CIGT201208EH1R0MNE

Metal Composite Power Inductor (Thin Film) Specification Sheet CIGT201208EH1R0MNE (2012 / EIA 0805) APPLICATION Smart phones, Tablet, Wearable devices, Power converter modules, etc. FEATURES RECOMMENDED LAND PATTERN Small power inductor for mobile devices Low DCR structure and high efficiency inductor for power circuits. Monolithic structure for high reliability Free of all RoHS-regulated substances Halogen free TYPE A B C Unit : mm 2012 0.8 0.8 1.3 DIMENSION TYPE 2012 Dimension [mm] W T L 2.0±0.2 1.25±0.2 0.8 max D 0.5±0.2 DESCRIPTION Part no. CIGT201208EH1R0MNE Size [inch/mm] Thickness [mm] (max) Inductance [uH] Inductance tolerance (%) 0805/2012 0.8 1.0 ±20 DC Resistance [mΩ] Rated DC Current (Isat) [A] Rated DC Current (Irms) [A] Max. Typ. Max. Typ. Max. Typ. 55 48 3.2 3.5 3.1 3.3 * Inductance : Measured with a LCR meter 4991A(Agilent) or equivalent (Test Freq. 1MHz, Level 0.1V) * DC Resistance : Measured with a Resistance HI-TESTER 3541(HIOKI) or equivalent * Maximum allowable DC current : Value defined when DC current flows and the initial value of inductance has decreased by 30% or when current flows and temperature has risen to 40℃ whichever is smaller. (Reference: ambient temperature is 25℃±10) (Isat) : Allowable current in DC saturation : The DC saturation allowable current value is specified when the decrease of the initial inductance value at 30% (Reference: ambient temperature is 25℃±10) (Irms) : Allowable current of temperature rise : The temperature rise allowable current value is specified when temperature of the inductor is raised 40℃ by DC current. (Reference: ambient temperature is 25℃±10) * Absolute maximum voltage : Absolute maximum voltage DC 20V. * Operating temperature range : -40 to +125°C (Including self-temperature rise) PRODUCT IDENTIFICATION CIG (1) T (2) 2012 (3) 08 (4) (1) Power Inductor (3) Dimension (2012: 2.0mm × 1.25mm ) (5) Remark (Characterization Code) (7) Toleranc (M:±20%) (8) Internal Code (9) Packaging (C:paper tape, E:embossed tape) EH (5) 1R0 (6) M (7) N (8) E (9) (2) Type (T: Metal Composite Thin Film Type) (4) Thicknes (08: 0.8mm) (6) Inductanc(1R0: 1.0 uH) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING IRON SOLDERING Temperature of Soldering Iron Tip Preheating Temperature Temperature Differential PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3000 pcs 280℃max. 150℃min. ΔT≤130℃ Soldering Time 3sec max. Wattage 50W max. Reliability Test Item Solderability Specified Value More than 90% of terminal electrode should be soldered newly. Test Condition After being dipped in flux for 4±1 seconds, and preheated at 150∼180℃ for 2∼3 min, the specimen shall be immersed in solder at 245±5℃ for 4±1 seconds. Resistance to Soldering After being dipped in flux for 4±1 seconds, and preheated at No mechanical damage. Remaining terminal Electrode: 75% min. 150∼180℃ for 2∼3 min, the specimen shall be immersed in Inductance change to be within ±20% to the initial. solder at 260±5℃ for 10 ±0.5 seconds. Thermal Shock (Temperature Cycle test) Repeat 100 cycles under the following conditions. No mechanical damage Inductance change to be within ±20% to the initial. -40±3℃ for 30 min → 85±3℃ for 30 min High Temp. Humidity Resistance Test 85±2℃, 85%RH, for 500±12 hours. No mechanical damage Measure the test items after leaving at normal temperature and Inductance change to be within ±20% to the initial humidity for 24 hours. Low Temperature Test Solder the sample on PCB. Exposure No mechanical damage at -55±2℃ for 500±12 hours. Inductance change to be within ±20% to the initial. Measure the test items after leaving at normal temperature and humidity for 24hours. High Temperature Test Solder the sample on PCB. Exposure at 125±2℃ for 500±12 No mechanical damage hours. Inductance change to be within ±20% to the initial. Measure the test items after leaving at normal temperature and humidity for 24hours. High Temp. Humidity Resistance Loading Test 85±2℃, 85%RH, Rated Current for 500±12 hours. No mechanical damage Measure the test items after leaving at normal temperature and Inductance change to be within ±20% to the initial humidity for 24 hours. High Temperature Loading Test 85±2℃, Rated Current for 500±12 hours. No mechanical damage Measure the test items after leaving at normal temperature and Inductance change to be within ±20% to the initial humidity for 24 hours. Reflow Test Vibration Test No mechanical damage Peak 260±5℃, 3 times Inductance change to be within ±20% to the initial Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm No mechanical damage amplitude for 2 hours in each of three(X,Y,Z) axis (total 6 Inductance change to be within ±20% to the initial. hours). No mechanical damage Bending Limit; 2mm Test Speed; 1.0mm/sec. Keep the test board at the limit point in 5 sec. PCB thickness : 1.6mm Bending Test No indication of peeling shall occur on the terminal electrode. W(kgf) TIME(sec) 0.5 10±1 Terminal Adhesion Test Drop Test Ipeak (AC+DC Load Life) No mechanical damage Random Free Fall test on concrete plate. Inductance change to be within ±20% to the initial. 1 meter, 10 drops 85±2℃, 85%RH, Load(Ipeak) for 120 hours. (Frequncy:1MHz, Load(Ipeak):1.5hr on / 0.5hr off) No mechanical damage Measure the test items after leaving at normal temperature and Inductance change to be within ±20% to the initial humidity for 24 hours. * Load(Ipeak) = Irms(max)×1.4 Metal Composite Power Inductor (Thin Film) Data Sheet 1. Model : CIGT201208EH1R0MNE 2. Description Part no. CIGT201208EH1R0MNE Size [inch/mm] Thickness [mm] (max) Inductance [uH] Inductance tolerance (%) 0805/2012 0.8 1.0 ±20 DC Resistance [mΩ] Rated DC Current (Isat) [A] Rated DC Current (Irms) [A] Max. Typ. Max. Typ. Max. Typ. 55 48 3.2 3.5 3.1 3.3 * Inductance : Measured with a LCR meter 4991A(Agilent) or equivalent (Test Freq. 1MHz, Level 0.1V) * DC Resistance : Measured with a Resistance HI-TESTER 3541(HIOKI) or equivalent * Maximum allowable DC current : Value defined when DC current flows and the initial value of inductance has decreased by 30% or when current flows and temperature has risen to 40℃ whichever is smaller. (Reference: ambient temperature is 25℃±10) (Isat) : Allowable current in DC saturation : The DC saturation allowable current value is specified when the decrease of the initial inductance value at 30% (Reference: ambient temperature is 25℃±10) (Irms) : Allowable current of temperature rise : The temperature rise allowable current value is specified when temperature of the inductor is raised 40℃ by DC current. (Reference: ambient temperature is 25℃±10) * Absolute maximum voltage : Absolute maximum voltage DC 20V. * Operating temperature range : -40 to +125°C (Including self-temperature rise) 3. Characteristics data 1) Frequency characteristics (Ls) 2) Frequency characteristics (Q) Agilent E4294A +E4991A , 1MHz to 1,000MHz Agilent E4294A +E4991A , 1MHz to 1,000MHz 45 2 40 1.5 30 0.5 Q Inductance [uH] 35 1 25 20 0 15 -0.5 10 -1 5 -1.5 0 1 10 100 1000 1 10 Frequency [MHz] Temperature rate of change [℃] Inductance [uH] 4)Temperature characteristics (Typ.) 1.00 0.95 0.90 0.85 0.80 0.75 0.70 0.65 0.60 0.55 0.50 1 1000 Frequency [MHz] 3) DC Bias characteristics (Typ.) 0 100 2 DC Current [A] 3 50 40 30 20 10 0 -10 0 1 2 DC Current[A] Any data in this sheet are subject to change, modify or discontinue without notice The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers 3