CIM05U221NC

Ver 201305 Chip Bead For EMI Suppression CIB/CIM05 Series (1005/ EIA 0402) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.45~0.55mm
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. 0.45~0.55mm 0.40~0.50mm 0.40~0.50mm DIMENSION Type 05 Dimension [mm] L W t d 1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.1 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIB05J100 0.5±0.05 10 0.05 1200 CIM05U100 0.5±0.05 10 0.05 1200 CIM05U300 0.5±0.05 30 0.10 700 CIM05U600 0.5±0.05 60 0.15 600 CIM05U800 0.5±0.05 80 0.20 600 CIM05U121 0.5±0.05 120 0.25 600 CIM05U221 0.5±0.05 220 0.35 500 CIM05U241 0.5±0.05 240 0.35 400 CIM05U301 0.5±0.05 300 0.45 400 CIM05U471 0.5±0.05 470 0.55 300 CIM05U601 0.5±0.05 600 0.60 300 CIM05U102 0.5±0.05 1000 0.80 300 CIM05J300 0.5±0.05 30 0.20 700 CIM05J600 0.5±0.05 60 0.20 650 CIM05J800 0.5±0.05 80 0.25 600 CIM05J121 0.5±0.05 120 0.25 500 CIM05J221 0.5±0.05 220 0.35 400 CIM05J241 0.5±0.05 240 0.35 400 CIM05J301 0.5±0.05 300 0.45 400 CIM05J471 0.5±0.05 470 0.55 300 CIM05J601 0.5±0.05 600 0.60 300 Part no. Ver 201305 Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIM05J102 0.5±0.05 1000 0.80 250 CIM05J152 0.5±0.05 1500 1.00 250 1800 1.40 200 Part no. CIM05J182 0.5±0.05 CIM05N750 0.5±0.05 75 0.35 300 CIM05N121 0.5±0.05 120 0.55 300 CIM05N221 0.5±0.05 220 0.80 200 CIM05F050 0.5±0.05 5 0.08 500 CIM05F100 0.5±0.05 10 0.10 300 CIM05F220 0.5±0.05 22 0.20 300 CIM05F470 0.5±0.05 47 0.35 300 CIM05F750 0.5±0.05 75 0.40 300 CIM05F121 0.5±0.05 120 0.55 300 CIM05F221 0.5±0.05 220 0.80 200 CIM05H800 0.5±0.05 80 0.20 450 CIM05H121 0.5±0.05 120 0.25 400 CIM05H601 0.5±0.05 600 0.80 200 CHARACTERISTIC DATA Ver 201305 Ver 201305 Ver 201305 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (6) (7) M (2) 05 (3) U (4) 121 (5) N (6) C (7) Chip Beads (2) M: Multi-layer type B:Mono-layer type Dimension (4) Material Code Nominal impedance (100:10Ω, 121:120Ω ) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 10,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.