CIH03T56NJNC

Ver. 201308 Multilayer High Frequency inductor CIH03T Series (0603/ EIA 0201) APPLICATION Mobile communication systems, noise suppression at high frequency and Impedance matching. FEATURES RECOMMENDED LAND PATTERN
Lowest value of specific resistance, good property of Q and high SRF.
Possible to use at range above 100MHz
Monolithic structure for high reliability.
Do not contain lead and support lead-free soldering.
RoHS compliant 0.20~ 0.20~0.35mm 0.30mm 0.60~1.0mm DIMENSION Dimension [mm] Type 03 L W t d 0.6±0.03 0.3±0.03 0.3±0.03 DC resistance (Ω) Max. Rated current (mA) Max. 0.15± 0.05 DESCRIPTION Q (typical.) Inductance (nH)@100MHz Q (Min.) 100 MHz 500MHz 800MHz 1.8GHz 2.0GHz 2.4GHz SRF (MHz) Min CIH03T1N0□ 1.0±0.2nH,0.3nH 4 17 20 28 30 33 13000 0.14 300 CIH03T1N2□ 1.2±0.2nH,0.3nH 4 16 20 28 30 33 10000 0.14 250 CIH03T1N3□ 1.3±0.2nH,0.3nH 4 16 20 28 30 33 10000 0.14 250 CIH03T1N5□ 1.5±0.2nH,0.3nH 4 15 20 27 29 32 10000 0.18 230 CIH03T1N8□ 1.8±0.2nH,0.3nH 4 15 20 27 29 31 10000 0.19 200 CIH03T2N0□ 2.0±0.2nH,0.3nH 4 15 20 26 28 30 8800 0.22 200 CIH03T2N2□ 2.2±0.2nH,0.3nH 4 15 20 26 28 30 8800 0.22 200 CIH03T2N4□ 2.4±0.2nH,0.3nH 5 15 20 26 28 30 7500 0.25 200 CIH03T2N7□ 2.7±0.2nH,0.3nH 5 15 20 26 28 30 7700 0.25 200 CIH03T3N0□ 3.0±0.2nH,0.3nH 5 15 20 26 28 30 7200 0.27 200 CIH03T3N3□ 3.3±0.2nH,0.3nH 5 15 20 26 28 30 6700 0.3 200 CIH03T3N6□ 3.6±0.2nH,0.3nH 5 15 20 27 29 31 6000 0.3 200 CIH03T3N9□ 3.9±0.2nH,0.3nH 5 15 20 27 29 31 6000 0.3 200 CIH03T4N3□ 4.3±0.2nH,0.3nH 5 15 19 26 28 30 5600 0.35 200 CIH03T4N7□ 4.7±0.2nH,0.3nH 5 15 19 26 28 30 5300 0.4 200 CIH03T5N6□ 5.6±0.2nH,0.3nH 5 15 19 26 27 28 4600 0.4 200 CIH03T6N2□ 6.2±0.2nH,0.3nH 5 17 18 23 24 25 4100 0.48 150 CIH03T6N8□ 6.8±5% 5.5 14 18 23 24 25 4100 0.48 150 CIH03T7N5□ 7.5±5% 5 14 18 22 23 23 3700 0.51 150 CIH03T8N2□ 8.2±5% 5 14 18 22 23 23 3400 0.55 150 CIH03T10N□ 10.0±5% 5 14 17 22 22 21 3300 0.63 150 CIH03T12N□ 12.0±5% 6 14 17 21 21 19 3000 0.7 150 CIH03T15N□ 15.0±5% 6 13 16 19 18 14 2700 0.8 100 CIH03T18N□ 18.0±5% 6 13 17 16 14 9 2100 0.9 100 CIH03T22N□ 22.0±5% 5 13 15 14 11 5 1800 1.2 100 CIH03T24N□ 24.0±5% 5 13 15 12 9 3 1800 1.6 100 CIH03T27N□ 27.0±5% 4 12 14 10 7 2 1800 1.8 50 Part No. Ver. 201308 Inductance (nH)@100MHz Part No. Q (Min.) 100 MHz Q (typical.) 500MHz 800MHz 1.8GHz 2.0GHz 2.4GHz SRF (MHz) Min DC resistance (Ω) Max. Rated current (mA) Max. CIH03T33N□ 33.0±5% 4 12 14 8 5 1 1700 2.1 50 CIH03T39N□ 39.0±5% 4 12 13 4 1 - 1500 2.4 50 CIH03T47N□ 47.0±5% 4 11 12 2 - - 1300 2.8 50 CIH03T56N□ 56.0±5% 4 11 11 - - - 1100 3 50 50 CIH03T68N□ 68.0±5% 5 13 11 - - - 1050 3 CIH03T82N□ 82.0±5% 5 12 8 - - - 900 4 50 CIH03TR10□ 100.0±5% 5 11 - - - - 770 4.5 50 *Operating temperature range –55 to +125°C ※Tolerance (B :±0.1nH, C :±0.2nH, S :±0.3nH, H :±3%, J :±5%) ※Measurement equipment & Jig : Agilent E4991A+16196C or Equivalent ※ The Rated Current is either the DC value at witch the internal Ls value is decreased within 5% with the application of DC_Current, or the value of current at which the temperature of the element is increased within 20℃ (Reference ambient temperature:20℃) ※ Residual Inductance of short chip: 0.30nH PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) H (2) 03 (3) T (4) 10N (5) J (6) N (7) C (8) Chip Inductor (2) H:High frequency type Dimension (4) Material code(T:Dielectric material) Inductance(4N7:4.7nH, 10N:10nH, R10:100nH) (6) Tolerance(C:±0.2nH, S:±0.3nH, J:±5%, K:±10%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Card Board Taping 10,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.