CX3VSM CRYSTAL
18 kHz to 600 kHz
™
Miniature Surface Mount Quartz Crystal for Pierce Oscillators
DESCRIPTION actual size
The CX3VSM quartz crystals are leadless devices designed for surface mounting on printed circuit boards or hybrid substrates. These miniature crystals are intended to be used in Pierce oscillators. They are hermetically sealed in a rugged, miniature ceramic package. They are manufactured using the STATEKdeveloped photolithographic process, and were designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. Maximum process temperature should not exceed 260O C.
FEATURES
Glass Lid Shown PACKAGE DIMENSIONS D
side view
A
TOP E
BOTTOM
D B C E
Miniature tuning fork design High shock resistance Designed for low power applications Compatible with hybrid or PC board packaging Low aging Full military testing available Ideal for battery operated applications Designed and manufactured in the USA
EQUIVALENT CIRCUIT
TYP. DIM A B C D E DIM “C“” MAX SM1 SM2 SM3 inches 0.263 0.097 0.052 0.030 mm 6.68 2.46 1.32 0.76 inches 0.270 0.104 0.058 0.035
MAX. mm 6.86 2.64 1.47 0.89
see below
GLASS LID inches 0.053 0.055 0.058 mm 1.35 1.40 1.47
CERAMIC LID inches 0.067 0.069 0.072 mm 1.70 1.75 1.83
C0 1 L1 C1 R1 2
CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance SUGGESTED LAND PATTERN
0.070 (1.78)
Rf BUFFER OSC Freq (fO )
AMPLIFIER
0.110 (2.79)
RA
CG
inches (mm) 0.210 (5.33)
CX3 XTAL
CD
10104 - Rev B
S
YS
ERT T E M C IFIC T A
N IO
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
IS O
90
01
SPECIFICATIONS
FIGURE 1 CX3V TYPICAL MOTIONAL RESISTANCE (R1)
Specifications are typical at 250C unless otherwise noted. Specifications are subject to change without notice. Frequency Range 18 kHz to 600 kHz Functional Mode Tuning Fork (Flexure) Standard Calibration Tolerance* (see table below) Motional Resistance (R1) See Figure 1 MAX.: 18-25 kHz, 2x Typ. 25-600 kHz, 2.5x Typ. Motional Capacitance (C1) Figure 2 Quality Factor (Q) Figure 3 MIN is 0.25x Typ. Shunt Capacitance (C0) 1.8 pF MAX Drive Level 18-24.9 kHz 0.5 µW MAX. 25-600 kHz 1.0 µW MAX. Turning Point (T0)** Figure 4 Temperature Coefficient (k) -0.035 ppm/0C2 Aging, first year 5 ppm MAX Shock, survival*** 1,500 g peak, 0.3 ms, 1/2 sine Vibration, survival*** 10 g RMS, 20-2,000 Hz random Operating Temp. Range -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55OC to +125OC Max Process Temperature 260OC for 20 sec.
*Tighter frequency calibration available. ** Other turning point available. *** Higher shock and vibration available.
300 200 100 50
R1(k )
20 10 5 2 18 50 100 200 600
Frequency (kHz)
FIGURE 2 CX3V TYPICAL MOTIONAL CAPACITANCE (C1)
5
C1(fF)
2 1.0 0.5 18 50 100 200 600
Frequency (kHz)
FIGURE 3 CX3V TYPICAL QUALITY FACTOR (Q)
300 200
(in 1000's)
100 50
CX3V Standard Calibration T lerance at 250C o
Frequency Range (kHz) 18-74.9 30 ppm (0.003%)
+ _ + _
20
18
50
100
200
600
75-169.9 50 ppm (0.005%)
+ _ + _
170-249.9
+ _
250-600
+ _
Frequency (kHz)
FIGURE 4 CX3V TYPICAL TURNING POINT TEMP (T0) .
100 ppm (0.01%) 200 ppm (0.02%)
200 ppm (0.02%) 500 ppm (0.05%)
100 ppm (0.01%)
100 ppm (0.01%)
+ _
+ _
Load Capacitance (CL), Used to Calibrate CX3V (other CL available)
O
+ _
1000 ppm (0.1%)
+ _
1000 ppm (0.1%)
+ _
2000 ppm (0.2%)
+ _
5000 ppm (0.5%)
+80 +70 +60 +50 +40 +30 +20 +10 0 -10 -20
TO( C)
18
50
100
200
600
Frequency Load Range Capacitance (kHz) (pF) 18-24.9 25-54.9 55-100.0 10 9 8
Frequency Range (kHz) 100.1-179.9 180-600
Load Capacitance (pF) 5 4
Frequency (kHz)
Note: Frequency f at temperature T is related to frequency f0 at turning point temperature T0 by: f-f0 = k (T-T )2 0
f0
TERMINATIONS
HOW TO ORDER CX3VSM CRYSTALS CX3V S C SM1 32.0K,
Frequency K = kHz SM1 = Gold Plated SM2 = Solder Plated SM3 = Solder Dipped
30
Calibration Tolerance @ 25OC (in ppm)
/
M
Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified
Designation SM1 SM2 SM3
Termination Gold Plated Solder Plated Solder Dipped
“S” if special or custom design. Blank if Std.
PACKAGING OPTIONS
CX3VSM
- Tray Pack - Tape and Reel
(Reference tape and reel data sheet 10109)
10104 - Rev B
S
Blank = Glass Lid C = Ceramic Lid
YS
ERT T E M C IFIC T A
N IO
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
IS O
90
01
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