CIM03U121NC

Ver 201305 Chip Bead For EMI Suppression CIM03 Series (0603/ EIA 0201) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN
The smallest beads suitable for surface mounting
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. 0.2~0.3mm 0.20~0.35mm 0.20~0.35mm 0.20~0.35mm DIMENSION Type 03 Dimension [mm] L W t d 0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIM 03N 300 0.3±0.03 30 0.70 150 CIM 03N 800 0.3±0.03 80 1.20 100 CIM 03U 800 0.3±0.03 80 0.40 200 CIM 03U 121 0.3±0.03 120 0.50 200 CIM 03U 241 0.3±0.03 240 0.75 200 CIM 03U 471 0.3±0.03 470 1.30 100 CIM 03U 601 0.3±0.03 600 1.50 100 CIM 03J 121 0.3±0.03 120 0.50 200 CIM 03J 241 0.3±0.03 240 1.00 100 Part no. *Operating temperature range –55 to +125°C ※Measurement equipment & Jig - Impedance Measuring equipment & Jig : Agilent E4991A + 16197A Bottom Electrode SMD Test Fixture or Equivalent - Resistance Measuring equipment & Jig : Agilent 4338A + 16089A Large Kelvin Clip Leads or Equivalent Ver 201305 CHARACTERISTIC DATA Ver 201305 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (6) (7) M (2) 03 (3) U (4) 121 (5) N (6) C (7) Chip Beads (2) M: Multi-layer type B:Mono-layer type Dimension (4) Material Code Nominal impedance (100:10Ω, 121:120Ω ) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Card Board Taping 10,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.