CIG10F1R0MAC

Ver. 201207 Multilayer Power Inductor CIG10F Series (1608/ EIA 0603) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES





RECOMMENDED LAND PATTERN The smallest multilayer power inductor (1.6mm×0.8mm) Much lower Profile than any other series (0.5mm max) Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION TYPE 10 Dimension [mm] L W T D 1.6±0.15 0.8±0.15 0.5 max. 0.3±0.2 DESCRIPTION Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance(Ω) Max. CIG10FR47MNC 0603/1608 0.47±20% 0.20±30 % 0.80 CIG10F1R0MNC 0603/1608 1.0±20% 0.30±30 % 0.70 CIG10F1R5MNC 0603/1608 1.5±20% 0.35±30 % 0.60 CIG10F2R2MNC 0603/1608 2.2±20% 0.45±30 % 0.50 Part no. ※Rated Current: DC current value when the self-generation of heat rises to 40℃ (Reference ambient temperature:25℃) ※Operating temperature range: –40 to +125°C ( Including self-temperature rise) ※Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201207 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 10 (3) F (4) 2R2 (5) M (6) N (7) C (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (F:Low Profile Type) Inductance (R47:0.47uH, 2R2:2.2uH) (6) Tolerance (M:±20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4,000 ■ NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.