CIG22E1R0MAE

Ver. 201307 Multilayer Power Inductor CIG22E Series (2520/ EIA 1008) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES




RECOMMENDED LAND PATTERN High Current Type Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION TYPE 22 Dimension [mm] L W T D 2.5±0.2 2.0±0.2 0.9±0.1 0.55±0.25 Rated Current (A)＊2 DESCRIPTION Size Inductance DC Rated Current (A)＊1 (inch/mm) (uH)@1MHz Resistance(Ω) Typ. Max. Typ. CIG22ER47MNE 1008/2520 0.47 ±20 % 0.036 ±30% 3.20 3.20 3.70 CIG22E1R0MNE 1008/2520 1.0 ±20 % 0.048 ±30% 2.20 2.30 2.90 CIG22E1R5MNE 1008/2520 1.5 ±20 % 0.130 ±20% 2.40 1.50 1.70 CIG22E2R2MNE 1008/2520 2.2 ±20 % 0.150 ±20% 1.70 1.30 1.60 CIG22E3R3MNE 1008/2520 3.3 ±20 % 0.200 ±20% 1.10 1.10 1.30 CIG22E4R7MNE 1008/2520 4.7 ±20 % 0.265 ±20% 0.90 1.00 1.15 Part no. ＊1 ※Rated Current (A) : DC current value when Inductance drops to 30% of nominal Inductance value (ONLY REFERENCE) ※Rated Current (A)＊2: DC current value when the self-generation of heat rises to 40℃ (Reference ambient temperature:25℃) ※Operating temperature range: –40 to +125°C ( Including self-temperature rise) ※Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201307 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 22 (3) E (4) 1R0 (5) M (6) N (7) E (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (E:High Current Type) Inductance (1R0:1.0uH) (6) Tolerance (M:±20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000pcs Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.