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CX3VSCSM2

CX3VSCSM2

  • 厂商:

    RSG

  • 封装:

  • 描述:

    CX3VSCSM2 - 18 kHz to 600 kHz Miniature Surface Mount Quartz Crystal for Pierce Oscillators - RSG El...

  • 详情介绍
  • 数据手册
  • 价格&库存
CX3VSCSM2 数据手册
CX3VSM CRYSTAL 18 kHz to 600 kHz ™ Miniature Surface Mount Quartz Crystal for Pierce Oscillators DESCRIPTION actual size The CX3VSM quartz crystals are leadless devices designed for surface mounting on printed circuit boards or hybrid substrates. These miniature crystals are intended to be used in Pierce oscillators. They are hermetically sealed in a rugged, miniature ceramic package. They are manufactured using the STATEKdeveloped photolithographic process, and were designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. Maximum process temperature should not exceed 260O C. FEATURES Glass Lid Shown PACKAGE DIMENSIONS D side view A TOP E BOTTOM D B C E Miniature tuning fork design High shock resistance Designed for low power applications Compatible with hybrid or PC board packaging Low aging Full military testing available Ideal for battery operated applications Designed and manufactured in the USA EQUIVALENT CIRCUIT TYP. DIM A B C D E DIM “C“” MAX SM1 SM2 SM3 inches 0.263 0.097 0.052 0.030 mm 6.68 2.46 1.32 0.76 inches 0.270 0.104 0.058 0.035 MAX. mm 6.86 2.64 1.47 0.89 see below GLASS LID inches 0.053 0.055 0.058 mm 1.35 1.40 1.47 CERAMIC LID inches 0.067 0.069 0.072 mm 1.70 1.75 1.83 C0 1 L1 C1 R1 2 CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance SUGGESTED LAND PATTERN 0.070 (1.78) Rf BUFFER OSC Freq (fO ) AMPLIFIER 0.110 (2.79) RA CG inches (mm) 0.210 (5.33) CX3 XTAL CD 10104 - Rev B S YS ERT T E M C IFIC T A N IO RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de IS O 90 01 SPECIFICATIONS FIGURE 1 CX3V TYPICAL MOTIONAL RESISTANCE (R1) Specifications are typical at 250C unless otherwise noted. Specifications are subject to change without notice. Frequency Range 18 kHz to 600 kHz Functional Mode Tuning Fork (Flexure) Standard Calibration Tolerance* (see table below) Motional Resistance (R1) See Figure 1 MAX.: 18-25 kHz, 2x Typ. 25-600 kHz, 2.5x Typ. Motional Capacitance (C1) Figure 2 Quality Factor (Q) Figure 3 MIN is 0.25x Typ. Shunt Capacitance (C0) 1.8 pF MAX Drive Level 18-24.9 kHz 0.5 µW MAX. 25-600 kHz 1.0 µW MAX. Turning Point (T0)** Figure 4 Temperature Coefficient (k) -0.035 ppm/0C2 Aging, first year 5 ppm MAX Shock, survival*** 1,500 g peak, 0.3 ms, 1/2 sine Vibration, survival*** 10 g RMS, 20-2,000 Hz random Operating Temp. Range -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55OC to +125OC Max Process Temperature 260OC for 20 sec. *Tighter frequency calibration available. ** Other turning point available. *** Higher shock and vibration available. 300 200 100 50 R1(k ) 20 10 5 2 18 50 100 200 600 Frequency (kHz) FIGURE 2 CX3V TYPICAL MOTIONAL CAPACITANCE (C1) 5 C1(fF) 2 1.0 0.5 18 50 100 200 600 Frequency (kHz) FIGURE 3 CX3V TYPICAL QUALITY FACTOR (Q) 300 200 (in 1000's) 100 50 CX3V Standard Calibration T lerance at 250C o Frequency Range (kHz) 18-74.9 30 ppm (0.003%) + _ + _ 20 18 50 100 200 600 75-169.9 50 ppm (0.005%) + _ + _ 170-249.9 + _ 250-600 + _ Frequency (kHz) FIGURE 4 CX3V TYPICAL TURNING POINT TEMP (T0) . 100 ppm (0.01%) 200 ppm (0.02%) 200 ppm (0.02%) 500 ppm (0.05%) 100 ppm (0.01%) 100 ppm (0.01%) + _ + _ Load Capacitance (CL), Used to Calibrate CX3V (other CL available) O + _ 1000 ppm (0.1%) + _ 1000 ppm (0.1%) + _ 2000 ppm (0.2%) + _ 5000 ppm (0.5%) +80 +70 +60 +50 +40 +30 +20 +10 0 -10 -20 TO( C) 18 50 100 200 600 Frequency Load Range Capacitance (kHz) (pF) 18-24.9 25-54.9 55-100.0 10 9 8 Frequency Range (kHz) 100.1-179.9 180-600 Load Capacitance (pF) 5 4 Frequency (kHz) Note: Frequency f at temperature T is related to frequency f0 at turning point temperature T0 by: f-f0 = k (T-T )2 0 f0 TERMINATIONS HOW TO ORDER CX3VSM CRYSTALS CX3V S C SM1 32.0K, Frequency K = kHz SM1 = Gold Plated SM2 = Solder Plated SM3 = Solder Dipped 30 Calibration Tolerance @ 25OC (in ppm) / M Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified Designation SM1 SM2 SM3 Termination Gold Plated Solder Plated Solder Dipped “S” if special or custom design. Blank if Std. PACKAGING OPTIONS CX3VSM - Tray Pack - Tape and Reel (Reference tape and reel data sheet 10109) 10104 - Rev B S Blank = Glass Lid C = Ceramic Lid YS ERT T E M C IFIC T A N IO RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de IS O 90 01
CX3VSCSM2
物料型号: - 型号为CX3VSM,是一种微型表面贴装石英晶体。

器件简介: - CX3VSM晶体振荡器是无引脚器件,设计用于在印刷电路板或混合基板上进行表面贴装。这些微型晶体用于皮尔斯振荡器中,并且被密封在一个坚固的微型陶瓷封装中。它们使用STATEK开发的光刻工艺制造,并且基于生产数百万晶体的经验设计,这些晶体用于工业、商业、军事和医疗应用。最大工艺温度不应超过260°C。

引脚分配: - 该晶体振荡器为无引脚设计,采用表面贴装技术。

参数特性: - 频率范围:18 kHz至600 kHz。 - 功能模式:调谐叉(弯曲)模式。 - 标准校准容差:根据不同频率范围,容差从±30ppm至±5000ppm不等。 - 动态电阻(R1)、动态电容(C1)和品质因数(Q):具体数值未给出,但提供了图表参考。 - 并联电容(Co):最大1.8 pF。 - 驱动电平:18-24.9 kHz时最大0.5 W,25-600 kHz时最大1.0 W。 - 温度系数(k):-0.035 ppm/°C。 - 老化,第一年:最大5 ppm。 - 冲击,生存:1,500 g峰值,0.3 ms,1/2正弦波。 - 振动,生存:10 g RMS,20-2,000 Hz随机。 - 工作温度范围:-10°C至+70°C(商业),-40°C至+85°C(工业)。 - 存储温度范围:-55°C至+125°C。 - 最大工艺温度:260°C持续20秒。

功能详解: - 微型调谐叉设计,高抗震性,适用于低功耗应用,兼容混合或PCB封装,低老化,全军用测试可用,适合电池操作应用,在美国设计和制造。

应用信息: - 适用于需要小型化、高抗震和精确频率控制的应用,如电池供电设备。

封装信息: - 提供了详细的封装尺寸图表,包括英寸和毫米单位的典型值和最大值。 - 封装类型包括玻璃盖和陶瓷盖,不同类型有不同的最大厚度值。 - 提供了不同频率负载范围下的负载电容值,用于校准CX3VSM晶体。
CX3VSCSM2 价格&库存

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