0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
CX3CSM5

CX3CSM5

  • 厂商:

    RSG

  • 封装:

  • 描述:

    CX3CSM5 - 9.6 MHz to 250 MHz Low Profile Miniature Surface Mount AT Quartz Crystal - RSG Electronic ...

  • 详情介绍
  • 数据手册
  • 价格&库存
CX3CSM5 数据手册
CX3SM AT CRYSTAL 9.6 MHz to 250 MHz Low Profile Miniature Surface Mount AT Quartz Crystal ™ Fundamental Mode: Third Overtone Mode: 9.6 MHz - 70 MHz 48 MHz - 250 MHz DESCRIPTION actual size STATEK’s miniature CX3SM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These crystals are low profile and have a small land pattern. glass lid X XXX S ceramic lid side view FEATURES PACKAGE DIMENSIONS D Designed for surface mount applications using infrared, vapor phase, or epoxy mount techniques. Low profile (less than 1.5 mm available) hermetically sealed ceramic package Excellent aging characteristics Available with glass or ceramic lid High shock and vibration resistance Custom designs available Full military testing available Designed and manufactured in the USA APPLICATIONS B C A TOP BOTTOM E D E Medical Monitoring Equipment Industrial, Computer & Communications Instrumentation Down-hole Data Recorder Engine Control Handheld Inventory Control Telemetry Military & Aerospace Communications Smart Munitions Timing Devices Surveillance Devices SM1 SM2/SM4 SM3/SM5 DIM A B C D E TYPICAL inches 0.263 0.097 0.052 0.030 mm 6.68 2.46 1.32 0.76 MAXIMUM inches 0.270 0.104 0.058 0.035 mm 6.86 2.64 1.47 0.89 see below THICKNESS (DIM C) MAXIMUM GLASS LID inches 0.053 0.055 0.058 mm 1.35 1.40 1.47 CERAMIC LID inches 0.067 0.069 0.072 mm 1.70 1.75 1.83 10120 - Rev D S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90 SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency Motional Resistance R1 (Ω) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Calibration Tolerances1 Load Capacitance Drive Level Frequency-Temperature Stability1,3 2 10 MHz 32 MHz 155.52 MHz 60 2.8 95 1.4 + _ 25 6.2 30 2.3 10 4.0 30 2.3 Designation SM1 SM2 SM3 SM4 SM5 Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) 260OC for 20 sec. Max Process Temperature 100 ppm, or tighter as required SUGGESTED LAND PATTERN 0.070 (1.78) 20 pF for f ≤ 50 MHz 10 pF for f > 50 MHz 500 µW MAX for f ≤ 50 MHz 200 µW MAX for f > 50 MHz + _ + _ + _ _ 50 ppm to + 10 ppm (Commercial) _ 100 ppm to + 20 ppm (Industrial) _ 100 ppm to + 30 ppm (Military) 0.120 (3.05) Aging, first year4 Shock, survival5 Vibration, survival6 Operating Temp. Range 5 ppm MAX (less than 1 ppm available) inches (mm) 0.215 (5.46) 3,000 g, 0.3 ms, 1/2 sine 20 g, 10-2,000 Hz swept sine -10 C to +70 C (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC 260OC for 20 sec. R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance O O EQUIVALENT CIRCUIT C0 1 L1 C1 R1 2 Storage Temp. Range Max Process Temperature 1. Other tolerances available. Contact factory. 2. Unless specified otherwise. 3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 5. Higher shock version available. 6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. PACKAGING OPTIONS • Tray Pack • 16mm tape, 7” or 13” reels Per EIA 481 (see Tape and Reel data sheet 10109) HOW TO ORDER CX3SM AT CRYSTALS CX3 “S” if special or custom design. Blank if Std. S O.T. = 3rd O.T. Mode Blank = Fundamental Mode C C = Ceramic Lid Blank = Glass Lid SM1 – 32.0M Frequency M = MHz , 100 Calibration Tolerance @ 25OC (in ppm) / 100 Frequency Stability over Temp. Range (in ppm) / — / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) OR — / — / 200 Total Frequency Tolerance (in ppm) / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 10120 - Rev D S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90
CX3CSM5
### 物料型号 - 型号:CX3SM AT晶体振荡器

### 器件简介 CX3SM AT晶体振荡器是为表面贴装在印刷电路板或混合基板上而设计的无引线陶瓷封装晶体。这些晶体具有低轮廓和小焊盘图案。

### 引脚分配 - 基本模式:9.6 MHz - 70 MHz - 第三泛音模式:48 MHz - 250 MHz

### 参数特性 - 封装:密封陶瓷封装,可用于红外、蒸汽相或环氧树脂安装技术。 - 老化特性:优异的老化特性。 - 抗冲击和振动:高抗冲击和振动性能。 - 定制设计:可定制设计。 - 军工测试:全面军工测试。

### 功能详解 - 应用领域:医疗监测设备、工业、计算机与通信、仪器、下井数据记录器、引擎控制、手持库存控制、遥测、军事与航空通信、智能弹药、定时设备、监视设备等。 - 尺寸参数:提供了详细的尺寸参数表,包括英寸和毫米单位。

### 应用信息 适用于需要高精度时钟信号的各种应用,特别是在对尺寸和性能有严格要求的场合。

### 封装信息 - 厚度(DIM C)最大值:不同型号的晶体厚度参数,包括玻璃盖和陶瓷盖的厚度。 - 封装选项:提供了托盘包装和胶带包装选项。
CX3CSM5 价格&库存

很抱歉,暂时无法提供与“CX3CSM5”相匹配的价格&库存,您可以联系我们找货

免费人工找货