CL03C4R3CA3GNNH

SPECIFICATION  Supplier : Samsung electro-mechanics  Samsung P/N : CL03C4R3CA3GNNH  Product : Multi-layer Ceramic Capacitor  Description : CAP, 4.3㎊, 25V, ±0.25㎊, C0G, 0201 A. Samsung Part Number ① Series 0201 ③ Dielectric C0G ⑤ Capacitance 03 C 4R3 C A 3 G N N H ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor ② Size ④ Capacitance CL (inch code) L: 0.6 ± 0.03 4.3 ㎊ ±0.25 ㎊ tolerance ⑥ Rated Voltage 25 V ⑦ Thickness 0.3 ± 0.03 mm mm 0.3 ± 0.03 mm W: ⑧ Inner electrode Cu Termination Cu Plating Sn 100% (Pb Free) ⑨ Product Normal ⑩ Special Reserved for future use ⑪ Packaging Cardboard Type, 7" reel B. Samsung Reliablility Test and Judgement condition Performance Within specified tolerance Test condition 1㎒±10% 0.5~5Vrms Rated Voltage 60~120 sec. Resistance 10,000Mohm or 500Mohm㎌ Whichever is Smaller Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Microscope (10) 300% of the rated voltage Voltage mechanical breakdown Temperature C0G Characterisitcs Adhesive Strength (From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃) No peeling shall be occur on the 200gF, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Bending to the limit (1mm) with 1.0mm/sec. Solderability within ±5% or ±0.5㎊ whichever is larger More than 75% of terminal surface Capacitance 486 min Q Insulation is to be soldered newly 1) Sn63Pb37 solder 235±5℃, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Solder pot : 270±5℃, 10±1sec. Performance Test condition Vibration Test Capacitance change : Humidity within ±2.5% or ±0.25㎊ whichever is larger From 10㎐ to 55㎐ (return : 1min.) Tan δ, IR : initial spec. 2hours  3 direction (x, y, z) Capacitance change : 40±2℃, 90~95%RH, 500+12/-0hrs Amplitude : 1.5mm within ±5% or ±0.5㎊ whichever is larger Q: 243 min IR : 1000Mohm or 50Mohm  ㎌ Whichever is Smaller Moisture Capacitance change : Resistance within ±7.5% or ±0.75㎊ whichever is larger 40±2℃, 90~95%RH, 500+12/-0hrs Q: 114.33 min IR : With rated voltage 500Mohm or 25Mohm  ㎌ Whichever is Smaller High Temperature Capacitance change : With 200% Resistance within ±3% or ±0.3㎊ whichever is larger Q: 243 min Max. operating temperature IR : of the rated voltage 1000+48/-0hrs 1000Mohm or 50Mohm  ㎌ Whichever is Smaller Temperature Capacitance change : 1 cycle condition Cycling within ±2.5% or ±0.25㎊ whichever is larger Min. operating temperature→ 25℃ Tan δ, IR : initial spec. → Max. operating temperature → 25℃ 5 cycle test C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) * For the more detail Specification, Please refer to the Samsung MLCC catalogue.