CX2HSCSM2

CX2HSM CRYSTAL 16 kHz to 600 kHz ™ Miniature Surface Mount Quartz Crystal for Series Oscillators DESCRIPTION The CX2HSM quartz crystals are leadless devices designed for surface mounting on printed circuit boards or hybrid substrates. These miniature crystals are intended to be used in Series oscillators. They are hermetically sealed in a rugged, miniature ceramic package. The CX2HSM crystal is manufactured using the STATEK-developed photolithographic process, and was designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. Maximum process temperature should not exceed 260OC. FEATURES actual size Glass Lid Shown PACKAGE DIMENSIONS B 1 side view 2 I G 3 F H A Miniature tuning fork design High shock resistance Compatible with hybrid or PC board packaging Low aging Full military testing available Designed and manufactured in the USA SUGGESTED LAND PATTERN C D E TYP. DIM A B C D E GRID COURTYARD MAX. mm 6.60 2.39 0.89 1.50 1.27 2.67 3.94 5.33 inches 0.275 0.108 0.045 0.069 0.060 0.115 0.165 0.220 mm 6.99 2.74 1.14 1.75 1.52 2.92 4.19 5.59 inches 0.260 0.094 0.035 0.059 0.050 0.105 0.155 0.210 0.105 (2.67) see below 0.113 (2.87) 0.060 (1.52) inches (mm) F G H I DIM “C” MAX SM1 SM2 SM3 1 2 0.060 (1.52) GLASS LID inches 0.065 0.067 0.070 mm 1.65 1.70 1.78 CERAMIC LID inches 0.075 0.077 0.080 mm 1.91 1.96 2.03 CONVENTIONAL SERIES OSCILLATOR CIRCUIT Note: Terminal 1 is electrically connected internally to terminal 3 EQUIVALENT CIRCUIT OSCILLATOR CX2H XTAL CX-2H XTAL BUFFER C0 1 L1 C1 R1 2 Contact factory for design guidelines R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance 10137 - Rev B S YS ERT T E M C IFIC T A N IO RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de IS O 90 01 SPECIFICATIONS FIGURE 1 CX2H TYPICAL MOTIONAL RESISTANCE (R1) Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Frequency Range 16 kHz to 600 kHz Standard Calibration Tolerance* (see table below) Motional Resistance (R1) Figure 1 MAX: 16-169.9 kHz, 2x Typ. 170-600 kHz, 2.5x Typ. Motional Capacitance (C1) Quality Factor (Q) Shunt Capacitance (C0) Drive Level Turning Point (T0)** Aging, first year Shock, survival*** Vibration, survival*** Operating Temp. Range Figure 2 Figure 3 MIN is 0.25x Typ. 2.0 pF MAX. 16-24.9 kHz 1.5 µW MAX. 25-600 kHz 3.0 µW MAX. Figure 4 O 2 1000 500 R1(k ) 2 100 50 20 10 16 50 100 200 600 0 0 Frequency (kHz) FIGURE 2 CX2H TYPICAL MOTIONAL CAPACITANCE (C1) 5 C1(fF) Temperature Coefficient (k) -0.035 ppm/ C 5 ppm MAX 2 1.0 0.5 1,500 g peak, 0.3 ms, 1/2 sine 10 g RMS 20-2,000 Hz -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC 260O C for 20 sec. 16 50 100 200 600 Frequency (kHz) FIGURE 3 CX2H TYPICAL QUALITY FACTOR (Q) Storage Temp. Range Max Process Temperature * Tighter frequency calibration available. ** Other turning point available. *** Higher shock and vibration available. 50 (in 1000's) 20 10 5 2 16 50 100 200 600 CX2H Standard Calibration T lerance at 250C o Frequency Range (kHz) 16-74.9 30 ppm (0.003%) + _ + _ 75-169.9 50 ppm (0.005%) + _ + _ 170-249.9 + _ 250-600 + _ 100 ppm (0.01%) 200 ppm (0.02%) 200 ppm (0.02%) 500 ppm (0.05%) Frequency (kHz) FIGURE 4 CX2H TYPICAL TURNING POINT TEMP (T0) . 100 ppm (0.01%) 100 ppm (0.01%) + _ + _ + _ HOW TO ORDER CX2HSM CRYSTALS CX2H S C SM1 32.768K Frequency K = kHz SM1 = Gold Plated SM2 = Solder Plated SM3 = Solder Dipped , 30 /M Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified “S” if special or custom design. Blank if Std. Calibration Tolerance @ 25OC (in ppm) TO( C) 1000 ppm (0.1%) + _ 1000 ppm (0.1%) + _ 2000 ppm (0.2%) + _ 5000 ppm (0.5%) +80 +70 +60 +50 +40 +30 +20 +10 0 -10 -20 O 16 50 100 200 600 Frequency (kHz) Note: Frequency f at temperature T is related to frequency f0 at turning point temperature T0 by: f-f0 = k (T-T )2 0 Blank = Glass Lid C = Ceramic Lid f0 TERMINATIONS PACKAGING OPTIONS Designation SM1 SM2 SM3 Termination Gold Plated Solder Plated Solder Dipped CX2HSM - Tray Pack -16mm tape, 7” or 13” reels (Reference tape and reel data sheet 10109) 10137 - Rev B S YS ERT T E M C IFIC T A N IO RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de IS O 90 01