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CX3SO.T.CSM2

CX3SO.T.CSM2

  • 厂商:

    RSG

  • 封装:

  • 描述:

    CX3SO.T.CSM2 - 9.6 MHz to 250 MHz Low Profile Miniature Surface Mount AT Quartz Crystal - RSG Electr...

  • 详情介绍
  • 数据手册
  • 价格&库存
CX3SO.T.CSM2 数据手册
CX3SM AT CRYSTAL 9.6 MHz to 250 MHz Low Profile Miniature Surface Mount AT Quartz Crystal ™ Fundamental Mode: Third Overtone Mode: 9.6 MHz - 70 MHz 48 MHz - 250 MHz DESCRIPTION actual size STATEK’s miniature CX3SM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These crystals are low profile and have a small land pattern. glass lid X XXX S ceramic lid side view FEATURES PACKAGE DIMENSIONS D Designed for surface mount applications using infrared, vapor phase, or epoxy mount techniques. Low profile (less than 1.5 mm available) hermetically sealed ceramic package Excellent aging characteristics Available with glass or ceramic lid High shock and vibration resistance Custom designs available Full military testing available Designed and manufactured in the USA APPLICATIONS B C A TOP BOTTOM E D E Medical Monitoring Equipment Industrial, Computer & Communications Instrumentation Down-hole Data Recorder Engine Control Handheld Inventory Control Telemetry Military & Aerospace Communications Smart Munitions Timing Devices Surveillance Devices SM1 SM2/SM4 SM3/SM5 DIM A B C D E TYPICAL inches 0.263 0.097 0.052 0.030 mm 6.68 2.46 1.32 0.76 MAXIMUM inches 0.270 0.104 0.058 0.035 mm 6.86 2.64 1.47 0.89 see below THICKNESS (DIM C) MAXIMUM GLASS LID inches 0.053 0.055 0.058 mm 1.35 1.40 1.47 CERAMIC LID inches 0.067 0.069 0.072 mm 1.70 1.75 1.83 10120 - Rev D S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90 SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency Motional Resistance R1 (Ω) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Calibration Tolerances1 Load Capacitance Drive Level Frequency-Temperature Stability1,3 2 10 MHz 32 MHz 155.52 MHz 60 2.8 95 1.4 + _ 25 6.2 30 2.3 10 4.0 30 2.3 Designation SM1 SM2 SM3 SM4 SM5 Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) 260OC for 20 sec. Max Process Temperature 100 ppm, or tighter as required SUGGESTED LAND PATTERN 0.070 (1.78) 20 pF for f ≤ 50 MHz 10 pF for f > 50 MHz 500 µW MAX for f ≤ 50 MHz 200 µW MAX for f > 50 MHz + _ + _ + _ _ 50 ppm to + 10 ppm (Commercial) _ 100 ppm to + 20 ppm (Industrial) _ 100 ppm to + 30 ppm (Military) 0.120 (3.05) Aging, first year4 Shock, survival5 Vibration, survival6 Operating Temp. Range 5 ppm MAX (less than 1 ppm available) inches (mm) 0.215 (5.46) 3,000 g, 0.3 ms, 1/2 sine 20 g, 10-2,000 Hz swept sine -10 C to +70 C (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC 260OC for 20 sec. R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance O O EQUIVALENT CIRCUIT C0 1 L1 C1 R1 2 Storage Temp. Range Max Process Temperature 1. Other tolerances available. Contact factory. 2. Unless specified otherwise. 3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 5. Higher shock version available. 6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. PACKAGING OPTIONS • Tray Pack • 16mm tape, 7” or 13” reels Per EIA 481 (see Tape and Reel data sheet 10109) HOW TO ORDER CX3SM AT CRYSTALS CX3 “S” if special or custom design. Blank if Std. S O.T. = 3rd O.T. Mode Blank = Fundamental Mode C C = Ceramic Lid Blank = Glass Lid SM1 – 32.0M Frequency M = MHz , 100 Calibration Tolerance @ 25OC (in ppm) / 100 Frequency Stability over Temp. Range (in ppm) / — / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) OR — / — / 200 Total Frequency Tolerance (in ppm) / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 10120 - Rev D S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90
CX3SO.T.CSM2
物料型号: - 型号为CX3SM AT晶体。

器件简介: - STATEK的CX3SM AT晶体是为表面贴装在印刷电路板或混合基板上而设计的无引脚陶瓷封装晶体。这些晶体具有低轮廓和小型接地图案。

引脚分配: - 该晶体为表面贴装应用设计,使用红外、蒸汽相或环氧树脂安装技术。

参数特性: - 封装为密封陶瓷封装,具有优异的老化特性,低轮廓(小于1.5mm),高冲击和振动抗性,可定制设计,全军用测试可用,设计和制造于美国。 - 老化特性:商业级10ppm最大,工业级20ppm最大,军用级100ppm最大。 - 冲击:3000g,0.3ms,1/2正弦波。 - 振动:20g,10-2000Hz扫描正弦波。 - 工作温度范围:商业级-10°C至+70°C,工业级-40°C至+85°C,军用级-55°C至+125°C。 - 存储温度范围:军用级-55°C至+125°C。 - 频率-温度稳定性:商业级50ppm至10ppm,工业级100ppm至20ppm,军用级100ppm至30ppm。 - 动容C1:10MHz时2.8ff,32MHz时6.2ff,155.52MHz时4.0ff。 - 并联电容C0:对于f≤50MHz为1.4pF,对于f>50MHz为20pF。 - 动阻R1和品质因数Q(k):文档中未提供具体数值。

功能详解: - 该晶体适用于医疗监测设备、工业计算机通信、仪器、下井数据记录器、引擎控制、手持库存控制、遥测、军事和航空通信、智能弹药、定时装置、监控装置等应用。

应用信息: - 应用领域包括医疗、工业、计算机通信、仪器、军事和航空通信等。

封装信息: - 提供了详细的封装尺寸和厚度信息,包括玻璃盖和陶瓷盖的不同厚度选项。 - 封装选项包括托盘包装和16mm胶带,7英寸或13英寸卷轴,符合EIA 481标准。
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