CL03C010CA3GNNH

SPECIFICATION (Reference sheet) · Supplier : Samsung electro-mechanics · Samsung P/N : CL03C010CA3GNNH · Product : Multi-layer Ceramic Capacitor · Description : CAP, 1㎊, 25V, ± 0.25㎊, C0G, 0201 A. Samsung Part Number CL 03 C 010 C A 3 G N N H ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor ① Series 0201 ② Size ⑤ Capacitance W: 0.30 ± 0.03 mm ⑧ Inner electrode Cu 1㎊ ± 0.25 ㎊ Termination Cu Plating Sn 100% tolerance 25 V ⑥ Rated Voltage ⑦ Thickness L: 0.60 ± 0.03 mm C0G ③ Dielectric ④ Capacitance (inch code) 0.30 ± 0.03 mm ⑨ Product Normal ⑩ Special Reserved for future use ⑪ Packaging Cardboard Type, 7" reel B. Structure and dimension Samsung P/N (Lead Free) CL03C010CA3GNNH (Pb Free) Dimension(㎜) L W T BW 0.60 ± 0.03 0.30 ± 0.03 0.30 ± 0.03 0.15 ± 0.05 C. Samsung Reliability Test and Judgement condition Performance 1㎒±10% 0.5~5Vrms Rated Voltage 60~120 sec. Resistance 10,000Mohm or 500Mohm×㎌ Whichever is smaller Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Microscope (´10) 300% of the rated voltage Voltage mechanical breakdown Temperature C0G Characteristics Adhesive Strength (From -55℃ to 125℃, Capacitance change should be within ±30PPM/℃) No peeling shall be occur on the 500g×F, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Bending to the limit (1mm) with 1.0mm/sec. Solderability within ±5% or ±0.5㎊ whichever is larger More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. Capacitance Within specified tolerance Test condition 420 min Q Insulation (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Vibration Test Capacitance change : Amplitude : 1.5mm within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.) 2hours ´ 3 direction (x, y, z) Moisture Capacitance change : With rated voltage Resistance within ±7.5% or ±0.75㎊ whichever is larger Q: 103.33 min 40±2℃, 90~95%RH, 500+12/-0hrs IR : Solder pot : 270±5℃, 10±1sec. 500Mohm or 25Mohm × ㎌ Whichever is smaller 200% High Temperature Capacitance change : With Resistance within ±3% or ±0.3㎊ whichever is larger Q: 210 min Max. operating temperature IR : of the rated voltage 1000+48/-0hrs 1,000Mohm or 50Mohm × ㎌ Whichever is smaller Temperature Capacitance change : 1 cycle condition Cycling within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Min. operating temperature 25℃ → 25℃ → Max. operating temperature → 5 cycle test ※ The reliability test condition can be replaced by the corresponding accelerated test condition. D. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) Product specifications included in the specifications are effective as of March 1, 2013. Please be advised that they are standard product specifications for reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers.