RU3040M
N-Channel Advanced Power MOSFET
MOSFET
Features
• 30V/40A, RDS (ON) =12mΩ(tpy.)@VGS=10V RDS (ON) =17.5mΩ(tpy.)@VGS=4.5V • Super High Dense Cell Design • Reliable and Rugged • 100% avalanche tested • Lead Free and Green Devices Available (RoHS Compliant)
Pin Description
PDFN 5X6
Applications
• DC/DC Conversion • Switching Application
N-Channel MOSFET
Absolute Maximum Ratings
Symbol Parameter Rating 30 ±20 150 -55 to 150 TC=25°C 40
①
Unit
Common Ratings (TC=25°C Unless Otherwise Noted) VDSS VGSS TJ TSTG IS Drain-Source Voltage Gate-Source Voltage Maximum Junction Temperature Storage Temperature Range Diode Continuous Forward Current V °C °C A
Mounted on Large Heat Sink I DP 300μs Pulse Drain Current Tested TC=25°C TC=25°C ID Continuous Drain Current(VGS=10V) TC=100°C TA=25°C TA=70°C TC=25°C PD Maximum Power Dissipation TC=100°C TA=25°C TA=70°C
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160 40
②
A A
① ① ③
23 13
10.6③
31 12.5 4.2 2.7
③ ③
W
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RU3040M
Mounted on Large Heat Sink RθJC RθJA
③
Thermal Resistance-Junction to Case Thermal Resistance-Junction to Ambient
4 30
°C/W °C/W
Drain-Source Avalanche Ratings EAS
④
Avalanche Energy, Single Pulsed
30
mJ
Electrical Characteristics
Symbol Static Characteristics BVDSS IDSS VGS(th) IGSS RDS(ON)
⑤
(TC=25°C Unless Otherwise Noted) RU3040M Min. Typ. Max.
Parameter
Test Condition
Unit
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance
VGS=0V, IDS=250µA VDS=30V, VGS=0V TJ=85°C VDS=VGS, IDS=250µA VGS=±20V, VDS=0V VGS=10V, IDS=20A VGS=4.5V, IDS=20A
30 1 30 1 2 2.5 ±100 12 17.5 14 25
V µA V nA mΩ mΩ
Diode Characteristics VSD
trr Qrr
⑤
Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge
⑥
ISD=20A, VGS=0V ISD=20A, dlSD/dt=100A/µs 12 18
1.2
V ns nC Ω pF
Dynamic Characteristics RG Gate Resistance Ciss Coss Crss td(ON) tr td(OFF) tf
VGS=0V,VDS=0V,F=1MHz VGS=0V, VDS=15V, Frequency=1.0MHz VDD=15V, RL=0.75Ω, IDS=20A, VGEN=10V, RG=3Ω
1.6 670 180 75 5 10 15 4
Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time
⑥
ns
Gate Charge Characteristics Qg Qgs Qgd Total Gate Charge
12 VDS=24V, VGS=10V, IDS=20A 3 4 nC
Gate-Source Charge Gate-Drain Charge
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RU3040M
Notes: ① Max current is limited by the source bonding. ② Pulse width limited by safe operating area. When mounted on 1 inch square copper board, t ≤10sec. ④ Limited by TJmax, IAS =11A, VDD =24V, RG = 50Ω , Starting TJ = 25°C. ⑤ Pulse test ; Pulse width≤300µs, duty cycle≤2%. ⑥ Guaranteed by design, not subject to production testing .
Ordering and Marking Information
Device RU3040M Marking RU3040M Package PDFN 5X6 Packaging Tape&Reel Quantity 3000 Reel Size 13’’ Tape width 12mm
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RU3040M
Typical Characteristics
Power Dissipation Drain Current
Tj - Junction Temperature (°C)
ID - Drain Current (A)
Tj - Junction Temperature (°C) Safe Operation Area
Ptot - Power (W)
Thermal Transient Impedance
VDS - Drain-Source Voltage (V)
Normalized Effective Transient
Square Wave Pulse Duration (sec)
4
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ID - Drain Current (A)
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RU3040M
Typical Characteristics
Output Characteristics
Drain-Source On Resistance
VDS - Drain-Source Voltage (V)
RDS(ON) - On Resistance (mΩ)
ID - Drain Current (A)
ID - Drain Current (A)
Drain-Source On Resistance
Gate Threshold Voltage
VGS - Gate-Source Voltage (V)
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Normalized Threshold Voltage
Tj - Junction Temperature (°C)
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RDS(ON) - On - Resistance (m)
RU3040M
Typical Characteristics
Drain-Source On Resistance Source-Drain Diode Forward
Normalized On Resistance
Tj - Junction Temperature (°C)
IS - Source Current (A)
VSD - Source-Drain Voltage (V) Capacitance
Gate Charge
VDS - Drain-Source Voltage (V)
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VGS - Gate-Source Voltage (V)
C - Capacitance (pF)
QG - Gate Charge (nC)
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RU3040M
Avalanche Test Circuit and Waveforms
Switching Time Test Circuit and Waveforms
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RU3040M
Package Information
PDFN 5X6
SYMBOL A b C D D1 D2 E E1
MM MIN 1.030 0.340 0.824 4.800 4.110 4.800 5.950 5.650 MAX 1.170 0.480 0.970 5.400 4.310 5.000 6.150 5.850 MIN
INCH MAX 0.046 0.019 0.038 0.213 0.170 0.197 0.242 0.230 SYMBOL E2 e L L1 L2 H I MIN 1.600 0.050 0.380 0.380 3.500 0.040 0.013 0.032 0.189 0.162 0.189 0.234 0.222
MM MAX 0.250 0.500 0.500 3.700 0.180
INCH MIN 0.063 0.002 0.015 0.015 0.138 MAX 0.010 0.020 0.020 0.146 0.007
1.270 BSC
0.050 BSC
ALL DIMENSIONS REFER TO JEDEC STANDARD DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS
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RU3040M
Customer Service
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