CIG21L1R2MNE

Ver. 201306 Multilayer Power Inductor CIG21L Series (2012/ EIA 0805) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES



RECOMMENDED LAND PATTERN Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION TYPE 21 Dimension [mm] L W T D 2.0±0.1 1.25±0.1 0.9±0.1 0.5+0.2 -0.3 DESCRIPTION Part no. Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance(Ω) Max. CIG21LR47MNE 0805/2012 0.47 ±20 % 0.080 ±20 % 1.30 CIG21L1R0MNE 0805/2012 1.0 ±20 % 0.110 ±20 % 1.15 CIG21L1R2MNE 0805/2012 1.2 ±20 % 0.125 ±20 % 1.10 CIG21L1R5MNE 0805/2012 1.5 ±20 % 0.140 ±20 % 1.05 CIG21L2R2MNE 0805/2012 2.2 ±20 % 0.160 ±20 % 0.95 CIG21L3R3MNE 0805/2012 3.3 ±20 % 0.220 ±20 % 0.80 CIG21L4R7MNE 0805/2012 4.7 ±20 % 0.260 ±20 % 0.75 ※Rated Current: DC current value when the self-generation of heat rises to 40℃ (Reference ambient temperature:25℃) ※Operating temperature range: –40 to +125°C ( Including self-temperature rise) ※Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201306 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 21 (3) L (4) 1R0 (5) M (6) N (7) E (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (L:Low RDC Type) Inductance (R47:0.47uH, 1R0:1.0uH) (6) Tolerance (M:±20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.