S DP /B 55N02
S amHop Microelectronics C orp. May,2004 ver1.1
N -Channel E nhancement Mode Field E ffect Transistor
4
P R ODUC T S UMMAR Y
V DS S
20V
F E AT UR E S
Max
ID
32A
R DS (on) ( m W )
S uper high dense cell design for extremely low R DS (ON). High power and current handling capability. TO-220 & TO-263 package.
19 @ V G S = 4 .5V
D
D
G D S
G
S
G
S DP S E R IE S TO-220
S DB S E R IE S TO-263(DD-P AK)
S
A BS OLUTE MAXIMUM R ATINGS (TC =25 C unless otherwise noted)
P arameter Drain-S ource Voltage Gate-S ource Voltage Drain C urrent-C ontinuous -P ulsed
a
S ymbol V DS V GS @ TJ=125 C ID IDM IS PD T J , T S TG
Limit 20 12 23 57 55 75 -65 to 175
Unit V V A A A W C
Drain-S ource Diode Forward C urrent Maximum P ower Dissipation @ Tc=25 C Operating and S torage Temperature R ange
THE R MAL C HAR AC TE R IS TIC S
Thermal R esistance, Junction-to-C ase Thermal R esistance, Junction-to-Ambient R JC R JA
1
2 62.5
C /W C /W
S DP /B 55N02
E LE CTR ICAL CHAR ACTE R IS TICS (T C = 2 5 C unless otherwise noted)
Parameter OFF CHAR ACTE R IS TICS
Drain-S ource Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage BV DS S IDS S IGS S V GS (th) R DS (ON) ID(ON) gFS
b
S ymbol
Condition
V GS = 0V, ID = 250uA V DS = 16V, V GS = 0V V GS = 8V, V DS =0V V DS = V GS , ID = 250uA V GS = 4.5V, ID = 21A V DS = 10V, V GS = 10V V DS = 10V, ID = 26A
Min Typ Max Unit
20 10 V uA 100 nA 0.9 1 14 40 53 1100 600 180 1.5 19 V
m ohm
C
4
ON CHAR ACTE R IS TICS a
Gate Threshold Voltage Drain-S ource On-S tate R esistance On-S tate Drain Current Forward Transconductance
A S
PF PF PF
DYNAMIC CHAR ACTE R IS TICS
Input Capacitance Output Capacitance R everse Transfer Capacitance
C IS S C OS S CRSS
b
V DS =15V, V GS = 0V f =1.0MH Z
S WITCHING CHAR ACTE R IS TICS
Turn-On Delay Time R ise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-S ource Charge Gate-Drain Charge
tD(ON) tr tD(OFF) tf Qg Q gs Q gd
V DD = 10V, ID = 1A, V GS = 10V R GE N = 6 ohm
50 62.5 200 89
18.2
ns ns ns ns nC nC nC
V DS =10V, ID = 30A, V GS =4.5V
2
5.3 2.2
S DP /B 55N02
E LE CTR ICAL CHAR ACTE R IS TICS (T C =25 C unless otherwise noted)
4
P arameter
Diode Forward Voltage
S ymbol
VSD
Condition
V GS = 0 V, Is =26A
Min Typ Max Unit
0.9 1.3 V
DR AIN-S OUR CE DIODE CHAR ACTE R IS TICS a
Notes a.Pulse Test:Pulse Width 300us, Duty Cycle 2%. b.Guaranteed by design, not subject to production testing.
80 70 75 -55 C 60 V G S =10,9,8,7,6,5,4V
ID , Drain C urrent(A)
60 50 40 30 20 10 0 0 0.5 1.0
I D , Drain C urrent (A)
45 30
25 C
V G S =3V
15 T J =125 C 0 0 1 2 3 4 5 6
1.5
2.0
2.5
3.0
V DS , Drain-to-S ource Voltage (V )
V G S , G ate-to-S ource Voltage (V )
F igure 1. Output C haracteris tics
3000
F igure 2. Trans fer C haracteris tics
1.60
R DS (ON) , Normalized Drain-S ource On-R es is tance
2500
1.40 1.20 1.00 0.80 0.60
I D =26A V G S =10V
C , C apacitance (pF )
2000 1500 1000 500 0 0 5 10 15 20 25 30 C is s C os s C rs s
0.40 -50 -25
0
25
50
75 100 125 150
V DS , Drain-to S ource Voltage (V )
T j, J unction T emperature ( C )
F igure 3. C apacitance
F igure 4. On-R es is tance Variation with Temperature
3
S DP /B 55N02
B V DS S , Normalized Drain-S ource B reakdown V oltage V th, Normalized G ate-S ource T hres hold V oltage
1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 -50 -25 0 25 50 75 100 125 150 V DS =V G S I D =250uA 1.06 1.04 1.02 1.00 0.98 0.96 0.94 -50 -25 I D =250uA
4
0
25
50
75 100 125 150
T j, J unction T emperature ( C )
T j, J unction T emperature ( C )
F igure 5. G ate T hres hold V ariation with T emperature
50
F igure 6. B reakdown V oltage V ariation with T emperature
50
gF S , T rans conductance (S )
Is , S ource-drain current (A)
40 30 20 V DS =10V 10 0 0 10 20 30 40
10
1.0
0.1 0.4 0.6 0.8 1.0 1.2 1.4
I DS , Drain-S ource C urrent (A)
V S D , B ody Diode F orward V oltage (V )
F igure 7. T rans conductance V ariation with Drain C urrent
10
F igure 8. B ody Diode F orward V oltage V ariation with S ource C urrent
60
V G S , G ate to S ource V oltage (V )
I D , Drain C urrent (A)
8 6 4 2 0 0 3
V DS =10V I D =30A
10
RD
S(
) ON
L im
it
1m
10 0m DC s 10 ms
10
0μ
s
s
1
0.1 0.1
V G S =10V S ingle P ulse T c=25 C 1 10 30 60
6
9
12
15
18
21
24
Q g, T otal G ate C harge (nC )
V DS , Drain-S ource V oltage (V )
F igure 9. G ate C harge 4
F igure 10. Maximum S afe O perating Area
S DP /B 55N02
V DD ton V IN D VG S R GE N G
90%
toff tr
90%
RL V OUT
td(on) V OUT
td(off)
90% 10%
tf
10%
INVE R TE D
S
V IN
50% 10%
50%
P ULS E WIDTH
F igure 11. S witching T es t C ircuit
F igure 12. S witching Waveforms
2
r(t),Normalized E ffective T ransient T hermal Impedance
1 D=0.5
0.2 0.1 0.1 0.05 0.02 0.01 S ingle P uls e 0.01 0.01 1. 2. 3. 4. 1 10 100 P DM t1 t2
R θJ C ( t)=r (t) * R θJ C R θJ C =S ee Datas heet T J M-T C = P * R θJ C ( t) Duty C ycle, D=t1/t2 1000 10000
0.1
S quare Wave P uls e Duration (ms ec)
F igure 13. Normalized T hermal T rans ient Impedance C urve
5
S DP /B 55N02
6