CIM21J252NE

Ver 201305 Chip Bead For EMI Suppression CIB/CIM21 Series (2012/ EIA 0805) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN 0.8~1.2mm
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. 0.9~1.6mm 0.6~1.2mm 0.6~1.2mm DIMENSION Type 21 Dimension [mm] L W t d 2.0±0.2 1.25±0.2 0.9±0.2 0.5+0.2 -0.3 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIB21P110 0.9±0.2 11 0.01 2000 CIB21P150 0.9±0.2 15 0.01 2000 CIB21P260 0.9±0.2 26 0.01 2000 CIB21P300 0.9±0.2 30 0.05 2000 CIB21P330 0.9±0.2 33 0.05 1500 CIB21P470 0.9±0.2 47 0.05 1500 CIM21U600 0.9±0.2 60 0.08 900 CIM21U800 0.9±0.2 80 0.10 900 CIM21U101 0.9±0.2 100 0.10 800 CIM21U121 0.9±0.2 120 0.10 800 CIM21U151 0.9±0.2 150 0.15 600 CIM21U241 0.9±0.2 240 0.15 600 CIM21U301 0.9±0.2 300 0.15 500 CIM21U471 0.9±0.2 470 0.30 500 CIM21U601 0.9±0.2 600 0.30 500 CIM21U102 0.9±0.2 1000(at 70MHz) 0.40 500 CIM21U202 0.9±0.2 2000(at 70MHz) 0.70 300 Part no. Ver 201305 Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIB21J260 0.9±0.2 26 0.05 2000 CIB21J300 0.9±0.2 30 0.05 2000 CIB21J400 0.9±0.2 40 0.05 2000 CIM21J600 0.9±0.2 60 0.08 900 CIM21J800 0.9±0.2 80 0.08 1000 CIM21J121 0.9±0.2 120 0.15 800 CIM21J151 0.9±0.2 150 0.15 500 CIM21J221 0.9±0.2 220 0.20 500 CIM21J241 0.9±0.2 240 0.20 500 CIM21J301 0.9±0.2 300 0.20 500 CIM21J471 0.9±0.2 470 0.25 500 CIM21J601 0.9±0.2 600 0.25 500 CIM21J751 0.9±0.2 750 0.35 400 CIM21J102 0.9±0.2 1000 0.35 500 CIM21J152 0.9±0.2 1500(at 70MHz) 0.45 500 CIM21J182 0.9±0.2 1800(at 70MHz) 0.45 500 Part no. CIM21J202 0.9±0.2 2000(at 70MHz) 0.50 500 CIM21J222 0.9±0.2 2200(at 70MHz) 0.70 300 CIM21J252 0.9±0.2 2500(at 50MHz) 0.70 300 CIM21K152 0.9±0.2 1500 0.45 300 CIM21K252 0.9±0.2 2500 0.80 250 CIM21N560 0.9±0.2 56 0.20 600 CIM21N700 0.9±0.2 70 0.20 600 CIM21N121 0.9±0.2 120 0.25 500 CIM21N241 0.9±0.2 240 0.30 400 CHARACTERISTIC DATA Ver 201305 Ver 201305 Ver 201305 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (6) (7) M (2) 21 (3) U (4) 121 (5) N (6) E (7) Chip Beads (2) M: Multi-layer type B:Mono-layer type Dimension (4) Material Code Nominal impedance (800:80Ω, 121:120Ω ) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) Ver 201305 RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 4,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.