CL03C1R6CA3GNNH

SPECIFICATION (Reference sheet)  Supplier : Samsung electro-mechanics  Samsung P/N : CL03C1R6CA3GNNH  Product : Multi-layer Ceramic Capacitor  Description : CAP, 1.6㎊, 25V, ±0.25㎊, C0G, 0201 A. Samsung Part Number CL 03 C 1R6 C A 3 G N N H ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor ① Series 0201 ② Size ③ Dielectric ④ Capacitance ⑤ Capacitance (inch code) mm W: 0.30 ± 0.03 mm C0G ⑧ Inner electrode Cu 1.6 ㎊ ±0.25 ㎊ Termination Cu Plating Sn 100% tolerance 25 V ⑥ Rated Voltage ⑦ Thickness L: 0.60 ± 0.03 0.30 ± 0.03 mm Normal ⑩ Special Reserved for future use ⑪ Packaging Cardboard Type, 7" reel B. Structure and dimension Samsung P/N (Lead Free) CL03C1R6CA3GNNH (Pb Free) ⑨ Product Dimension(㎜) L W T BW 0.60±0.03 0.30±0.03 0.30±0.03 0.15±0.05 C. Samsung Reliability Test and Judgement condition Performance Capacitance Within specified tolerance Test condition 1㎒±10% 0.5~5Vrms 10,000Mohm or 500Mohm㎌ Whichever is smaller Rated Voltage 60~120 sec. Microscope (10) 300% of the rated voltage 432 min Q Insulation Resistance Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Voltage mechanical breakdown Temperature C0G Characteristics Adhesive Strength (From -55℃ to 125℃, Capacitance change should be within ±30PPM/℃) No peeling shall be occur on the 200gF, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Bending to the limit (1mm) with 1.0mm/sec. Solderability within ±5% or ±0.5㎊ whichever is larger More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat within ±2.5% or ±0.25㎊ whichever is larger Vibration Test Tan δ, IR : initial spec. Capacitance change : Moisture within ±2.5% or ±0.25㎊ whichever is larger From 10㎐ to 55㎐ (return : 1min.) Tan δ, IR : initial spec. 2hours  3 direction (x, y, z) Capacitance change : With rated voltage Resistance Solder pot : 270±5℃, 10±1sec. Amplitude : 1.5mm within ±7.5% or ±0.75㎊ whichever is larger 40±2℃, 90~95%RH, 500+12/-0hrs Q: 105.33 min IR : 500Mohm or 25Mohm  ㎌ Whichever is smaller 200% High Temperature Capacitance change : With Resistance within ±3% or ±0.3㎊ whichever is larger Q: 216 min Max. operating temperature IR : of the rated voltage 1000+48/-0hrs 1,000Mohm or 50Mohm  ㎌ Whichever is smaller Temperature Capacitance change : 1 cycle condition Cycling within ±2.5% or ±0.25㎊ whichever is larger Min. operating temperature → Tan δ, IR : initial spec. Max. operating temperature → → 5 cycle test ※ The reliability test condition can be replaced by the corresponding accelerated test condition. D. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) Product specifications included in the specifications are effective as of March 1, 2013. Please be advised that they are standard product specifications for reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers. 25℃ 25℃