CX9VSM1

CX9VSM CRYSTAL 32 kHz to 160 kHz ™ Ultra-Miniature, Low Profile Surface Mount Quartz Crystal DESCRIPTION Designed and manufactured in the USA, the CX9V quartz crystal is available in frequencies from 32 kHz to 160 kHz. Using micro-machining processes, this surface-mountable crystal is hermetically sealed within a ultra-miniature ceramic package to ensure high stability and low aging. Tight calibration and high frequency/temperature stability make the CX9V ideally suited for all low frequency applications. FEATURES actual size side view Glass Lid Shown PACKAGE DIMENSIONS Ultra-miniature, surface mount design (4.1mm x 1.5mm) Low profile (typically 0.80mm) Available with glass or ceramic lid Hermetically sealed ceramic package High shock and vibration survival Excellent aging characteristics Designed for low power applications Full military testing available Designed and manufactured in the USA APPLICATIONS A TOP BOTTOM D B C TYP. DIM A B C D DIM “C” MAX SM1 SM2 SM3 inches 0.160 0.060 0.031 inches 0.035 0.036 0.037 GLASS LID mm 0.89 0.91 0.94 mm 4.10 1.50 0.79 inches 0.170 0.068 0.038 inches 0.038 0.039 0.040 MAX. mm 4.32 1.73 0.97 mm 0.97 0.99 1.02 Medical Pacemaker, defibrillator, and other implantables Medical instruments Industrial, Computer, & Communications Smart card Down hole instrumentation Transponder / Animal migration Process instrumentation Military & Aerospace Airborne hybrid Navigational computer Real time clock EQUIVALENT CIRCUIT see below CERAMIC LID SUGGESTED LAND PATTERN GRID COURTYARD 0.180[4.70] 0.132[3.40] INCHES[mm] C0 0.080 [2.10] 1 L1 C1 R1 2 0.048[1.30] 0.084[2.10] 10157 - Rev A S R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance YS ERT T E M C IFIC T A N IO RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de IS O 90 01 SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. 32.768 kHz 100 kHz Motional Resistance R1(kΩ) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Load Capacitance (pF)* Turning Point (oC)** 70 2.2 27 1.1 9 20 19 1.0 80 0.84 5 16 Designation SM1 SM2 SM3 Termination Gold Plated Nickel, Solder Plated Nickel, Solder Dipped PACKAGING OPTIONS CX9VSM -Tray Pack -16mm tape, 7” or 13” reels Per EIA 481 (see data sheet 10109) Standard Calibration Tolerance*** + _ 30 ppm, + 100 ppm, + 1000 ppm _ _ Glass Lid: + _ 100 ppm, + 1000 ppm, + 10000 ppm _ _ Ceramic Lid: Drive Level Aging, first year Shock, survival Vibration, survival Operating Temp. Range 0.5 µW MAX 5 ppm 5,000 G peak, 0.3 ms, 1/2 sine 20 G RMS, 10-2,000 Hz random -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC 260OC for 20 sec. CG Temperature Coefficient (k) -0.035 ppm/OC2 CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT Rf BUFFER OSC Freq (fO ) AMPLIFIER RA Storage Temp. Range Max Process Temperature Note: Deviation in frequency (f) @ temperature (T) from frequency (fO) @ turning point temperature (TO); f-fO = k (T-T )2 o fO * Other load capacitance values available ** Other temperatures available *** Tighter tolerances available CX9 CD HOW TO ORDER CX9VSM CRYSTALS CX9V S C C = Ceramic Lid Blank = Glass Lid SM1 100.0K, Frequency K = kHz 100 Calibration Tolerance @ 25OC (in ppm) / M Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified “S” if special or custom design. Blank if Std. SM1 = Gold Plated SM2 = Nickel, Solder Plated SM3 = Nickel, Solder Dipped 10157 - Rev A S YS ERT T E M C IFIC T A N IO RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de IS O 90 01