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CIS10P331NC

CIS10P331NC

  • 厂商:

    SAMSUNG(三星)

  • 封装:

    0603

  • 描述:

    FERRITE BEAD 3A 0603

  • 数据手册
  • 价格&库存
CIS10P331NC 数据手册
Ver 201207 Chip Bead For EMI Suppression CIS10P Series (1608/ EIA 0603) APPLICATION Noise Suppression in power line FEATURES RECOMMENDED LAND PATTERN 0.6~0.8mm Smallest beads used in high current.  CIS series is used for high current. (~ 6A) 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm DIMENSION Type 10 Dimension [mm] L W t d 1.6 ±0.15 0.8 ±0.15 0.6±0.15, 0.3 ±0.2 0.8±0.15 DESCRIPTION Thickness Impedance DC Resistance Rated Current (mm) (Ω)±25%@100MHz (Ω) Max. (mA) Max. CIS10P260AC 0.6±0.15 26 0.007 6000 CIS10P300AC 0.6±0.15 30 0.01 6000 CIS10P700AC 0.6±0.15 70 0.02 4000 CIS10P101AC 0.6±0.15 100 0.03 3000 CIS10P121AC 0.6±0.15 120 0.03 3000 CIS10P181AC 0.6±0.15 180 0.04 2500 CIS10P221NC 0.8±0.15 220 0.05 2500 CIS10P301NC 0.8±0.15 300 0.07 2000 CIS10P331NC 0.8±0.15 330 0.07 1700 CIS10P391NC 0.8±0.15 390 0.10 1200 CIS10P471NC 0.8±0.15 470 0.13 1500 CIS10P601NC 0.8±0.15 600 0.15 1300 Part No. Ver 201207 CHARACTERISTIC DATA Ver 201207 PRODUCT IDENTIFICATION CI (1) S (2) 10 (3) P (4) 300 (5) A (6) C (7) (1) Chip Beads (2) Ultra high current (~6A) (3) Dimension (4) Material Code (5) Nominal impedance (300:30Ω, 121:120Ω ) (6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) (7) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 ■ NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.
CIS10P331NC 价格&库存

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