RU2H30Q

RU2H30Q N-Channel Advanced Power MOSFET MOSFET Features • 200V/30A, RDS (ON) =75mΩ (Typ.) @ VGS=10V • Ultra Low On-Resistance • Fast Switching and Fully Avalanche Rated • 100% avalanche tested • 175°C Operating Temperature Pin Description TO-220 TO-220F TO-263 • Lead Free and Green Available TO-247 Applications • Switching Application Systems • DC/DC Converters N-Channel MOSFET Absolute Maximum Ratings Symbol Parameter Rating 200 ±25 175 -55 to 175 TC=25°C 30 ① Unit Common Ratings (TC=25°C Unless Otherwise Noted) VDSS VGSS TJ TSTG IS IDP ID Drain-Source Voltage Gate-Source Voltage Maximum Junction Temperature Storage Temperature Range Diode Continuous Forward Current V °C °C A Mounted on Large Heat Sink 300μs Pulse Drain Current Tested Continuous Drain Current TC=25°C TC=25°C TC=100°C PD RθJC ③ 120 30 A A ② Maximum Power Dissipation Thermal Resistance-Junction to Case TC=25°C TC=100°C 23 180 90 ② W °C/W 0.83 Drain-Source Avalanche Ratings EAS Avalanche Energy, Single Pulsed 81 mJ Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 www.ruichips.com RU2H30Q Electrical Characteristics Symbol Static Characteristics BVDSS IDSS VGS(th) IGSS RDS(ON) ④ (TC=25°C Unless Otherwise Noted) RU2H30Q Min. Typ. Max. Parameter Test Condition Unit Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance VGS=0V, IDS=250µA VDS= 200V, VGS=0V TJ=85°C VDS=VGS, IDS=250µA VGS=±25V, VDS=0V VGS= 10V, IDS=17A 200 1 30 2 3 4 ±100 75 85 V µA V nA mΩ Diode Characteristics VSD trr Qrr ④ Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge ⑤ ISD=30A, VGS=0V ISD=30A, dlSD/dt=100A/µs 150 125 VGS=0V,VDS=0V,F=1MHz VGS=0V, VDS=100V, Frequency=1.0MHz VDD=100V, RL=3Ω, IDS=30A, VGEN= 10V, RG=6Ω 1.0 2140 308 78 16 48 38 33 1.2 V ns nC Ω pF Dynamic Characteristics RG Gate Resistance Ciss Coss Crss td(ON) tr td(OFF) tf Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time ⑤ ns Gate Charge Characteristics Qg Qgs Qgd Notes: Total Gate Charge Gate-Source Charge Gate-Drain Charge VDS=160V, VGS= 10V, IDS=30A 116 23 52 nC ①Pulse width limited by safe operating area. ②Calculated continuous current based on maximum allowable junction temperature. ③Limited by TJmax, IAS =18A, VDD = 60V, RG = 50Ω , Starting TJ = 25°C. ④Pulse test ; Pulse width≤300µs, duty cycle≤2%. ⑤Guaranteed by design, not subject to production testing. Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 2 www.ruichips.com RU2H30Q Typical Characteristics Power Dissipation Drain Current Tj - Junction Temperature (°C) ID - Drain Current (A) Tj - Junction Temperature (°C) Ptot - Power (W) Safe Operation Area Thermal Transient Impedance VDS - Drain-Source Voltage (V) Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 Normalized Effective Transient Square Wave Pulse Duration (sec) 3 ID - Drain Current (A) www.ruichips.com RU2H30Q Typical Characteristics Output Characteristics Drain-Source On Resistance VDS - Drain-Source Voltage (V) RDS(ON) - On Resistance (mΩ) ID - Drain Current (A) ID - Drain Current (A) Drain-Source On Resistance Gate Threshold Voltage VGS - Gate-Source Voltage (V) Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 4 Normalized Threshold Voltage Tj - Junction Temperature (°C) www.ruichips.com RDS(ON) - On - Resistance (m) RU2H30Q Typical Characteristics Drain-Source On Resistance Source-Drain Diode Forward Normalized On Resistance Tj - Junction Temperature (°C) IS - Source Current (A) VSD - Source-Drain Voltage (V) Capacitance Gate Charge VDS - Drain-Source Voltage (V) Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 5 VGS - Gate-Source Voltage (V) C - Capacitance (pF) QG - Gate Charge (nC) www.ruichips.com RU2H30Q Avalanche Test Circuit and Waveforms Switching Time Test Circuit and Waveforms Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 6 www.ruichips.com RU2H30Q Ordering and Marking Information RU2H30 Package (Available) R : TO-220; S: TO-263 ; Q: TO-247 Operating Temperature Range C : -55 to 175 ºC Assembly Material G : Green & Lead Free Packaging T : TUBE TR : Tape & Reel Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 7 www.ruichips.com RU2H30Q Package Information TO-220FB-3L SYMBOL A A1 A2 b b2 C D D1 DEP E E1 E2 MM MIN 4.40 1.27 2.35 0.77 1.23 0.48 15.40 9.00 0.05 9.70 9.80 NOM 4.57 1.30 2.40 0.50 15.60 9.10 0.10 9.90 8.70 10.00 MAX 4.70 1.33 2.50 0.90 1.36 0.52 15.80 9.20 0.20 10.10 10.20 MIN 0.173 0.050 0.093 0.030 0.048 0.019 0.606 0.354 0.002 0.382 0.386 INCH NOM 0.180 0.051 0.094 0.020 0.614 0.358 0.004 0.389 0.343 0.394 MAX 0.185 0.052 0.098 0.035 0.054 0.021 0.622 0.362 0.008 0.398 0.401 SYMBOL Øp1 e e1 H1 L L1 L2 Øp Q 3.57 2.73 5° 1° 6.40 12.75 MIN 1.40 MM NOM 1.50 2.54BSC 5.08BSC 6.50 2.50REF. 3.60 2.80 7° 3° 3.63 2.87 9° 5° 0.141 0.107 5° 1° 6.60 13.17 3.95 0.252 0.502 MAX 1.60 MIN 0.055 INCH NOM 0.059 0.1BSC 0.2BSC 0.256 0.098REF. 0.142 0.110 7° 3° 0.143 0.113 9° 5° 0.260 0.519 0.156 MAX 0.063 θ1 θ2 ALL DIMENSIONS REFER TO JEDEC STANDARD DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 8 www.ruichips.com RU2H30Q TO-263-2L SYMBOL A A1 A2 b b1 c C1 D E e H MM MIN 4.40 0 2.59 0.77 1.23 0.34 1.22 8.60 10.00 14.70 NOM 4.57 0.10 2.69 8.70 10.16 2.54BSC 15.10 15.50 0.579 MAX 4.70 0.25 2.79 0.90 1.36 0.47 1.32 8.80 10.26 MIN 0.173 0 0.102 0.030 0.048 0.013 0.048 0.338 0.394 INCH NOM 0.180 0.004 0.106 0.343 0.4 0.1BSC 0.594 0.610 MAX 0.185 0.010 0.110 0.035 0.052 0.019 0.052 0.346 0.404 SYMBOL L L3 L1 L4 L2 MIN 2.00 1.17 - MM NOM 2.30 1.27 0.25BSC 2.50REF. 0° 5° 1° 0.05 1.40 7° 3° 0.10 1.50 8° 9° 5° 0.20 1.60 0° 5° 1° 0.002 0.055 MAX 2.60 1.40 1.70 MIN 0.079 0.046 - INCH NOM 0.090 0.050 0.01BSC 0.098REF. 7° 3° 0.004 0.059 8° 9° 5° 0.008 0.063 MAX 0.102 0.055 0.067 θ θ1 θ2 DEP Øp1 ALL DIMENSIONS REFER TO JEDEC STANDARD DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 9 www.ruichips.com RU2H30Q TO-247 SYMBOL A A1 B b1 b2 c c1 D E1 MM MIN 4.850 2.200 1.000 2.800 1.800 0.500 1.900 15.450 MAX 5.150 2.600 1.400 3.200 2.200 0.700 2.100 15.750 MIN INCH MAX 0.200 0.102 0.055 0.126 0.087 0.028 0.083 0.620 SYMBOL E2 L L1 L2 Φ e H h MIN 0,191 0.087 0.039 0.110 0.071 0.020 0.075 0.608 MM MAX 41.300 25.100 20.600 7.300 3.600 REF 40.900 24.800 20.300 7.100 INCH MIN 1.610 0.976 0.799 0.280 MAX 1.626 0.988 0.811 0.287 0.142 REF 5.450 TYP 5.980 REF. 0.000 0.300 0.215 TYP 0.235 REF. 0.000 0.012 3.500 REF. 0.138 REF. ALL DIMENSIONS REFER TO JEDEC STANDARD DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 10 www.ruichips.com RU2H30Q Customer Service Worldwide Sales and Service: Sales@ruichips.com Technical Support: Technical@ruichips.com Investor Relations Contacts: Investor@ruichips.com Marcom Contact: Marcom@ruichips.com Editorial Contact: Editorial@ruichips.com HR Contact: HR@ruichips.com Legal Contact: Legal@ruichips.com Shen Zhen RUICHIPS Semiconductor CO., LTD Room 501, the 5floor An Tong Industrial Building, NO.207 Mei Hua Road Fu Tian Area Shen Zhen City, CHINA TEL: (86-755) 8311-5334 FAX: (86-755) 8311-4278 E-mail: Sales-SZ@ruichips.com Copyright© Ruichips Semiconductor Co., Ltd Rev. A– JUL., 2011 11 www.ruichips.com