CX4SSM4

CX4SM AT CRYSTAL 14 MHz to 250 MHz ™ Ultra-Miniature, Low Profile Surface Mount AT Quartz Crystal DESCRIPTION STATEK’s ultra-miniature CX4SM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These crystals are low profile and have a very small land pattern. FEATURES actual size glass lid XX SXX ceramic lid side view PACKAGE DIMENSIONS Designed for surface mount applications using infrared, vapor phase, wave solder or epoxy mount techniques. Low profile (less than 1.2 mm) hermetically sealed ceramic package Excellent aging characteristics Available with glass or ceramic lid High shock and vibration resistance Custom designs available Full military testing available Designed and manufactured in the USA APPLICATIONS D A TOP F BOTTOM B TYPICAL DIM A B C D E F inches 0.197 0.072 0.036 0.020 0.025 C mm 5.00 1.83 0.91 0.51 0.64 D E MAXIMUM inches 0.210 0.085 mm 5.33 2.16 Medical Neurostimulators Cochlear Implants Implantable CRM Infusion Pumps Glucose Monitors Industrial, Computer & Communications Instrumentation Process Control Environmental Control Engine Control Handheld Inventory Control Down-hole Data Recorder Telemetry Military & Aerospace Communications Radio Smart Munitions Timing Devices (Fuzes) Surveillance Devices see below 0.046 1.16 - THICKNESS (DIM C) MAXIMUM GLASS LID inches SM1 SM2/SM4 SM3/SM5 0.045 0.046 0.048 mm 1.14 1.17 1.22 CERAMIC LID inches 0.050 0.051 0.053 mm 1.27 1.30 1.35 10150 - Rev. D S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90 SPECIFICATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency 14.7456 MHz 16MHz 20 MHz 32 MHz 40 MHz 80 MHz 160 MHz 200 MHz Motional Resistance R1 (Ω) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Calibration Tolerances1 Load Capacitance Drive Level Frequency-Temperature Stability1,3 + _ 60 1.4 120 0.8 75 1.5 90 0.9 50 1.4 110 0.9 30 2.5 70 1.1 30 1.5 90 1.0 30 1.8 40 1.0 30 2.5 20 1.5 40 2.0 15 1.5 100 ppm, or tighter as required 10 pF (unless specified otherwise) 200 µW MAX for f ≤ 50 MHz TERMINATIONS Designation SM1 100 µW MAX for f > 50 MHz SM2 + _ 50 ppm to + 10 ppm (Commercial) SM3 _ + _ 100 ppm to + 20 ppm (Industrial) _ SM4 + SM5 _ 100 ppm to + 30 ppm (Military) _ 5 ppm MAX (better than 1 ppm available) Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) 260OC for 20 sec. Aging, first year3 Shock, survival 4 Max Process Temperature 5,000 g, 0.3 ms, 1/2 sine 20 g, 10-2,000 Hz swept sine -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC 260OC for 20 sec. EQUIVALENT CIRCUIT Vibration, survival5 Operating Temp. Range C0 1 L1 C1 R1 2 Storage Temp. Range Max Process Temperature 1) Other tolerances available. Contact factory. 2) Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 3) 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 4) Higher shock version available. 5) Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance SUGGESTED LAND PATTERN 0.059 (1.5) PACKAGING OPTIONS 0.092 (2.3) • Tray Pack • Tape and Reel Per EIA 481 (see Tape and Reel data sheet 10109) inches (mm) 0.160 (4.0) HOW TO ORDER CX4SM AT CRYSTALS CX4 S C C = Ceramic Lid Blank = Glass Lid SM1 – 32.0M Frequency M = MHz , 100 Calibration Tolerance @25OC (in ppm) / 100 Frequency Stability over Temp. Range / — / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 200 Total Frequency Tolerance (in ppm) / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 10150 - Rev. D S “S” if special or custom design. Blank if standard SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) OR — / — / YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90