSG Electronic ...

  • 详情介绍
  • 数据手册
  • 价格&库存
CX1SHGCSM3 数据手册
CX1HGSM AT CRYSTAL 8 MHz to 250 MHz High Shock Miniature Surface Mount AT Quartz Crystal ™ Fundamental Mode: 8 MHz - 250 MHz Third Overtone Mode: 48 MHz - 160 MHz DESCRIPTION actual size STATEK’s miniature CX1HGSM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These rugged crystals are designed for applications requiring exceptional shock and vibration survival. FEATURES glass lid XX SXX ceramic lid side view High shock and vibration resistance Designed for surface mount applications using infrared, vapor phase, or epoxy mount techniques Low profile hermetically sealed ceramic package Available with glass or ceramic lid Custom designs available Full military testing available Designed and manufactured in the USA APPLICATIONS PACKAGE DIMENSIONS D A TOP BOTTOM E D B E C Industrial Down-hole Data Recorder Process Control Environmental Control Engine Control Telemetry Ruggedized Instrumentation Automotive Control Military & Aerospace Smart Munitions Timing Devices (Fuzes) Surveillance Devices Missile Telemetry Ruggedized Communications Aviation Equipment SM1 SM2/SM4 SM3/SM5 DIM A B C D E TYPICAL inches 0.315 0.140 0.045 0.060 mm 8.00 3.56 1.14 1.52 MAXIMUM inches 0.330 0.155 0.055 0.070 mm 8.38 3.94 1.40 1.78 see below THICKNESS (DIM C) MAXIMUM GLASS LID inches 0.065 0.067 0.070 mm 1.65 1.70 1.78 CERAMIC LID inches 0.070 0.072 0.075 mm 1.78 1.83 1.90 10108 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90 SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency 10 MHz 32 MHz 155.52 MHz Motional Resistance R1 (Ω) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Calibration Tolerance Load Capacitance2 Drive Level Frequency-Temperature Stability1,3 1 30 5.5 100 2.2 + _ 25 6.2 30 2.3 15 4.0 30 2.3 Designation SM1 SM2 SM3 SM4 SM5 Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) 260OC for 20 sec. 100 ppm, or tighter as required Max Process Temperature 20 pF for f ≤ 50 MHz 10 pF for f > 50 MHz 500 µW MAX for f ≤ 50 MHz 200 µW MAX for f > 50 MHz + _ + _ + _ SUGGESTED LAND PATTERN 0.070 (1.78) 50 ppm to 100 ppm to 100 ppm to + _ + _ + _ 10 ppm (Commercial) 20 ppm (Industrial) 30 ppm (Military) inches (mm) 0.160 (4.06) Aging, first year4 Shock, survival 5 10 ppm MAX 10,000 g, 0.2 ms, 1/2 sine 6 0.270 (6.86) Vibration, survival 50 g, 10-2,000 Hz swept sine -10 C to +70 C (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC. 260OC for 20 sec. O O EQUIVALENT CIRCUIT Operating Temp. Range C0 1 L1 C1 R1 2 Storage Temp. Range Max Process Temperature 1. Other tolerances available. Contact factory. 2. Unless specified otherwise. 3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 5. Up to 100,000 g. Contact factory. 6. Per MIL-STD-202G, Method 204D, Condition E. Random vibration testing also available. R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance PACKAGING OPTIONS • Tray Pack • 16mm tape, 7” or 13” reels Per EIA 481 (see Tape and Reel data sheet 10109) HOW TO ORDER CX1HGSM AT CRYSTALS CX1 “S” if special or custom design. Blank if Std. S HG O.T. = 3RD O.T. Mode Blank = Fundamental Mode C C = Ceramic Lid Blank = Glass Lid SM1 – 32.0M , Frequency M = MHz 100 Calibration Tolerance @ 25OC (in ppm) / 100 / — / I Frequency Stability over Temp. Range (in ppm) SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified OR — — 200 Total Frequency Tolerance (in ppm) I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 10108 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90
CX1SHGCSM3
1. 物料型号: - CX1HGSM AT CRYSTAL,型号覆盖8 MHz到250 MHz,包括基本模式8 MHz - 250 MHz和第三泛音模式48 MHz - 160 MHz。

2. 器件简介: - STATEK的CX1HGSM AT晶体是一种小型的无铅陶瓷封装表面贴装晶体,设计用于印刷电路板或混合基板的表面安装。这些坚固的晶体专为需要承受极高冲击和振动的应用而设计。

3. 引脚分配: - 提供了不同的终止方式,包括Gold Plated (Lead Free)、Solder Plated、Solder Dipped等,具体分配如下: - SM1:Gold Plated (Lead Free) - SM2:Solder Plated - SM3:Solder Dipped - SM4:Solder Plated (Lead Free) - SM5:Solder Dipped (Lead Free)

4. 参数特性: - 包括基本频率、动容抗、静容抗、品质因数、负载电容、驱动水平、频率-温度稳定性、老化、冲击和振动生存等参数。例如,10 MHz至155.52 MHz的频率范围,对应的动容抗和静容抗值,以及最大加工温度260°C持续20秒。

5. 功能详解: - 晶体具有高冲击和振动抵抗能力,设计用于使用红外、蒸汽相或环氧树脂安装技术的表面安装应用。提供玻璃或陶瓷盖的低轮廓密封陶瓷封装,可定制设计,并提供全面的军事测试。

6. 应用信息: - 应用领域包括工业、井下数据记录器、过程控制、环境控制、引擎控制、遥测、坚固仪器、汽车控制、军事和航空、智能弹药、计时装置(引信)、监控装置、导弹遥测、坚固通信、航空设备等。

7. 封装信息: - 提供了详细的封装尺寸图表,包括最大尺寸A、B、D、E的英寸和毫米值,以及不同玻璃或陶瓷盖的厚度(DIM C)最大值。
CX1SHGCSM3 价格&库存

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