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16ST155MA23216

16ST155MA23216

  • 厂商:

    RUBYCON(红宝石)

  • 封装:

    1206(3216公制)

  • 描述:

    薄膜电容 1206 1.5µF ±20% 3.20 x 1.60mm

  • 数据手册
  • 价格&库存
16ST155MA23216 数据手册
To PMLCAP Polymer Multi Layer Capacitor Specification Sheet Rubycon PART No. PMLCAP Drawing No. RPR-0024 Issued Date ST series October 15, 2008 RUBYCON CORPORATION PML DIVISION 2932, MOTOOSHIMA, MATSUKAWA-MACHI, SHIMOINA-GUN, NAGANO-KEN, JAPAN PHONE +81-265-36-6250 FAX. . +81-265-36-6015 Designed by Approved by SHIGEYA TOMIMOTO KAZUYUKI IIZAWA 1/12 1. Scope . This specification covers polymer multi layer capacitor for use in electronic equipments. 2. Reference Standard JIS C 5101-1-1998 3. Type and numbering system (1) Type PMLCAP ST SERIES (2) Numbering system □□□ □□ Rated Voltage Series 16 to 63 ST (16V→16) 4. 5. □□□ M Nominal Capacitance 224 to 226 Capacitance tolerance (M: ±20%) □□□ □□ □□□ Option TP code Chip size Refer to 11-1 3216 to 5750 (1.0µF→105) Example 16 ST 105 M A2 3216 Rating (1) Category temperature range (Operating temperature range) (2) Rated voltage (3) Nominal capacitance range (4) Capacitance tolerance -55°C to +125°C Including temperature-rise on element surface (10°C) DC16V(16), 25V(25), 35V(35), 50V(50), 63V(63) () means Rated Voltage Code 0.22 to 22μF(224 to 226)E6 series () means Nominal Capacitance Code ±20%(M) () means Capacitance Tolerance Code Soldering Method on PC board Reflow method only 6. Structure This capacitor has stacked dielectric thin film and inner electrode with simple mold – less structure. Brass (Metal Spray) Stacked Element Conductive Paste (Dielectric Thin Film + Deposited Al) Tin (Plating) Outer Electrode Stacked Element Fig-1 PMLCAP Construction PMLCAP SERIES RUBYCON CORPORATION 2/12 7. Dimensions Refer to table-4 8. Performance The test shall be conducted at standard atmospheric conditions (Temperature 15deg C to 35deg C, Relative Humidity 45 to 75%). However the test shall be conducted at a temperature of 20±2deg C, a relative humidity of 60 to 70%, if a doubt occurred for a judgment. Table-1 Performance Items Conditions Specifications Apply a 150% of rated voltage for 1minute or 175% of rated voltage for 1 second to 5 seconds. 1 Voltage proof Between terminals Nothing abnormal shall be found, when applied a specific voltage. Measurement frequency : 1kHz±20% Measurement voltage : 5Vrms or less 2 3 4 Capacitance Within a range of specified value. Dissipation factor (Tangent of the loss angle: tanδ) Insulation resistance Measurement frequency : 1kHz±20% Measurement voltage : 5Vrms or less Measuring Circuit : Series Circuit When the reading of measuring instrument becomes steady at a value after applying the rated voltage for 1minute ± 5 seconds. Pressure:5N 1.5% or less Between terminals 300MΩ・µF or more (0.51kg・f) Holding time:10±1 Seconds Solder the capacitor to the test jig (glass epoxy boards) as shown in below. Then apply 5N force to the longitudinal direction of specimen for 10±1sec. (JIS C 5101-1 4.34) 5N 5 Test Jig Adhesive strength of termination No coming off the terminations or other defect should occur. Capacitor Items PMLCAP SERIES Conditions RUBYCON CORPORATION Specifications 3/12 Solder the capacitor to the test jig (glass epoxy boards, t=1.6mm). Then apply a force in the direction shown in below until the flexure becomes 1mm and maintain for 5±1sec. (JIS C 5101-1 4.35) Pressurizing speed; 1.0mm/sec 6 The following vibration shall be applied to the sample (mounted on the PC board) 8 9 No coming off the terminations or other defect should occur. Capacitance Within ±2% of the value before the test Appearance No defect or abnormality Connection Stable, no short and no open Outer Electrodes A new uniform coating of solder covers 90% or more of terminal surface. Appearance No remarkable change Voltage proof No defect or abnormality Capacitance Within +20/-5% of the value before the test Insulation resistance 30MΩ・µF or more Bending test Flexure: ≦ 1mm 7 Appearance Vibration proof Range of vibration frequency is from 10Hz to 55Hz and total amplitude is 1.5mm, vibration frequency changes from 10Hz to 55Hz and then turns into 10Hz again. This cycle is 1minute. This cycle shall be conducted for 2hours each (total 6hours) in 3 mutually perpendicular directions. Dip the capacitor in a flux wholly, and then dip it in the solder bath at a temperature of 235±5°C for 2±0.5seconds. Solderability Humidity proof (Steady state) The capacitor shall be mounted on the PC board. Then the capacitor under test shall be left at 40deg C and the relative humidity at 90 to 95% for 500+24/-0 hours. Remove and set for 1 to 2 hours at standard atmospheric conditions, then measure. Apply 130% of rated voltage for 1minute, when measured voltage proof. Dissipation factor: tanδ Items PMLCAP SERIES Conditions RUBYCON CORPORATION 2.25% or less (at 1kHz) Specifications 4/12 10 11 The capacitor shall be mounted on the PC board. Then the capacitor under test shall be applied the rated voltage continuously at 40±2deg C and the relative humidity at 90 to 95% for 500+24/-0 hours. Remove and set for 1 to 2 hours at standard atmospheric conditions, then measure. Apply 130% of rated voltage for 1minute, when measured voltage proof. Humidity load (Damp heat) High temperature load (Endurance) The capacitor shall be mounted on the PC board. Then the capacitor under test shall be applied 125% of rated voltage continuously at 125±3deg C for 1000+48/-0 hours through a seriesconnected resister of from 200Ω to 1000Ω per 1V Remove and set for 1 to 2 hours at standard atmospheric conditions, then measure. The capacitor shall be mounted on the PC board using reflow soldering method as shown in Fig-2. (Reflow soldering cycle shall be two) 12 Resistance to Soldering Heat After the test, set for 1 to 2 hours at standard atmospheric conditions, then measure. Appearance No remarkable change Voltage proof No defect or abnormality Capacitance Within +20/-5% of the value before the test Insulation resistance 30MΩ・µF or more Dissipation factor: tanδ 2.25% or less (at 1kHz) Appearance No remarkable change Capacitance Within +5/-20% of the value before the test Insulation resistance 100MΩ・µF or more Dissipation factor: tanδ 1.65% or less (at 1kHz) Appearance No remarkable defect or abnormality Connection No remarkable defect or abnormality Voltage proof No defect or abnormality Capacitance Within +5/-10% of the value before the test Insulation resistance 100MΩ・µF or more Applying 130% of rated voltage for 1minute, when measured the voltage proof. Dissipation factor: tanδ 1.65% or less (at 1kHz) Items PMLCAP SERIES Conditions RUBYCON CORPORATION Specifications 5/12 13 Temperature Cycle The capacitor shall be mounted on the PC board Then the capacitor under test shall be put at -55±3deg C for 30±3minutes. After this, the capacitor under test shall be put at +125±3deg C for 30±3minutes. This operation shall be counted as 1 cycle, and it shall be repeated for 5 cycles successively. Voltage is not applied to the capacitors through the test. PMLCAP SERIES Appearance No remarkable change Capacitance Within +5/-20% of the value before the test Insulation resistance 30MΩ ・μF or more Dissipation factor: tanδ 1.65% or less (at 1kHz) RUBYCON CORPORATION 6/12 9. Notes on use of PMLCAP 9-1. Soldering (1)Soldering Method This capacitor shall be used in only reflow method. Don’t use in flow, dipping, and VPS soldering method. When the double-stick tape is used by tentative mounting, this product can not be used again (2)Recommended reflow soldering conditions Please confirm your reflow conditions (reflow time and temperature). Fig.2 shows recommended reflow temperature profile Peak Temperature Tem perature at surface of capacitor (deg C ) 250 t3 200 t2 150 Preheat t1 100 50 Time (seconds) Fig-2 Recommended reflow temperature profile 1. Peak temperature at the surface of capacitor shall not exceed the temperature value as shown in table-2 2. Duration times, t2 and t3 shall not exceed the values shown in table-2 3. Holding time at the peak temperature shall be as short as possible. 4. The capacitors shall be preheated at temperature between 150 and 180 deg C, and the preheat time (t1) shall not exceed the value shown in table-2. 5. Maximum reflow soldering cycle shall be two(2) . The second soldering should be carried out after the capacitor itself has returned to normal temperature. Table-2 Reflow temperature profile Preheat Temperature (T) Peak temperature (t1) Period of preheat 150°C to 180°C 260°C 180 Sec. (t2) Period over 200 °C 90Sec. (t3) Period over 240°C 40Sec. (3) Soldering conditions when using soldering iron Reflow soldering is recommended, however use the following conditions when using soldering iron for testing or reworking after reflow soldering. Conditions when using soldering iron PMLCAP SERIES RUBYCON CORPORATION 7/12 Temperature of soldering iron Time for soldering Power of soldering iron Other Conditions 350°C 4.0 seconds Max 30W Max. No preheat Note z Soldering under above condition shall not be repeated for a same part. z Reworking with soldering iron after reflow soldering shall be performed with above conditions. It shall not be repeated for a same part z The tip of soldering iron must not touch with capacitors directly. z Please contact us in advance when require further conditions except for above. (4) Recommended land size For designing land size, refer to the following recommended land size. (Table-3) Please contact us if your land design is remarkably different than Table-3 Table-3 Recommended land size Chip size Dimensions A B C 3216 1.8 3.6 1.4 3225 1.8 3.6 2.3 4532 2.7 5.7 3.0 5750 3.5 7.8 4.5 (5) Solder paste A recommended solder paste thickness is between 0.1 mm to 0.2mm. The content of halogen in the soldering flux should be 0.1wt% or less. (6) Cleaning Please contact us in advance when cleaning the PC board after mounting. If used not proper cleaning agent, the capacitor may be damaged. 475 9-2. Storage 685 106 30 Dry capacitors at 125 deg C for over 5 hours and then reflow-solder if the capacitors absorb the moisture. 25 20 ∆C/C(%) at 1kHz Due to absorbing or discharging of moisture, the capacitance changes depending on storing conditions.(Fig-3) The aluminum moisture-proof bag (dry pack) with silica-gel is used in shipping, however the soldering performance may deteriorate due to moisture absorbed which percentage is depended on storing condition after opening the pack. 15 10 5 0 **Fig-3 shows capacitance change at moisture condition. - Moisture absorbing condition: Temperature 40°C Humidity 95%RH Time 500hours - Drying condition : PMLCAP SERIES Temperature 125°C Time 5hours -5 -10 Initial After moisture absorbing After drying Fig-3 Capacitance change at moisture absorbing condition RUBYCON CORPORATION 8/12 10. Diagram of dimensions Refer to Table-4 W H L Fig-4 Dimensions of PMLCAP Table-4 Dimensions in mm(Tolerance;±0.3×W±0.3×H±0.2) WV(V) Cap(µF) 16 25 50 63 0.22 3216 (1.0) 3216 (1.4) 0.33 3216 (1.4) 3225 (1.4) 3216 (1.0) 3225 (1.4) 3225 (1.8) 3216 (1.4) 3216 (1.4) 3225 (2.0) 4532 (1.4) 0.47 0.68 1.0 3216 (1.4) 3216 (1.4) 3225 (1.4) 4532 (1.4) 4532 (1.8) 1.5 3216 (1.4) 3225 (2.0) 3225 (2.0) 4532 (1.8) 4532 (2.6) 2.2 3225 (1.8) 3225 (1.8) 4532 (1.4) 4532 (2.6) 5750 (1.8) 3.3 3225 (2.0) 4532 (1.4) 4532 (1.8) 5750 (1.8) 5750 (2.6) 4.7 4532 (1.4) 4532 (1.8) 4532 (2.6) 5750 (2.6) 6.8 4532 (1.8) 4532 (2.6) 5750 (1.8) 10 4532 (2.6) 5750 (1.8) 5750 (2.6) 15 5750 (1.8) 5750 (2.6) 22 5750 (2.6) Example PMLCAP 35 SERIES ; 3216 (1.0) → L:3.2×W:1.6×H:1.0 RUBYCON CORPORATION 9/12 16V Type 16 ST 105 M A2 3216 16 ST 155 M A2 3216 16 ST 225 M B2 3225 16 ST 335 M B3 3225 16 ST 475 M C1 4532 16 ST 685 M C2 4532 16 ST 106 M C4 4532 16 ST 156 M D1 5750 16 ST 226 M D3 5750 Rating WV (DC) 16 16 16 16 16 16 16 16 16 µF 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 L 3.2 3.2 3.2 3.2 4.5 4.5 4.5 5.7 5.7 Size(mm) W 1.6 1.6 2.5 2.5 3.2 3.2 3.2 5.0 5.0 H 1.4 1.4 1.8 2.0 1.4 1.8 2.6 1.8 2.6 Taping code A2 A2 B2 B3 C1 C2 C4 D1 D3 Rating WV (DC) 25 25 25 25 25 25 25 25 25 µF 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10 15 L 3.2 3.2 3.2 3.2 4.5 4.5 4.5 5.7 5.7 Size(mm) W 1.6 1.6 2.5 2.5 3.2 3.2 3.2 5.0 5.0 H 1.4 1.4 2.0 1.8 1.4 1.8 2.6 1.8 2.6 Taping code A2 A2 B3 B2 C1 C2 C4 D1 D3 Rating WV (DC) 35 35 35 35 35 35 35 35 35 µF 0.47 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10 L 3.2 3.2 3.2 3.2 4.5 4.5 4.5 5.7 5.7 Size(mm) W 1.6 1.6 2.5 2.5 3.2 3.2 3.2 5.0 5.0 H 1.0 1.4 1.4 2.0 1.4 1.8 2.6 1.8 2.6 Taping code A1 A2 B1 B3 C1 C2 C4 D1 D3 25V Type 25 ST 684 M A2 3216 25 ST 105 M A2 3216 25 ST 155 M B3 3225 25 ST 225 M B2 3225 25 ST 335 M C1 4532 25 ST 475 M C2 4532 25 ST 685 M C4 4532 25 ST 106 M D1 5750 25 ST 156 M D3 5750 35V Type 35 ST 474 M A1 3216 35 ST 684 M A2 3216 35 ST 105 M B1 3225 35 ST 155 M B3 3225 35 ST 225 M C1 4532 35 ST 335 M C2 4532 35 ST 475 M C4 4532 35 ST 685 M D1 5750 35 ST 106 M D3 5750 50V Type 50 ST 224 M A1 3216 50 ST 334 M A2 3216 50 ST 474 M B1 3225 50 ST 684 M B3 3225 50 ST 105 M C1 4532 50 ST 155 M C2 4532 50 ST 225 M C4 4532 50 ST 335 M D1 5750 50 ST 475 M D3 5750 PMLCAP SERIES Rating WV (DC) 50 50 50 50 50 50 50 50 50 Taping code Size(mm) µF 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 4.7 L 3.2 3.2 3.2 3.2 4.5 4.5 4.5 5.7 5.7 W 1.6 1.6 2.5 2.5 3.2 3.2 3.2 5.0 5.0 RUBYCON CORPORATION H 1.0 1.4 1.4 2.0 1.4 1.8 2.6 1.8 2.6 A1 A2 B1 B3 C1 C2 C4 D1 D3 10/12 63V Rating WV (DC) 63 63 63 63 63 63 63 63 Type 63 ST 224 M A2 3216 63 ST 334 M B1 3225 63 ST 474 M B2 3225 63 ST 684 M C1 4532 63 ST 105 M C2 4532 63 ST 155 M C4 4532 63 ST 225 M D1 5750 63 ST 335 M D3 5750 µF 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 L 3.2 3.2 3.2 4.5 4.5 4.5 5.7 5.7 Size(mm) W 1.6 2.5 2.5 3.2 3.2 3.2 5.0 5.0 H 1.4 1.4 1.8 1.4 1.8 2.6 1.8 2.6 Taping code A2 B1 B2 C1 C2 C4 D1 D3 11. Taping 11-1 Embossed taping Chip size 3216 3225 4532 5750 PMLCAP Taping code A1 A2 B1 B2 B3 C1 C2 C3 C4 D1 D2 D3 Dimensions [mm] P0 P1 P2 B0 W F E ±0.1 ±0.1 ±0.3 ±0.05 ±0.1 ±0.1 ±0.04 ±0.1 ΦD0 ±0.1 ΦD1 +0.2/-0 2.00 3.60 8.0 3.5 1.75 4.0 2.0 4.0 1.5 1.0 2.90 3.60 8.0 3.5 1.75 4.0 2.0 4.0 1.5 1.0 3.60 4.90 12.0 5.5 1.75 8.0 2.0 4.0 1.5 1.5 5.40 6.10 12.0 5.5 1.75 8.0 2.0 4.0 1.5 1.5 A0 SERIES RUBYCON CORPORATION K T ±0.1 ±0.05 1.4 1.8 1.8 2.2 2.4 1.8 2.2 2.4 3.0 2.2 2.6 3.0 0.20 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 11/12 11-2 Leader part and tape end Leader part Tape end 20 empty pocket min. 300mm min 300mm min 11-3 Reel dimension A N E r φD W1 W2 Chip size PMLCAP Taping code Dimension(mm) A N W1 W2 ΦD E r ±1.0 ±1.0 ±1.0 ±1.0 ±0.2 ±0.5 ±0.2 3216 A 180 60 9.5 13.1 13.0 2.0 1.0 3225 B 180 60 9.5 13.1 13.0 2.0 1.0 4532 C 254 100 13.5 18.5 13.0 2.0 1.0 5750 D 254 100 13.5 18.5 13.0 2.0 1.0 SERIES RUBYCON CORPORATION 12/12 11-4 Reel size and quantity Chip size 3216 3225 4532 5750 12. Reel size φ180mm φ180mm φ254mm φ254mm Quantity 2000pcs/real 2000pcs/real 1500pcs/real 1500pcs/real Packaging The capacitor shall be put in embossed taping. Then, it shall be put in package with dry silica gel. 13. Use Conditions Operating temperature range :−55°C to +125°C Including temperature-rise on element surface (10°C) Rated voltage derating by category temperature is not necessary. Rerated voltage derating by category temperature % to the rated voltage 100 90 80 70 60 50 40 100 105 110 115 120 125 Temperature (C) PMLCAP SERIES RUBYCON CORPORATION
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