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CIG21C4R7MNE

CIG21C4R7MNE

  • 厂商:

    SAMSUNG(三星)

  • 封装:

    0805

  • 描述:

    4.7 µH 屏蔽 多层 电感器 580 mA 433 毫欧 0805(2012 公制)

  • 数据手册
  • 价格&库存
CIG21C4R7MNE 数据手册
Ver. 201306 Multilayer Power Inductor CIG21C Series (2012/ EIA 0805) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES     RECOMMENDED LAND PATTERN Suit for small DC-DC converter and choke uses Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION TYPE 21 Dimension [mm] L W T D 2.0±0.1 1.25±0.1 0.9±0.1 0.5+0.2 -0.3 DESCRIPTION Part no. Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance(Ω) Max. CIG21C2R2MNE 0805/2012 2.2±20% 0.250±20 % 0.80 CIG21C4R7MNE 0805/2012 4.7±20% 0.433±20 % 0.58 ※Rated Current: DC current value when the self-generation of heat rises to 40℃ (Reference ambient temperature:25℃) ※Operating temperature range: –40 to +125°C ( Including self-temperature rise) ※Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201306 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 21 (3) C (4) 2R2 (5) M (6) N (7) E (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (C:Choke Type) Inductance (2R2:2.2uH) (6) Tolerance (M:±20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.
CIG21C4R7MNE 价格&库存

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