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74ALVCH16244DGG:11

74ALVCH16244DGG:11

  • 厂商:

    RUBYCON(红宝石)

  • 封装:

    TSSOP-48

  • 描述:

    类型:缓冲器,非反相;电源电压:1.2V~3.6V;输入类型:-;输出类型:三态;低电平输出电流(IOL):24mA;高电平输出电流(IOH):24mA;工作温度:-40℃~+85℃;

  • 数据手册
  • 价格&库存
74ALVCH16244DGG:11 数据手册
INTEGRATED CIRCUITS 74ALVC16244/74ALVCH16244 2.5V/3.3V 16-bit buffer/line driver (3-State) Product specification Supersedes data of 1997 Mar 21 IC24 Data Handbook       1998 Jun 29 Philips Semiconductors Product specification 74ALVC16244/ 74ALVCH16244 16-bit buffer/line driver (3-State) FEATURES PIN CONFIGURATION • Wide supply voltage range of 1.2V to 3.6V • Complies with JEDEC standard no. 8-1A • CMOS low power consumption • MULTIBYTETM flow-through standard pin-out architecture • Low inductance multiple VCC and GND pins for minimum noise and ground bounce • Direct interface with TTL levels • Bus hold on data inputs (74ALVCH16244 only) • Output drive capability 50Ω transmission lines @ 85°C • Current drive ±24 mA at 3.0 V DESCRIPTION The 74ALVC16244(74ALVCH16244) is a 16-bit non-inverting buffer/line driver with 3-State outputs. The device can be used as four 4-bit buffers, two 8-bit buffers or one 16-bit buffer. The 3-State outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to assume a high impedance OFF-state. The 74ALVCH16244 has active bus hold circuitry which is provided to hold unused or floating data inputs at a valid logic level. This feature eliminates the need for external pull-up or pull-down resistors. The 74ALVC16244 has 5V tolerant inputs. 1OE 1 48 2OE 1Y0 2 47 1A0 1Y1 3 46 1A1 GND 4 45 GND 1Y2 5 44 1A2 1Y3 6 43 1A3 VCC 7 42 VCC 2Y0 8 41 2A0 2Y1 9 40 2A1 GND 10 39 GND 2Y2 11 38 2A2 2Y3 12 37 2A3 3Y0 13 36 3A0 3Y1 14 35 3A1 GND 15 34 GND 3Y2 16 33 3A2 3Y3 17 32 3A3 VCC 18 31 VCC 4Y0 19 30 4A0 4Y1 20 29 4A1 GND 21 28 GND 4Y2 22 27 4A2 4Y3 23 26 4A3 4OE 24 25 3OE SW00194 QUICK REFERENCE DATA GND = 0 V; Tamb = 25°C; tr = tf ≤ 2.5 ns PARAMETER SYMBOL tPHL/tPLH Propagation delay An to Yn CI Input capacitance CPD Power dissipation capacitance per buffer CONDITIONS TYPICAL UNIT 1.9 1.9 ns 5.0 pF VCC = 2.5V, CL = 30pF VCC = 3.3V, CL = 50pF VI = GND to VCC1 Outputs enabled 25 Outputs disabled 4 pF NOTE: 1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD × VCC2 × fi +  (CL × VCC2 × fo) where: fi = input frequency in MHz; CL = output load capacitance in pF; fo = output frequency in MHz; VCC = supply voltage in V;  (CL × VCC2 × fo) = sum of the outputs. ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 48-Pin Plastic SSOP Type III –40°C to +85°C 74ALVC16244 DL AC16244 DL SOT370-1 48-Pin Plastic TSSOP Type II –40°C to +85°C 74ALVC16244 DGG AC16244 DGG SOT362-1 48-Pin Plastic SSOP Type III –40°C to +85°C 74ALVCH16244 DL ACH16244 DL SOT370-1 48-Pin Plastic TSSOP Type II –40°C to +85°C 74ALVCH16244 DGG ACH16244 DGG SOT362-1 1998 Jun 29 2 853-2082 19638 Philips Semiconductors Product specification 74ALVC16244/ 74ALVCH16244 16-bit buffer/line driver (3-State) PIN DESCRIPTION PIN NUMBER FUNCTION TABLE SYMBOL NAME AND FUNCTION INPUTS Output enable input (active LOW) OUTPUT nOE nAn nYn L L L L H H H X Z 1 1OE 2, 3, 5, 6 1Y0 to 1Y3 Data outputs 4, 10, 15, 21, 28, 34, 39, 45 GND Ground (0V) 7, 18, 31, 42 VCC Positive supply voltage 8, 9, 11, 12 2Y0 to 2Y3 Data outputs 13, 14, 16, 17 3Y0 to 3Y3 Data outputs 19, 20, 22, 23 4Y0 to 4Y3 Data outputs 24 4OE Output enable input (active LOW) 25 3OE Output enable input (active LOW) 1OE 1 1EN 2OE 48 2EN Data inputs 3OE 25 3EN 24 4EN 30, 29, 27, 26 4A0 to 4A3 H = HIGH voltage level L = LOW voltage level X = don’t care Z = high impedance OFF-state LOGIC SYMBOL (IEEE/IEC) 36, 35, 33, 32 3A0 to 3A3 Data inputs 4OE 41, 40, 38, 37 2A0 to 2A3 Data inputs 1A0 47, 46, 44, 43 1A0 to 1A3 48 2OE Data inputs 1A1 Output enable input (active LOW) 1A2 1A3 2A0 LOGIC SYMBOL 2A1 2A2 1A0 47 2 1Y0 3A0 36 13 3Y0 2A3 3A0 1A1 46 3 1Y1 3A1 35 14 3Y1 3A1 3A2 1A2 44 5 1Y2 3A2 33 16 3Y2 3A3 4A0 1A3 43 6 1Y3 3A3 32 17 3Y3 4A1 4A2 1OE 1 3OE 25 4A3 47 2 1Y0 46 3 1Y1 44 5 1Y2 43 6 1Y3 8 2Y0 1 41 1 1∇ 2∇ 40 9 38 11 2Y2 37 12 2Y3 13 3Y0 35 14 3Y1 33 16 3Y2 32 17 3Y3 19 4Y0 29 20 4Y1 27 22 4Y2 26 23 36 1 30 1 3∇ 4∇ 2Y1 4Y3 SW00056 2A0 41 8 40 9 38 11 37 12 2Y0 4A0 30 19 29 20 27 22 26 23 4Y0 BUS HOLD CIRCUIT 2A1 2Y1 4A1 4Y1 VCC 2A2 2A3 2OE 48 2Y2 4A2 2Y3 4A3 4OE 4Y2 4Y3 24 Data Input To internal circuit SW00195 SW00044 1998 Jun 29 3 Philips Semiconductors Product specification 74ALVC16244/ 74ALVCH16244 16-bit buffer/line driver (3-State) RECOMMENDED OPERATING CONDITIONS LIMITS SYMBOL VCC VI VO Tamb tr, tf PARAMETER CONDITIONS UNIT MIN MAX DC supply voltage 2.5V range (for max. speed performance @ 30 pF output load) 2.3 2.7 DC supply voltage 3.3V range (for max. speed performance @ 50 pF output load) 3.0 3.6 DC supply voltage (for low-voltage applications) 1.2 3.6 For data input pins with bus hold 0 VCC For data input pins without bus hold 0 5.5 For control pins 0 5.5 0 VCC V –40 +85 °C 0 0 20 10 ns/V DC Input voltage range DC output voltage range Operating free-air temperature range VCC = 2.3 to 3.0V VCC = 3.0 to 3.6V Input rise and fall times V V ABSOLUTE MAXIMUM RATINGS1 In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V) SYMBOL VCC IIK PARAMETER CONDITIONS DC supply voltage DC input diode current VI 0 For data inputs with bus hold2 VI DC input voltage –50 mA –0.5 to VCC +0.5 –0.5 to +5.5 VO DC output voltage Note 2 IO DC output source or sink current VO = 0 to VCC DC VCC or GND current Storage temperature range Power dissipation per package –plastic medium-shrink (SSOP) –plastic thin-medium-shrink (TSSOP) V –0.5 to +5.5 VO VCC or VO  0 PTOT –0.5 to +4.6 For control pins2 DC output diode current Tstg UNIT For data inputs without bus hold2 IOK IGND, ICC RATING For temperature range: –40 to +125 °C above +55°C derate linearly with 11.3 mW/K above +55°C derate linearly with 8 mW/K 50 V mA –0.5 to VCC +0.5 V 50 mA 100 mA –65 to +150 °C 850 600 mW NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Jun 29 4 Philips Semiconductors Product specification 74ALVC16244/ 74ALVCH16244 16-bit buffer/line driver (3-State) DC CHARACTERISTICS Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). LIMITS SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C MIN VIH HIGH level Input In ut voltage TYP1 VCC = 1.2V VCC VCC = 1.8V 0.7*VCC 0.9 VCC = 2.3 to 2.7V 1.7 1.2 VCC = 2.7 to 3.6V 2.0 1.5 VCC = 1.2V VIL VOH VOL II IIHZ/IILZ IOZ ICC LOW level In Input ut voltage HIGH level output voltage GND 0.9 0.2*VCC VCC = 2.3 to 2.7V 1.2 0.7 VCC = 2.7 to 3.6V 1.5 0.8 VCC = 1 1.8 8 to 3 3.6V; 6V; VI = VIH or VIL; IO = –100µA VCC–0.2 –0 2 VCC VCC = 1.8V; VI = VIH or VIL; IO = –6mA VCC–0.4 VCC–0.10 VCC = 2.3V; VI = VIH or VIL; IO = –6mA VCC–0.3 VCC–0.08 VCC = 2.3V; VI = VIH or VIL; IO = –12mA VCC–0.5 VCC–0.17 VCC = 2.3V; VI = VIH or VIL; IO = –18mA VCC–0.6 VCC–0.26 VCC = 2.7V; VI = VIH or VIL; IO = –12mA VCC–0.5 VCC–0.14 VCC = 3.0V; VI = VIH or VIL; IO = –24mA VCC–1.0 VCC–0.28 GND 0 20 0.20 VCC = 1.8V; VI = VIH or VIL; IO = 6mA 0.09 0.30 VCC = 2.3V; VI = VIH or VIL; IO = 6mA 0.07 0.20 VCC = 2.3V; VI = VIH or VIL; IO = 12mA 0.15 0.40 VCC = 2.3V; VI = VIH or VIL; IO = 18mA 0.23 0.60 VCC = 2.7V; VI = VIH or VIL; IO = 12mA 0.14 0.40 VCC = 3.0V; VI = VIH or VIL; IO = 24mA 0.27 0.55 Input leakage current per data pin with bus hold VCC = 1.8 to 3.6V; VI = VCC or GND 0.1 5 Input leakage current per data pin without bus hold VCC = 1.8 to 3.6V; VI = 5.5 V or GND 0.1 5 Input leakage current per control pin VCC = 1.8 to 3.6V; VI = 5.5 V or GND 0.1 5 VCC = 1.8 to 2.7V; VI = VCC or GND 0.1 10 VCC = 3.6V; VI = VCC or GND 0.1 15 VCC = 1.8 to 2.7V; VI = VIH or VIL; VO = VCC or GND 0.1 5 VCC = 2.7 to 3.6V; VI = VIH or VIL; VO = VCC or GND 0.1 10 VCC = 1.8 to 2.7V; VI = VCC or GND; IO = 0 0.1 20 VCC = 2.3 to 3.6V; VI = VCC or GND; IO = 0 0.2 40 150 750 5 500 5 500 LOW level output voltage Input current for common I/O pins 3-State output out ut OFF-state current Quiescent su supply ly current Additional quiescent supply current given per data I/O pin without bus hold VCC = 2.7V to 3.6V; VI = VCC – 0.6V; IO = 0 5 V V 8 to 3 6V; VI = VIH or VIL; IO = 100µA VCC = 1 1.8 3.6V; Additional quiescent supply current given per control pin 1998 Jun 29 V VCC = 1.8V Additional quiescent supply current given per data I/O pin with bus hold ∆ICC UNIT MAX V µA µA µA µA µA Philips Semiconductors Product specification 74ALVC16244/ 74ALVCH16244 16-bit buffer/line driver (3-State) DC ELECTRICAL CHARACTERISTICS (Continued) Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). LIMITS SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C MIN IBHL2 Bus hold LOW sustaining current IBHH2 Bus hold HIGH sustaining current IBHLO2 Bus hold LOW overdrive current IBHHO2 Bus hold HIGH overdrive current TYP1 VCC = 2.3V; VI = 0.7V 45 – VCC = 3.0V; VI = 0.8V 75 150 VCC = 2.3V; VI = 1.7V –45 VCC = 3.0V; VI = 2.0V –75 VCC = 2.7V 300 VCC = 3.6V 450 VCC = 2.7V –300 VCC = 3.6V –450 UNIT MAX µA µA –175 µA µA NOTES: 1. All typical values are at Tamb = 25°C. 2. Valid for data inputs of bus hold parts. AC CHARACTERISTICS FOR VCC = 2.3V TO 2.7V RANGE AND VCC < 2.3V GND = 0V; tr = tf ≤ 2.0ns; CL = 30pF LIMITS SYMBOL PARAMETER WAVEFORM VCC = 2.3 to 2.7V VCC = 1.8V VCC = 1.2V MIN TYP1, 2 MAX MIN TYP1 MAX TYP1 UNIT tPHL/tPLH Propagation delay nAn to nYn 1, 3 1.0 1.9 3.7 1.5 2.8 5.1 5.8 ns tPZH/tPZL 3-State output enable time nOE to nYn 2, 3 1.0 2.5 4.9 1.5 3.8 7.1 8.4 ns tPHZ/tPLZ 3-State output disable time nOE to nYn 2, 3 1.0 2.1 4.1 1.5 3.1 3.5 5.9 ns NOTES: 1. All typical values are measured at Tamb = 25°C. 2. Typical value is measured at VCC = 2.5V AC CHARACTERISTICS FOR VCC = 3.0V TO 3.6V RANGE AND VCC = 2.7V GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF LIMITS SYMBOL PARAMETER VCC = 3.3 ± 0.3V WAVEFORM VCC = 2.7V UNIT MIN TYP1, 2 MAX MIN TYP1 MAX tPHL/tPLH Propagation delay nAn to nYn 1, 3 1.0 1.9 3.0 1.0 2.1 3.6 ns tPZH/tPZL 3-State output enable time nOE to nYn 2, 3 1.0 2.3 4.0 1.0 2.9 4.9 ns tPHZ/tPLZ 3-State output disable time nOE to nYn 2, 3 1.0 2.7 4.1 1.0 3.0 4.5 ns NOTES: 1. All typical values are measured at Tamb = 25°C. 2. Typical value is measured at VCC = 3.3V 1998 Jun 29 6 Philips Semiconductors Product specification 74ALVC16244/ 74ALVCH16244 16-bit buffer/line driver (3-State) AC WAVEFORMS FOR VCC = 2.3V TO 2.7V AND VCC < 2.3V RANGE TEST CIRCUIT VM = 0.5 VCC VX = VOL + 0.15V VY = VOH –0.15V VOL and VOH are the typical output voltage drop that occur with the output load. V =V CC I S1 VCC PULSE GENERATOR D.U.T. AC WAVEFORMS FOR VCC = 3.0V TO 3.6V AND VCC = 2.7V RANGE RT VM = 1.5 V VX = VOL + 0.3V VY = VOH –0.3V VOL and VOH are the typical output voltage drop that occur with the output load. V = 2.7V I RL = 500 Ω VO VI 2 * VCC Open GND RL = 500 Ω CL Test Circuit for switching times DEFINITIONS RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators. SWITCH POSITION VI An INPUT TEST S1 VCC VI VM tPLH/tPHL GND tPHL tPLH VOH Open tPLZ/tPZL 2  VCC tPHZ/tPZH GND < 2.7V VCC 2.7–3.6V 2.7V SV00906 Yn OUTPUT VM Waveform 3. Load circuitry for switching times VOL SW00057 Waveform 1. Input (An) to output (Yn) propagation delay times VI nOE INPUT VM GND tPLZ tPZL VCC OUTPUT LOW-to-OFF OFF-to-LOW VM VX VOL tPHZ tPZH VOH OUTPUT HIGH-to-OFF OFF-to-HIGH VY VM GND outputs enabled outputs disabled outputs enabled SW00058 Waveform 2. 3-State enable and disable times 1998 Jun 29 7 Philips Semiconductors Product specification 2.5V/3.3V 16-bit buffer/line driver (3-State) SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm 1998 Jun 29 8 74ALVC16244/ 74ALVCH16244 SOT370-1 Philips Semiconductors Product specification 2.5V/3.3V 16-bit buffer/line driver (3-State) TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1mm 1998 Jun 29 9 74ALVC16244/ 74ALVCH16244 SOT362-1 Philips Semiconductors Product specification 74ALVC16244/ 74ALVCH16244 2.5V/3.3V 16-bit buffer/line driver (3-State) DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Formative or in Design This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. Preliminary Specification Preproduction Product This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product Specification Full Production This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.  Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Date of release: 06-98 Document order number:       1998 Jun 29 10 9397-750-04536
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