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CIC31P471NE

CIC31P471NE

  • 厂商:

    SAMSUNG(三星)

  • 封装:

    1206 (3216 Metric)

  • 描述:

    FERRITE BEAD 470 OHM 1206 1LN

  • 数据手册
  • 价格&库存
CIC31P471NE 数据手册
Ver 201306 Chip Bead For High Current CIC31 Series (3216/ EIA 1206) APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN  CIC series is used for high current. (~ 3A) 1.8~2.5mm 1.2~2.0mm 0.6~1.5mm 0.6~1.5mm DIMENSION Type 31 Dimension [mm] L W t d 3.2±0.2 1.6±0.2 1.1±0.2 0.5+0.2 -0.3 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIC31P260 1.1±0.2 26 0.01 6000 CIC31P300 1.1±0.2 30 0.01 6000 CIC31P310 1.1±0.2 31 0.01 6000 CIC31P330 1.1±0.2 33 0.01 6000 CIC31P350 1.1±0.2 35 0.025 3000 CIC31P500 1.1±0.2 50 0.025 3000 CIC31P520 1.1±0.2 52 0.025 3000 CIC31P600 1.1±0.2 60 0.025 3000 CIC31P680 1.1±0.2 68 0.025 3000 CIC31P700 1.1±0.2 70 0.025 3000 CIC31P800 1.1±0.2 80 0.025 3000 CIC31P900 1.1±0.2 90 0.025 2000 CIC31P121 1.1±0.2 120 0.025 2000 CIC31P151 1.1±0.2 150 0.05 2000 CIC31P221 1.1±0.2 220 0.05 2000 CIC31P301 1.1±0.2 300 0.05 2000 CIC31P391 1.1±0.2 390 0.05 2000 CIC31P471 1.1±0.2 470 0.07 1500 Part no. Ver 201306 Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIC31P601 1.1±0.2 600 0.07 1500 CIC31J300 1.1±0.2 30 0.02 4000 CIC31J500 1.1±0.2 50 0.02 4000 CIC31J680 1.1±0.2 68 0.02 4000 CIC31J800 1.1±0.2 80 0.02 4000 CIC31J900 1.1±0.2 90 0.02 4000 CIC31J121 1.1±0.2 120 0.03 4000 CIC31J151 1.1±0.2 150 0.03 3000 CIC31J241 1.1±0.2 240 0.05 3000 CIC31J301 1.1±0.2 300 0.05 3000 CIC31J471 1.1±0.2 470 0.05 3000 CIC31J501 1.1±0.2 500 0.05 3000 CIC31J601 1.1±0.2 600 0.05 2500 Part no. CHARACTERISTIC DATA Ver 201306 Ver 201306 PRODUCT IDENTIFICATION CI C (1) (2) (1) (3) (5) (6) (7) 31 P (3) (4) 300 N E (5) (6) (7) Chip Beads (2) For High current(C:~3A) Dimension (4) Material Code Nominal impedance (300:30Ω, 221:220Ω ) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Embossed Taping Quantity(pcs/reel) 3,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.
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