CIV05U102NC

201306 Chip Bead For GHz noise suppression CIV05 Series (1005/ EIA 0402) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES RECOMMENDED LAND PATTERN
CIV Series have high impedance in a GHz band and suppress GHz noise which is usually made due to high frequency of the electronic appliances, high speed and mass storage of the data.
Excellent solderability and high heat resistance for either flow or reflow soldering
Monolithic inorganic material construction for high reliability 0.45~0.55mm 0.45~0.55mm 0.40~0.50mm 0.40~0.50mm DIMENSION Type 05 Dimension [mm] L W t d 1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.1 DESCRIPTION Impedance Impedance DC Resistance Rated Current (Ω)±25%@100MHz (Ω)±40%@1GHz (Ω) Max. (mA) Max. CIV05U601 600 1000 0.7 300 CIV05U102 1000 1400 1.1 250 CIV05J102 1000 2000 1.25 250 CIV05J182 1800 2700 2.20 200 Part no. Ver 201306 CHARACTERISTIC DATA PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (6) (7) V (2) 05 (3) U (4) 102 (5) N (6) C (7) Chip Beads (2) Multi-layer type for GHz Noies suppression Dimension (4) Material Code Nominal impedance (601:600Ω, 102:1000Ω ) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) Ver 201306 RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Card Board Taping Quantity(pcs/reel) 4000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.