RU1HL8L
P-Channel Advanced Power MOSFET
Features
Pin Description
• -100V/-8A,
RDS (ON) =350mΩ(Typ.)@VGS=-10V
RDS (ON) =400mΩ(Typ.)@VGS=-4.5V
• Super High Dense Cell Design
• ESD protected
• Reliable and Rugged
TO252
• 100% avalanche tested
• Lead Free and Green Devices Available
(RoHS Compliant)
Applications
• Power Management
• DC/DC Converters
P-Channel MOSFET
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (TC=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
-100
VGSS
Gate-Source Voltage
±16
Maximum Junction Temperature
175
°C
-55 to 175
°C
TC=25°C
-8
A
TC=25°C
-32
TC=25°C
-8
TC=100°C
-6
TC=25°C
40
TC=100°C
20
TJ
TSTG
IS
Storage Temperature Range
Diode Continuous Forward Current
V
Mounted on Large Heat Sink
IDP
300μs Pulse Drain Current Tested
ID
Continuous Drain Current(VGS=-10V)
PD
Maximum Power Dissipation
RJC
Thermal Resistance-Junction to Case
①
A
A
W
3.75
°C/W
25
mJ
Drain-Source Avalanche Ratings
②
EAS
Avalanche Energy, Single Pulsed
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
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RU1HL8L
Electrical Characteristics
Symbol
(TC=25°C Unless Otherwise Noted)
Parameter
Static Characteristics
BVDSS Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VGS(th)
IGSS
RDS(ON)
③
Test Condition
VGS=0V, IDS=-250A
Min.
Typ.
-1
Gate Leakage Current
VGS=±16V, VDS=0V
-30
-1
Unit
V
TJ=85°C
VDS=VGS, IDS=-250A
Max.
-100
VDS= -100V, VGS=0V
Gate Threshold Voltage
Drain-Source On-state Resistance
RU1HL8L
-
A
-2.5
V
±10
A
VGS= -10V, IDS=-8A
350
450
m
VGS= -4.5V, IDS=-5A
400
480
m
-1.2
V
Diode Characteristics
VSD
③
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD=-8A, VGS=0V
ISD=-8A, dlSD/dt=100A/s
30
ns
58
nC
1.6
④
Dynamic Characteristics
RG
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
1550
230
pF
110
15
VDD=-50V, RL=5,
IDS=-8A, VGEN=-10V,
RG=6
Turn-off Fall Time
Gate Charge Characteristics
19
30
ns
16
④
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Notes:
VGS=0V,
VDS= -50V,
Frequency=1.0MHz
VDS=-80V, VGS= -10V,
IDS=-8A
26
8
nC
9
①Pulse width limited by safe operating area.
②Limited by TJmax, IAS =10A, VDD =-60V, RG = 50Ω , Starting TJ = 25°C.
③Pulse test ; Pulse width300s, duty cycle2%.
④Guaranteed by design, not subject to production testing.
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
2
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RU1HL8L
Typical Characteristics
Drain Current
Ptot - Power (W)
-ID - Drain Current (A)
Power Dissipation
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
-ID - Drain Current (A)
Normalized Effective Transient
Thermal Transient Impedance
-VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
Square Wave Pulse Duration (sec)
3
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RU1HL8L
Typical Characteristics
Drain-Source On Resistance
-ID - Drain Current (A)
RDS(ON) - On Resistance (mΩ)
Output Characteristics
-ID - Drain Current (A)
Drain-Source On Resistance
Gate Threshold Voltage
RDS(ON) - On - Resistance (m)
Normalized Threshold Voltage
-VDS - Drain-Source Voltage (V)
-VGS - Gate-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
Tj - Junction Temperature (°C)
4
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RU1HL8L
Typical Characteristics
Source-Drain Diode Forward
-IS - Source Current (A)
Normalized On Resistance
Drain-Source On Resistance
Tj - Junction Temperature (°C)
-VSD - Source-Drain Voltage (V)
Gate Charge
C - Capacitance (pF)
-VGS - Gate-Source Voltage (V)
Capacitance
-VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
QG - Gate Charge (nC)
5
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RU1HL8L
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
6
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RU1HL8L
Ordering and Marking Information
Device
Marking
Package
Packaging
Quantity
Reel Size
Tape width
RU1HL8L
RU1HL8L
TO-252
Tape&Reel
2500
13’’
16mm
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
7
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RU1HL8L
Package Information
TO252-2L
SYMBOL
MM
INCH
MM
SYMBOL
MIN
MAX
MIN
MAX
A
2.200
2.400
0.087
0.094
L
A1
0.000
0.127
0.000
0.005
L1
INCH
MIN
MAX
MIN
MAX
9.800
10.400
0.386
0.409
2.900 REF.
b
0.660
0.860
0.026
0.034
L2
C
0.460
0.580
0.018
0.023
L3
D
6.500
6.700
0.256
0.264
L4
0.600
1.000
0.024
0.039
D1
5.100
5.460
0.201
0.215
Φ
1.100
1.300
0.043
0.051
θ
0°
8°
0°
8°
0.000
0.300
0.000
0.012
D2
4.830 REF.
0.190 REF.
E
6.000
6.200
0.236
0.244
h
e
2.186
2.386
0.086
0.094
V
1.400
1.700
0.114 REF.
1.600 REF.
5.350 REF.
0.055
0.067
0.063REF.
0.211 REF.
ALL DIMENSIONS REFER TO JEDEC STANDARD
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
8
www.ruichips.com
RU1HL8L
Customer Service
Worldwide Sales and Service:
Sales@ruichips.com
Technical Support:
Technical@ruichips.com
Investor Relations Contacts:
Investor@ruichips.com
Marcom Contact:
Marcom@ruichips.com
Editorial Contact:
Editorial@ruichips.com
HR Contact:
HR@ruichips.com
Legal Contact:
Legal@ruichips.com
Shen Zhen RUICHIPS Semiconductor CO., LTD
Room 501, the 5floor An Tong Industrial Building,
NO.207 Mei Hua Road Fu Tian Area Shen Zhen City, CHINA
TEL: (86-755) 8311-5334
FAX: (86-755) 8311-4278
E-mail: Sales-SZ@ruichips.com
Copyright Ruichips Semiconductor Co., Ltd
Rev. B– JUN., 2014
9
www.ruichips.com