CX9SSM2

CX9SM AT CRYSTAL 14 MHz to 250 MHz ™ Low Profile, Ultra-Miniature Surface Mount AT Quartz Crystal DESCRIPTION Designed and manufactured in the USA, Statek’s CX9SM AT quartz crystal is the newest device available in frequencies ranging from 14 MHz to 250 MHz. This device has been specifically designed for applications requiring a very small foot print and low profile. It is 4.1 mm x 1.5 mm with a height under 1 mm. Using micro-machining processes, this surface-mountable crystal is hermetically sealed within an ultra-miniature ceramic package to ensure high stability and low aging. Tight calibration and excellent frequency/temperature stability make the CX9SM ideally suited for many high frequency applications. FEATURES actual size glass lid ceramic lid PACKAGE DIMENSIONS side view A TOP BOTTOM Low profile (less than 1 mm) Ultra-miniature, surface mount design Available with glass or ceramic lid Hermetically sealed ceramic package High shock and vibration survival Excellent aging characteristics Designed for low power applications Full military testing available Designed and manufactured in the USA APPLICATIONS D B C TYPICAL DIM A B C D inches 0.160 0.060 0.031 mm 4.10 1.50 0.79 MAXIMUM inches 0.170 0.068 0.038 mm 4.32 1.73 0.97 see below Medical Neurostimulators Medical Telemetry Chronic Pain Management Cochlear Implants Infusion Pumps Military & Aerospace Avionic Indicators and Instrumnts Cockpit Instrumentation Displays Data Communications Survival radio Industrial, Computer & Communications Communications Transmitters Pulse Generators Tracking Beacons Wildlife Telemetry THICKNESS (DIM C) MAXIMUM GLASS LID MAX SM1 SM2/SM4 SM3/SM5 inches 0.034 0.034 0.036 mm 0.87 0.87 0.91 CERAMIC LID inches 0.035 0.035 0.037 mm 0.90 0.90 0.94 10158 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90 SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency Motional Resistance R1(Ω) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Calibration Tolerance1 Load Capacitance Drive Level + _ 25 MHz 30 1.8 120 1.0 10 pF 49 MHz 155.52 MHz 30 25 2.1 60 1.0 2.5 16 1.4 Designation SM1 SM2 SM3 SM4 SM5 Termination Gold Plated Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) Max Process Temperature 260OC for 20 sec. SUGGESTED LAND PATTERN 100 ppm, or tighter as required (unless specified otherwise) 200 µW MAX for f ≤ 50 MHz 100 µW MAX for f > 50 MHz 0.048 (1.22) Frequency-Temperature Stability1,3 + _ + _ + _ _ 50 ppm to + 10 ppm (Commercial) _ 100 ppm to + 20 ppm (Industrial) 100 ppm to 30 ppm (Military) (better than 1 ppm available) + _ 0.080 (2.03) Aging, first year Shock, survival 3 5 ppm MAX 5,000 g, 0.3 ms, 1/2 sine 20 g, 10-2,000 Hz swept sine -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC inches (mm) 0.132 (3.35) Vibration, survival4 Operating Temp. Range Storage Temp. Range EQUIVALENT CIRCUIT Max Process Temperature 260OC for 20 sec. 1. Other tolerances available. Contact factory. 2. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 3. 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 4. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. C0 1 L1 C1 R1 2 R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance PACKAGING OPTIONS • Tray Pack • 16mm tape, 7” or 13” reels Per EIA 481 (see Tape and Reel data sheet 10109) HOW TO ORDER CX9SM AT CRYSTALS CX9 “S” if special or custom design. Blank if Std. S C C = Ceramic Lid Blank = Glass Lid SM1 – 49.0M Frequency M = MHz , 100 Calibration Tolerance @ 250C (in ppm) / 100 / — / I Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 200 Total Frequency Tolerance (in ppm) / I SM1 = Gold Plated SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated Lead Free SM5 = Solder Dipped Lead Free Frequency Stability over Temp.Range (in ppm) OR — / — / Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 10158 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90