RU20P3B
P-Channel Advanced Power MOSFET
MOSFET
Features
Pin Description
• -20V/-3A,
RDS (ON) =80mΩ (Typ.) @ VGS=-4.5V
RDS (ON) =110mΩ (Typ.) @ VGS=-2.5V
• Low RDS (ON)
• Super High Dense Cell Design
• Reliable and Rugged
SOT-23
• Lead Free and Green Available
Applications
• Power Management
• Load Switch
Absolute Maximum Ratings
Symbol
P-Channel MOSFET
Parameter
Rating
Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS
Drain-Source Voltage
-20
VGSS
Gate-Source Voltage
±12
Maximum Junction Temperature
150
°C
-55 to 150
°C
TA=25°C
-1.2
A
TA=25°C
-12
TA=25°C
-3
TA=70°C
-2.3
TA=25°C
1
TA=70°C
0.64
TJ
TSTG
IS
Storage Temperature Range
Diode Continuous Forward Current
V
Mounted on Large Heat Sink
IDP
300μs Pulse Drain Current Tested
ID
Continuous Drain Current(VGS=-4.5V)
PD
RθJA
②
Maximum Power Dissipation
Thermal Resistance-Junction to Ambient
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
①
A
A
125
W
°C/W
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RU20P3B
Electrical Characteristics
Symbol
(TA=25°C Unless Otherwise Noted)
Parameter
Test Condition
RU20P3B
Min.
Typ.
Max.
Unit
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VGS(th)
IGSS
RDS(ON)
③
VGS=0V, IDS=-250µA
V
-20
VDS=-20V, VGS=0V
-1
TJ=85°C
Gate Threshold Voltage
VDS=VGS, IDS=-250µA
Gate Leakage Current
VGS=±12V, VDS=0V
-30
-0.5
-
µA
-1
V
±100
nA
VGS=-4.5V, IDS=-3A
80
100
mΩ
VGS=-2.5V, IDS=-2A
110
150
mΩ
-1.2
V
Drain-Source On-state Resistance
Diode Characteristics
VSD
③
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ISD=-1A, VGS=0V
ISD=-3A, dlSD/dt=100A/µs
13
ns
6
nC
2
Ω
④
Dynamic Characteristics
RG
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
VGS=0V,
VDS=-10V,
Frequency=1.0MHz
480
120
pF
40
8
VDD=-10V, RL=3Ω,
IDS=-3A, VGEN=-4.5V,
RG=6Ω
Turn-off Fall Time
13
ns
25
12
④
Gate Charge Characteristics
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Notes:
7
VDS=-16V, VGS=-4.5V,
IDS=-3A
1.5
nC
2.5
Pulse width limited by safe operating area.
②When mounted on 1 inch square copper board, t ≤10sec. The value in any given application depends on
the user's specific board design.
③Pulse test ; Pulse width≤300µs, duty cycle≤2%.
④Guaranteed by design, not subject to production testing.
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
2
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RU20P3B
Typical Characteristics
Drain Current
Ptot - Power (W)
-ID - Drain Current (A)
Power Dissipation
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
-ID - Drain Current (A)
Normalized Effective Transient
Thermal Transient Impedance
-VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
Square Wave Pulse Duration (sec)
3
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RU20P3B
Typical Characteristics
Drain-Source On Resistance
-ID - Drain Current (A)
RDS(ON) - On Resistance (mΩ)
Output Characteristics
-ID - Drain Current (A)
Drain-Source On Resistance
Gate Threshold Voltage
RDS(ON) - On - Resistance (m)
Normalized Threshold Voltage
-VDS - Drain-Source Voltage (V)
-VGS - Gate-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
Tj - Junction Temperature (°C)
4
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RU20P3B
Typical Characteristics
Source-Drain Diode Forward
-IS - Source Current (A)
Normalized On Resistance
Drain-Source On Resistance
Tj - Junction Temperature (°C)
-VSD - Source-Drain Voltage (V)
Gate Charge
C - Capacitance (pF)
-VGS - Gate-Source Voltage (V)
Capacitance
-VDS - Drain-Source Voltage (V)
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
QG - Gate Charge (nC)
5
www.ruichips.com
RU20P3B
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
6
www.ruichips.com
RU20P3B
Ordering and Marking Information
②
Device
Marking
①
Package
Packaging
Quantity
Reel Size
Tape width
RU20P3B
8XYWW
SOT-23
Tape&Reel
3000
7’’
8mm
RU20P3B-G
8XYWW
SOT-23
Tape&Reel
3000
7’’
8mm
① The following characters could be different and means:
X
=Assembly site code
Y
=Year
WW =Work Week
② Device end with -G means Green Product
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
7
www.ruichips.com
RU20P3B
Package Information
SOT-23
SYMBOL
MM
INCH
MM
SYMBOL
INCH
MIN
MAX
MIN
MAX
A
0.900
1.150
0.035
0.045
E1
MIN
MAX
MIN
MAX
2.250
2.550
0.089
A1
0.000
0.100
0.000
0.004
e
0.100
A2
0.900
1.050
0.035
0.041
e1
b
0.300
0.500
0.012
0.020
L
c
0.080
0.150
0.003
0.006
L1
0.300
0.500
0.012
0.020
D
2.800
3.000
0.110
0.118
θ
0°
8°
0°
8°
E
1.200
1.400
0.047
0.055
0.950 TYP.
1.800
2.000
0.550 REF.
0.037 TYP.
0.071
0.079
0.022 REF.
ALL DIMENSIONS REFER TO JEDEC STANDARD
DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
8
www.ruichips.com
RU20P3B
Customer Service
Worldwide Sales and Service:
Sales@ruichips.com
Technical Support:
Technical@ruichips.com
Investor Relations Contacts:
Investor@ruichips.com
Marcom Contact:
Marcom@ruichips.com
Editorial Contact:
Editorial@ruichips.com
HR Contact:
HR@ruichips.com
Legal Contact:
Legal@ruichips.com
Shen Zhen RUICHIPS Semiconductor CO., LTD
Room 501, the 5floor An Tong Industrial Building,
NO.207 Mei Hua Road Fu Tian Area Shen Zhen City, CHINA
TEL: (86-755) 8311-5334
FAX: (86-755) 8311-4278
E-mail: Sales-SZ@ruichips.com
Copyright Ruichips Semiconductor Co., Ltd
Rev. A– SEP., 2012
9
www.ruichips.com
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