CL05B222KB8NNNC

Multilayer Ceramic Capacitor Multilayer Ceramic Capacitor ■ INTRODUCTION MLCC(Multilayer Ceramic Capacitor) is SMD(Surface Mounted Device) type capacitor that is used in wide ranges of capacitance. MLCC is paid more attentions than other capacitors due to the better frequency characteristics, higher reliability, higher withstanding voltage and so on. MLCC is made of many layers of ceramic and inner electrodes like sandwich. Pd was used for inner electrodes. But the price of Pd was skyrocketed and Pd was replaced by the BME(Base Metal Electrode), which reduced the total cost of MLCC. This inner electrode is connected to outer termination for surface mounting, which is composed of three layers, Cu or Ag layer, Ni plating layer, and SnPb or Sn plating layer. Most of MLCCs become Pb free by the environmental issue at present. MLCC is divided into two classes. Class I(C0G, etc) is the temperature compensating type. It has a small TCC(Temperature Coefficient of Capacitance) and a better frequency performance. Therefore, it is used in RF applications such as cellular phone, tuner, and so on. Class II(X7R, X5R, Y5V, etc) is the high dielectric constant type, which is used in general electronic circuit. Especially high capacitance MLCC is replacing other capacitors (Tantalum and Aluminum capacitor) due to the low ESR(Equivalent Series Resistance) value. ■ FEATURE AND APPLICATION ● Feature - Miniature Size - Wide Capacitance and Voltage Range - Highly Reliable Performance - Tape & Reel for Surface Mount Assembly - Low ESR - High Q at High Frequencies - Stable Temperature Dependence of Capacitance ● Application - High Frequency Circuit(Tuner, VCO, PAM etc) - General Power Supply Circuit(SMPS etc) - DC-DC Converter - General Electronic Circuit -1- Multilayer Ceramic Capacitor ■ STRUCTURE -2- Multilayer Ceramic Capacitor ■ APPEARANCE AND DIMENSION L T W BW CODE DIMENSION ( mm ) EIA CODE L W T (MAX) BW 03 0201 0.6 ± 0.03 0.3 ± 0.03 0.3 ± 0.03 0.15±0.05 05 0402 1.0 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 0.2+0.15/-0.1 10 0603 1.6 ± 0.1 0.8 ± 0.1 0.8 ± 0.1 0.3 ± 0.2 21 0805 2.0 ± 0.1 1.25 ± 0.1 1.25± 0.1 0.5+0.2/-0.3 31 1206 3.2 ± 0.2 1.6 ± 0.2 1.6 ± 0.2 0.5+0.2/-0.3 32 1210 3.2 ± 0.3 2.5 ± 0.2 2.5 ± 0.2 0.6 ± 0.3 43 1812 4.5 ± 0.4 3.2 ± 0.3 3.2 ± 0.3 0.8 ± 0.3 55 2220 5.7 ± 0.4 5.0 ± 0.4 3.2 ± 0.3 1.0 ± 0.3 -3- Multilayer Ceramic Capacitor ■ PREVIOUS PART NUMBERING CL 1 ● 10 2 ● C 3 ● 101 4 ● J 5 ● B 6 ● N 7 ● C 8 ● 1 SAMSUNG Multilayer Ceramic Capacitor ● 2 Type(Size) ● 3 Capacitance Temperature Characteristics ● 4 Nominal Capacitance ● 5 Capacitance Tolerance ● 6 Rated Voltage ● 7 Thickness Option ● 8 Packaging Type ● 3 CAPACITANCE TEMPERATURE CHARACTERISTICS ● ▶ CLASS Ⅰ(Temperature Compensation) Symbol EIA Code Temperature Coefficient(PPM/℃) ※ Temperature C C0G(CH) 0 ± 30 CΔ P P2H -150 ± 60 PΔ R R2H -220 ± 60 RΔ S S2H -330 ± 60 SΔ T T2H -470 ± 60 TΔ U U2J -750 ± 120 UΔ L S2L +350 ~ -1000 SL Characteristics ※ Temperature Characteristics Temperature below 2.0pF 2.2 ~ 3.9pF above 4.0pF Characteristics Operation Temperature Range -55 ~ +125℃ above 10pF CΔ C0G C0G C0G C0G PΔ - P2J P2H P2H RΔ - R2J R2H R2H ☞ K : ±250 PPM/℃ SΔ - S2J S2H S2H J : ±120 PPM/℃ TΔ - T2J T2H T2H H : ±60 PPM/℃ UΔ - U2J U2J U2J G : ±30 PPM/℃ ▶ CLASS Ⅱ(High Dielectric Constant) Symbol EIA Code Capacitance Change (ΔC : %) Operation Temperature Range A X5R ± 15 -55 ~ +85℃ B X7R ± 15 -55 ~ +125℃ F Y5V +22 ~ -82 -30 ~ +85℃ -4- Multilayer Ceramic Capacitor 4 NOMINAL CAPACITANCE ● The nominal capacitance value is expressed in pico-Farad(pF) and identified by threedigit number, first two digits represent significant figures and last digit specifies the number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal point and the last digit becomes significant. example) 100 : 10 × 10o = 10pF 102 : 10 × 102 = 1000pF 020 : 2 × 10o = 2pF 1R5 : 1.5pF 5 CAPACITANCE TOLERANCE ● Temperature Characteristics Symbol Tolerance Applicable Capacitance & Range B ± 0.1pF C ± 0.25pF C0G(NPO) D ± 0.5pF or F ± 1pF T.C Series G ± 2% J ± 5% K ± 10% J ± 5% K ± 10% M ± 20% Z -20% ~ +80% A(X5R) B(X7R) F(Y5V) 0.5 ~ 3pF 0.5 ~ 10pF 6 ~ 10pF E-24 Series for over 10pF E-12 Series E-6 Series ※ Please consult us for special tolerances. 6 RATED VOLTAGE ● Symbol Rated Voltage(Vdc) Symbol Rated Voltage(Vdc) Q 6.3V D 200V P 10V G 500V O 16V I 1000V A 25V J 2000V B 50V K 3000V C 100V -5- Multilayer Ceramic Capacitor 7 THICKNESS OPTION ● Symbol Description of the Code N Standard thickness (please refer to standard thickness table on next page) A Thinner than standard thickness B Thicker than standard thickness C Standard Thickness High Q ( Low ` D.F ` ) D Sn-100% (High-Q) E Sn-100% (General) ※ Please Consult us for other termination type. 8 PACKAGING TYPE ● Symbol Packaging Symbol Packaging B Bulk F Embossed Tape, 13" Reel P Cassette L Paper 13" Reel C Paper Tape, 7" Reel O Paper 10" Reel D Paper Tape, 13" Reel S Embossed Tape, 10" Reel E Embossed Tape, 7" Reel ▶ STANDARD CAPACITANCE STEP Series Capacitance Step 1.0 E- 3 1.0 E- 6 E-12 E-24 2.2 1.5 4.7 2.2 3.3 4.7 6.8 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1 ※ Standard Capacitance is " Each step ×10n " -6- Multilayer Ceramic Capacitor ■ NEW PART NUMBERING CL 1 ● 10 2 ● C 3 ● 101 4 ● J 5 ● B 6 ● 8 7 ● N 8 ● N 9 ● N 10 ● C 11 ● 1 SAMSUNG Multilayer Ceramic Capacitor ● 2 Size(mm) ● 3 Capacitance Temperature Characteristic ● 4 Nominal Capacitance ● 5 Capacitance Tolerance ● 6 Rated Voltage ● 7 Thickness Option ● 8 Product & Plating Method ● 9 Samsung Control Code ● 10 Reserved For Future Use ● 11 Packaging Type ● 1 PRODUCT ABBREVIATION ● Symbol Product Abbreviation CL SAMSUNG Multilayer Ceramic Capacitor 2 SIZE(mm) ● Symbol Size(mm) Length Width 03 0.6 0.3 05 1.0 0.5 10 1.6 0.8 21 2.0 1.2 31 3.2 1.6 32 3.2 2.5 43 4.5 3.2 55 5.7 5.0 -7- Multilayer Ceramic Capacitor 3 CAPACITANCE TEMPERATURE CHARACTERISTIC ● Symbol Temperature Temperature Characteristics Range C COG C△ 0±30(ppm/℃) P P2H P△ -150±60 R R2H R△ -220±60 S2H S△ -330±60 T T2H T△ -470±60 U U2J U△ -750±60 L S2L S△ +350 ~ -1000 A X5R X5R ±15% -55 ~ +85℃ X7R X7R ±15% -55 ~ +125℃ Y5V Y5V +22 ~ -82% -30 ~ +85℃ Class Ⅰ S Class Ⅱ B F -55 ~ +125℃ ※ Temperature Characteristic Temperature Characteristics Below 2.0pF 2.2 ~ 3.9pF Above 4.0pF Above 10pF CΔ C0G C0G C0G C0G PΔ - P2J P2H P2H RΔ - R2J R2H R2H SΔ - S2J S2H S2H TΔ - T2J T2H T2H UΔ - U2J U2J U2J J : ±120PPM/℃, H : ±60PPM/℃, G : ±30PPM/℃ 4 NOMINAL CAPACITANCE ● Nominal capacitance is identified by 3 digits. The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. 'R' identifies a decimal point. ● Example Symbol Nominal Capacitance 1R5 1.5pF 103 10,000pF, 10nF, 0.01μF 104 100,000pF, 100nF, 0.1μF -8- Multilayer Ceramic Capacitor 5 CAPACITANCE TOLERANCE ● Symbol Tolerance A ±0.05pF B ±0.1pF C ±0.25pF D ±0.5pF F ±1pF F ±1% G ±2% J ±5% K ±10% M ±20% Z +80, -20% Nominal Capacitance Less than 10pF (Including 10pF) More than 10pF 6 RATED VOLTAGE ● Symbol Rated Voltage Symbol Rated Voltage Q 6.3V E 250V P 10V G 500V O 16V H 630V A 25V I 1,000V B 50V J 2,000V C 100V K 3,000V D 200V -9- Multilayer Ceramic Capacitor 7 THICKNESS OPTION ● Type Symbol Thickness(T) Spec 0603 3 0.30 ±0.03 1005 5 0.50 ±0.05 1608 8 0.80 ±0.10 A 0.65 C 0.85 F 1.25 ±0.10 C 0.85 ±0.15 F 1.25 ±0.15 H 1.6 ±0.20 F 1.25 H 1.6 ±0.10 2012 3216 ±0.20 3225 I 2.0 J 2.5 F 1.25 H 1.6 ±0.20 4532 I 2.0 J 2.5 L 3.2 F 1.25 H 1.6 I 2.0 J 2.5 L 3.2 ±0.30 ±0.20 5750 ±0.30 - 10 - Multilayer Ceramic Capacitor 8 PRODUCT & PLATING METHOD ● Symbol Electrode Termination Plating Type A Pd Ag Sn_100% N Ni Cu Sn_100% G Cu Cu Sn_100% 9 SAMSUNG CONTROL CODE ● Symbol Description of the code Symbol Description of the code A Array (2-element) N Normal B Array (4-element) P Automotive C High - Q W 3 Terminal EMI Filter L LICC 10 RESERVED FOR FUTURE USE ● Symbol Description of the code N Reserved for future use 11 PACKAGING TYPE ● Symbol Packaging Type Symbol Packaging Type B Bulk F Embossing 13" (10,000EA) P Bulk Case L Paper 13" (15,000EA) C Paper 7" O Paper 10" D Paper 13" (10,000EA) S Embossing 10" E Embossing 7" - 11 - Multilayer Ceramic Capacitor ▶ CAPACITANCE vs CHIP THICKNESS STANDARD Description Dimension (mm) 0603 1005 1608 (0201) (0402) (0603) 2012 Type (0805) 3216 Type (1206) 3225 Type (1210) 4532 Type (1812) 5750 Type (2220) L 0.6 ±0.03 1.0 ±0.05 1.6 ±0.1 2.0±0.1 3.2±0.15 3.2 ±0.2 3.2±0.3 4.5±0.4 5.7±0.4 W 0.3 ±0.03 0.5 ±0.05 0.8 ±0.1 1.25±0.1 1.6±0.15 1.6 ±0.2 2.5±0.2 3.2±0.3 5.0±0.4 T 0.3 ±0.03 0.5~ ±0.05 0.8 ±0.1 0.85 ±0.1 1.25 0.85 1.25 1.6 ±0.1 ±0.15 ±0.15 ±0.2 - 0.5~ 240 0.5 ~ 0.5 1100 ~ 1600~ 0.5 ~ 3000~ 6200~ 1000 ~1000 1500 2700 2700 5600 8200 - 0.5~ 47 0.5~ 220 0.5 ~ 1000 - - 0.5 ~ 180 0.5 ~ 1000 6.3V 10 220 2200 - - 10000 - - 10000 - - - 22000 - - - 47000 - - 47000 10V 10 100 1000 - - 2200 - - 4700~ 10000 - - - 22000 - - - - - - 47000 16V - 47 330~ 470 - - 1000 - - 4700 - - - 6800~ 10000 - - - - - - - 25V - - - - - - - - - - - - - - - - - - - - 50V - 6.8~ 10 - - - - - - - - - - - - - - - - - - 6.3V 0.1~ 10 47~ 100 470~ 1000 - - 1000 - - 6800~ 10000 - - - 22000 - - - - - - - 10V 0.1~ 10 33~ 100 220~ 470 220~ 270 330~ 470 560~ 1000 - 1000~ 4700 1500~ 3300 3900~ 3300 2200 4700 - - - - 22000 - - - 16V 0.1~ 1 10~ 33 100~ 220 68~ 200 220~ 330 390~ 1000 330~ 1000~ 2200~ 1500~ 3300 3900~ 680 1500 3300 2200 4700 - - - 2200 - - - - 25V - 4.7~ 10 47~ 100 39~ 68 82~ 100 150~ 470 100~ 470~ 330 620 680~ 1000 680~ 1800 1500 2200 - - - 1000 - - - 10000 50V - 0.22~ 4.7 0.22~ 100 0.22~ 39 47~ 100 220 1~ 150 220 390~ 1000 2.2~ 680 820~ 1000 - - 10~ 1000 - - - - - 3300~ 4700 6.3V 10~ 100 - 2200 - - 10000 - - - - - 47000 - - - - - - - - 10V - 220~ 330 100~ 1000 - - 4700 - - - - 22000 - - - - - - 100000 16V - 10~ 220 100~ 1000 10~ 680 820~ 1200~ 1000~ 2700~ 10000 3300~ 10000 15000 1000 2200 2200 4700 6800 - - - 22000 - - - - 25V - 10~ 33 22~ 330 10~ 220 270~ 470 560~ 1000 470~ 1200~ 2700~ 1000~ 4700~ 1000 2200 3300 3300 10000 - - - - - 10000 - - - 50V - 2.2~ 10 2.2~ 100 2.2~ 68 82~ 150 180~ 1000 10~ 470 - - - - - 10000 - - - - - 3300~ 1500~ 3900~ 7500~ 8200 3600 6800 10000 1.25 1.6 ±0.2 ±0.2 2.0 ±0.2 2.5 ±0.2 1.25 ±0.2 1.6 ±0.2 2.0 ±0.2 2.5 ±0.2 1.6 2.0 ±0.2 ±0.2 2.5 ±0.2 - - - - - - - - - - - - - - 100000 - - - - - ( SL 50V C A R AP NA 25V GC EI T C, TC p A (Except F N SL,UJ) C 50V E 0.65 ±0.1 ) A (X5R) C A P A C I T A N C E R A N G E B (X7R) ( - 560~ 11000 24000~ ~ 10000 22000 47000 - 1000~ 15000~ 24000~ 62000~ 43000 93000 130000 13000 22000 47000 68000 ) n F 0.5 ~ 620~ 1100~ 0.5 ~ 2400~ 560 1000 3300 2200 4700 F (Y5V) 4700 10000~ 22000 560~ 1000 - 100~ 1000 - - 12 - Multilayer Ceramic Capacitor ■ PACKAGING ● CARDBOARD PAPER TAPE Perforated square holes for inserting a chip Feeding round holes D E A F W B t P0 P2 P1 unit : mm Symbol Type W F E P1 03 D i m e n s i o n P2 P0 D 2.0 ±0.05 05 8.0 ±0.3 10 3.5 ±0.05 A B 0.37 ±0.03 0.38 ±0.03 0.68 ±0.03 0.6 ±0.05 1.75 ±0.1 2.0 ±0.05 Φ1.5 +0.1/-0 4.0 ±0.1 4.0 ±0.1 21 t 1.1 MAX 31 0.65 1.15 +0.05/-0.1 +0.05/-0.1 1.1 ±0.2 1.9 ±0.2 1.6 ±0.2 2.4 ±0.2 2.0 ±0.2 3.6 ±0.2 ● EMBOSSED PLASTIC TAPE Perforated square holes for inserting a chip Feeding round holes D E A F W B t1 P0 t0 P2 P1 unit : mm Symbol Type D i m e n s i o n A B 21 1.45 ±0.2 2.3 ±0.2 31 2.0 ±0.2 3.6 ±0.2 2.9 ±0.2 3.6 ±0.2 43 3.6 ±0.2 4.9 ±0.2 55 5.4 ±0.2 6.0 ±0.2 32 W 8.0 ±0.3 F 3.5 ±0.05 E 1.75 ±0.1 P1 4.0 ±0.1 P2 2.0 ±0.05 P0 4.0 ±0.1 D Φ1.5 +0.1/-0 t0 0.6 max t1 2.5 max - 13 - Multilayer Ceramic Capacitor ● TAPING SIZE Empty Section Empty Section Packed Part 45 Pitch Loading Section 50 Pitch 35 Pitch END START unit : pcs Symbol Cardboard Paper Tape Embossed Plastic Tape 7" Reel 4000 2000 13" Reel 15000 - ● REEL DIMENSION E C B R D W t A unit : mm Symbol A B 7" Reel φ178±2.0 min.φ50 φ330±2.0 min.φ70 13" Reel C D E W t R φ13±0.5 21±0.8 2.0±0.5 10±1.5 0.8±0.2 1.0 - 14 - Multilayer Ceramic Capacitor ● BULK CASE PACKAGING - Bulk case packaging can reduce the stock space and transportation costs. - The bulk feeding system can increase the productivity. - It can eliminate the components loss. A B T C D E F W G H L I Symbol A B T C D E Dimension 6.8±0.1 8.8±0.1 12±0.1 1.5+0.1/-0 2+0/-0.1 4.7±0.1 Symbol F W G H L I Dimension 31.5+0.2/-0 36+0/-0.2 19±0.35 7±0.35 110±0.7 5±0.35 ● QUANTITY Size 05(0402) 10(0603) Quantity 50,000 10,000~15,000* 21(0805) T≤0.85mm T≥1.0mm 10,000 5,000 * Option - 15 - Multilayer Ceramic Capacitor ■ CHARACTERISTIC MAP ● CLASS Ⅰ Temperature Characteristics Size Capacitance Range (㎊) Voltage 0.5 05 (0402) 50V 10 (0603) 50V 21 (0805) 50V 31 (1206) 50V 03 (0201) 25V 10 100 1000 10000 100000 1000000 10000000 100000000 240 1000 SL,UJ 05 (0402) 10 (0603) 21 (0805) C(COG) & TC Series 31 (1206) 32 (1210) 43 (1812) 55 (2220) 25V 50V 2700 8200 47 220 180 25V 1000 50V 1000 25V 50V 3300 25V 1500 100V 10000 　 4700 50V 50V 8200 3300 560 47000 4700 18000 25V 50V 50V 100000 1000 68000 43000 130000 - 16 - Multilayer Ceramic Capacitor ● CLASS Ⅱ , A(X5R) Temperature Characteristics Size Capacitance Range (㎊) Voltage 10 0603 (0201) 100 1000 10000 100000 6.3V 10000 10V 10000 220000 6.3V 1005 (0402) 10V 100000 16V 50V 1000000 10000000 100000000 47000 6800 10000 6.3V 1608 (0603) 2200000 10V 16V 1000000 330000 470000 6.3V A(X5R) 2012 (0805) 10V 16V 10000000 2200000 1000000 6.3V 3216 (1206) 10V 10000000 4700000 16V 3225 (1210) 5750 (2220) 4700000 6.3V 22000000 10V 22000000 16V 4532 (1812) 10000000 6800000 10000000 6.3V 47000000 6.3V 47000000 10V 47000000 - 17 - Multilayer Ceramic Capacitor ● CLASS Ⅱ , B(X7R) Temperature Characteristics Capacitance Range (㎊) Size Voltage 10 03 (0201) 100 1000 10000 6.3V 100 10000 10V 100 10000 16V 100 47000 10V 16V 50V 100000 33000 10000 25V 4700 220 100000 33000 10000 4700 6.3V 470000 10V 10 (0603) 220000 16V 100000 25V B(X7R) 50V 1000000 10000000 100000000 1000 6.3V 05 (0402) 100000 47000 1000000 470000 220000 100000 100000 220 6.3V 1000000 10V 21 (0805) 16V 68000 1000000 39000 25V 50V 470000 220 220000 6.3V 6800000 10V 31 (1206) 1000000 16V 　 25V 50V 1000000 220000 330000 100000 1000 10000000 4700000 3300000 1000000 1000000 - 18 - Multilayer Ceramic Capacitor ● CLASS Ⅱ , B(X7R) Temperature Characteristics Capacitance Range (㎊) Size Voltage 10 100 1000 10000 100000 1000000 10000000 100000000 6.3V 32 (1210) 22000000 10V 1500000 4700000 16V 1500000 4700000 25V 50V 2200000 680000 2200 1000000 10V B(X7R) 43 (1812) 16V 2200000 25V 1000000 50V 55 (2220) 22000000 10000 1000000 25V 50V 10000000 3300000 4700000 - 19 - Multilayer Ceramic Capacitor ● CLASS Ⅱ , F(Y5V) Temperature Characteristics Capacitance Range (㎊) Size Voltage 10 03 (0201) 100 1000 6.3V 10000 10000 10 V 05 (0402) 100000 220000 16 V 10000 25 V 10000 50 V 100000 1000000 10000000 100000000 330000 220000 33000 10000 2200 6.3V 10 (0603) 2200000 10 V 100000 1000000 16 V 100000 1000000 25 V 50 V 22000 330000 2200 100000 6.3V 10000000 10 V 21 (0805) 4700000 16 V 10000 25 V 10000 2200000 1000000 F(Y5V) 50 V 1000000 2200 10 V 31 (1206) 16 V 4700000 　 1000000 25 V 50 V 10000000 470000 3300000 10000 1000000 6.3V 47000000 10 V 32 (1210) 22000000 16 V 3300000 25 V 50 V 16V 43 (1812) 55 (2220) 22000000 10000000 1000000 100000 15000000 1000000 22000000 25 V 10000000 50 V 10000000 10 V 100000000 - 20 - Multilayer Ceramic Capacitor ■ RELIABILITY TEST DATA NO ITEM PERFORMANCE 1 APPEARANCE TEST CONDITION NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10) 10,000㏁ OR 500㏁·㎌ PRODUCT WHICHEVER IS 2 INSULATION SMALLER RESISTANCE (RATED VOLTAGE IS BELOW 16V MEASUREMENT TIME IS 60 ~ 120 RATED VOLTAGE TIME 60 SEC. : 10,000㏁ OR 100㏁·㎌) 3 WITHSTANDING VOLTAGE RATED VOLTAGE SHALL BE APPLIED. CLASSⅠ: 300% OF THE RATED VOLTAGE FOR 1~5 SEC, NO DIELECTRIC BREAKDOWN OR CLASSⅡ:250% OF THE RATED VOLTAGE FOR 1~5 SEC MECHANICAL BREAKDOWN IS APPLIED WITH LESS THAN 50㎃ CURRENT CAPACITANCE CLASS Ⅰ FREQUENCY 1,000㎊ AND WITHIN THE SPECIFIED 1㎒±10% BELOW TOLERANCE 0.5 ~ 5 Vrms MORE THAN 4 CAPACIT 1㎑±10% 1,000㎊ ANCE CLASS Ⅱ WITHIN THE SPECIFIED CAPACITANCE FREQUENCY VOLTAGE 10㎌ AND BELOW 1㎑±10% 1.0±0.2Vrms 120㎐±20% 0.5±0.1Vrms FREQUENCY VOLTAGE TOLERANCE MORE THAN 10㎌ CAPACITANCE 5 VOLTAGE Q CLASS Ⅰ OVER 30㎊ : Q ≥1,000 1,000㎊ AND LESS THAN 30㎊: Q ≥400 +20C 1㎒±10% BELOW 0.5 ~ 5 Vrms ( C : CAPACITANCE ) MORE THAN 1㎑±10% 1,000㎊ CAPACITANCE 1. CHAR : B RATED VOLTAGE DF SPEC 6.3V 0.05 max 10V 0.05 max 16V 0.035 max 25V 0.025 max 50V 이상 0.025 max FREQUENCY VOLTAGE 10㎌ AND BELOW 1㎑±10% 1.0±0.2Vrms MORE THAN 10㎌ 120㎐±20% 0.5±0.1Vrms 2. CHAR : F 6 Tanδ 6.3V 10V 1005 - 0.125max 1608 0.16max 0.125max 0.09max 2012 0.16max 0.125max 0.09max 0.07max 0.05max 3216 0.16max 0.125max 0.09max 0.07max 0.05max 3225 0.16max 0.125max 0.09max 4532 0.16max 0.16max 0.09max - - 0.125max - - - CLASS Ⅱ 5750 16V 0.09max (C＜220nF) 0.125max (C≥220nF) 25V 50V 0.05max 0.05max 0.05max(C≤100nF) 0.07max(C>100nF) 0.07max(C≤6.8㎌) 0.09max(C>6.8㎌) 0.05max 0.05max - 21 - Multilayer Ceramic Capacitor NO ITEM PERFORMANCE TEST CONDITION THESE SYMMETRICAL TOLERANCE APPLY TO TEMP. COEFFICIENT CHARACTERISTIC (PPM/℃) 0 ± 30 C0G CAPACITANCE 7 TEMPERATURE CLASS Ⅰ COEFFICIENT 2 POINT MEASUREMENT OF TEMPERATURE COEFFICIENT: ONE AT 25℃ AND AT 85℃ PH -150 ± 60 STEP RH -220 ± 60 1 SH -330 ± 60 2 TH -470 ± 60 3 UL -750 ± 120 4 SL +350 ~ -1000 TEMPERATURE 25 ± 2 MIN RATED TEMP ± 2 25 ± 2 MAX RATED TEMP ± 2 25 ± 2 5 The change of capacitance should be got from the capacitance at 25℃. After capacitance measured from Min. Temp. to CAPACITANCE CHANGE TEMPERATURE 8 CHARACTERISTIC S CLASS Ⅱ Max. Temp., it should be calculated from the formula below. CHAR. CAP. CHANGE(%) A,B ±15% F +22% ~ -82% C2 - C1 × 100 % C1 C1 : CAPACITANCE AT STANDARD TEMPERATURE(25℃) C2 : CAPACITANCE AT EACH TEMPERATURE NO INDICATION OF PEELING SHALL OCCUR ON THE TERMINAL 9 ADHESIVE STRENGTH A 500g.f PRESSURE SHALL BE APPLIED FOR 10±1 SECOND. ELECTRODE. OF TERMINATION 500g.f SEE (FIG.1) APPEARANCE NO MECHANICAL DAMAGE SHALL BENDING SHALL BE APPLIED TO OCCUR. THE LIMIT(1mm) WITH 0.3mm/SEC. CHARACTER CLASS I 10 CHANGE OF KEEP THE TEST BOARD AT THE LIMIT POINT CAPACITANCE IN 5 SEC., THEN MEASURE CAPACITANCE. WITHIN ±5% CHARACTER LIMIT OR ± 0.5 pF C, A, B, F 1mm WHICHEVER IS BENDING 20 LARGER STRENGTH CAPACITANCE A,B R=340 WITHIN ±12.5% 50 ○ CLASS II F ○ WITHIN ±30% 45±1 SEE (FIG.2) 45±1 BENDING LIMIT - 22 - Multilayer Ceramic Capacitor NO ITEM PERFORMANCE TEST CONDITION MORE THAN 75% OF THE TERMINAL SOLDER TEMPERATURE : 230±5℃ SURFACE IS TO BE SOLDERED NEWLY, DIP TIME SO METAL PART DOES NOT COME SOLDER : H63A OUT OR DISSOLVE FLUX : RMA TYPE : 3±1 Sec *PB-FREE 11 SOLDERABILITY SOLDER TEMPERATURE : 260±5℃ SOLDER : Sn96.5-3Ag-0.5Cu Flux : RMA TYPE IN PB--FREE PART, MORE THAN 95% DIP TIME : 3±0.1Sec OF THE TERMINAL SURFACE IS TO BE * PRE-HEATING : AT 80~120℃ FOR 10~30SEC. SOLDERED NEWLY APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC CLASSⅠ CAPACITANCE A,B CLASSⅡ RESISTANCE 12 HEAT Tanδ CLASS Ⅱ WITHIN ±2.5% OR EACH TERMINATION SHALL BE FULLY ±0.25㎊ WHICHEVER IMMERSED AND PREHEATED IS LARGER AS FOLLOWING: WITHIN ±7.5% 30㎊ AND OVER : Q≥ 1000 1 80~100 60 LESS THAN 30㎊ : Q≥ 400+20×C 2 150~180 60 WITHIN ±20% TO SATISFY THE SPECIFIED MEASURE AT ROOM TEMP. AFTER INITIAL VALUE COOLING FOR TO SATISFY THE SPECIFIED CLASSⅠ : 24 ± 2 HOURS RESISTANCE INITIAL VALUE CLASSⅡ : 48 ± 4 HOURS VOLTAGE APPEARANCE TO SATISFY THE SPECIFIED INITIAL VALUE NO MECHANICAL DAMAGE SHALL BENDING SHALL BE APPLIED TO OCCUR. THE LIMIT(1mm) WITH 0.3mm/SEC. CHARACTERISTIC CAP. CHANGE WITHIN ±2.5% OR ±0.25㎊ CLASS Ⅰ WHICHEVER CAPACITANCE IS LARGER VIBRATION TEST TIME (SEC.) INSULATION WITHSTANDING 13 DIP TIME :10±1 SEC. TEMP.(℃) F CLASS Ⅰ 270±5℃ CAP. CHANGE STEP TO SOLDERING Q DIP : SOLDER TEMPERATURE OF Q CLASS Ⅰ Tanδ CLASS Ⅱ KEEP THE TEST BOARD AT THE LIMIT POINT IN 5 SEC., THEN MEASURE CAPACITANCE. CHAR. FREQUENCY RANGE A,B,C,F 10Hz → 55Hz → 10Hz CLASS A,B WITHIN ±5% CHAR. TRAVERSED TIME Ⅱ F WITHIN ±20% A,B,C,F 1 min 30㎊ AND OVER : Q≥ 1000 LESS THAN 30㎊ : Q≥ 400+20×C THE ENTIRE FREQUENCY RANGE, FROM 10 TO 55Hz AND RETURN TO SATISFY THE SPECIFIED TO 10Hz, SHALL BE TRAVERSED INITIAL VALUE IN 1 MINUTE. INSULATION TO SATISFY THE SPECIFIED RESISTANCE INITIAL VALUE THIS CYCLE SHALL BE PERFORMED 2 HOURS IN EACH THERE MUTUALLY PERPENDICULAR DIRECTION, FOR TOTAL PERIOD OF 6 HOURS. * THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED AFTER THE HEAT TREATMENT OF 150 +0/-10℃, 1Hr AND SITTING OF 48±4hr AT ROOM TEMPERATURE & ROOM HUMIDITY. - 23 - Multilayer Ceramic Capacitor NO ITEM PERFORMANCE APPEARANCE TEST CONDITION NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC CAPACITANCE CHANGE Q HUMIDITY 14 CLASSⅠ (STEADY STATE) Ⅱ F 10 ~30㎊ APPEARANCE CLASSⅡ : 48±4 Hr. 6.3V LESS THAN 10pF : Q≥ 200 + 10×C A,B F RESISTANCE CLASSⅠ : 24±2 Hr. WITHIN ±30% : Q≥ 275 + 2.5×C 0.125 MAX *Condition Tanδ 1005 C ≥0.22㎌ 25V AND OVER 16V 0.05 0.05 MAX 0.075 MAX 0.1MAX (C〈1.0㎌) 0.125 MAX (C≥1.0㎌) CLASS Ⅱ INSULATION AFTER COOLING FOR WITHIN ±12.5% 30㎊ AND OVER : Q≥ 350 CHAR. Tanδ MEASURE AT ROOM TEMPERATURE IS LARGER A,B : 500 +12/-0 Hr. ±0.5㎊ WHICHEVER CAPACITANCE CLASS RELATIVE HUMIDITY:90~95 %RH TEST TIME WITHIN ±5% OR CLASS Ⅰ : 40±2 ℃ TEMPERATURE 10V 0.05 MAX 6.3V 0.075 MAX 4V 0.1 MAX 1608 C ≥2.2㎌ CLASSⅡ (A,B) 0.15 MAX 0.195 MAX 2012 C ≥4.7㎌ 3216 C ≥10.0㎌ 3225 C ≥22.0㎌ 0.25 MAX 4532 C ≥47.0㎌ 5750 C ≥100.0㎌ MINIMUM INSULATION RESISTANCE: 1,000 ㏁ OR 50㏁·㎌ PRODUCT WHICHEVER IS SMALLER APPLIED VOLTAGE : NO MECHANICAL DAMAGE SHALL OCCUR RATED VOLTAGE CHARACTERISTIC TEMPERATURE : 40±2 ℃ CAPACITANCE CHANGE RELATIVE HUMIDITY:90~95%RH WITHIN ±7.5% OR CLASS Ⅰ A,B CURRENT APPLIED : 50㎃ MAX. IS LARGER WITHIN ±12.5% CLASS Ⅱ SHOULD BE MEASURED INITIAL VALUE AFTER BE HEAT-TREATED WITHIN ±30% CAPACITANCE CLASS Ⅱ F MOISTURE 15 TEST TIME : 500 +12/-0 Hr. ±0.75㎊ WHICHEVER RESISTANCE FOR 1 HR IN 150℃+0/-10℃ AND BE LEFT WITHIN +30~－40% FOR 48±4HR AT ROOM TEMPERATURE. 1005 C>0.47μF 1608 C>1.0μF CLASSⅠ SHOULD BE MEASURED AFTER 2012 C>4.7μF LEFT FOR 24±2 HRS IN ROOM 3216 C>10.0μF TEMPERATURE AND HUMIDITY. CLASS Ⅱ SHOULD BE MEASURED 3225 C>22.0μF LATTER VALUE AFTER BE 4532 C>47.0μF HEAT-TREATED FOR 1 HR IN 150℃+0/-10 Q CLASSⅠ 30㎊ AND OVER : Q≥ 200 CHAR. Tanδ ℃ AND BE LEFT FOR 48±4HR AT ROOM 30㎊ AND BELOW : Q≥ 100 + 10/3×C A,B CLASSⅡ 25V AND OVER 16V 0.05 MAX 0.05 MAX 10V 6.3V TEMPERATURE. 4V 6.3V Tanδ 0.05 MAX 0.075 MAX 1608 C ≥2.2㎌ 0.1 MAX 2012 C ≥4.7㎌ CLASSⅡ F 0.075 MAX 0.125 MAX *Condition 1005 C ≥0.22㎌ 0.1MAX (C〈1.0㎌) 0.125MAX (C≥1.0㎌) 0.15 MAX 0.195 MAX 0.25 MAX (A,B) 3216 C ≥10.0㎌ 3225 C ≥22.0㎌ 4532 C ≥47.0㎌ 5750 C ≥100.0㎌ INSULATION RESISTANCE MINIMUM INSULATION RESISTANCE: 500 ㏁ OR 25㏁·㎌ PRODUCT, WHICHEVER IS SMALLER. - 24 - Multilayer Ceramic Capacitor NO ITEM PERFORMANCE TEST CONDITION APPLIED VOLTAGE : 150%, 200% OF RATED VOLTAGE APPEARANCE TEST TIME : 1000 +48/-0 Hr. NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC CLASS Ⅰ CAP. CHANGE CAPACITANCE CLASS TEMP. 125 ±3 ℃ WITHIN ±3% OR ±0.3㎊, CLASS WHICHEVER IS LARGER Ⅱ F A 85 ±3 ℃ B 125 ±3 ℃ F 85 ±3 ℃ WITHIN ±30% WITHIN+30~40% VALUE AFTER BE HEAT-TREATED FOR 1 1005 C>0.47μF HR IN 150℃+0/-10℃ AND BE LEFT FOR 48± 1608 C>1.0μF 4HR AT ROOM TEMPERATURE. CLASS Ⅱ SHOULD BE MEASURED INITIAL 2012 C>4.7μF 16 CHAR. CLASS Ⅰ WITHIN ±12.5% A,B Ⅱ CURRENT APPLIED : 50㎃ MAX. CLASSⅠ SHOULD BE MEASURED AFTER HIGH 3216 C>10.0μF TEMPERATURE 3225 C>22.0μF TEMPERATURE AND HUMIDITY. RESISTANCE 4532 C>47.0μF CLASS Ⅱ SHOULD BE MEASURED LATTER Q CLASSⅠ LEFT FOR 24±2 HRS IN ROOM VALUE AFTER BE HEAT-TREATED FOR 1 30㎊ AND OVER : Q ≥ 350 10 ~ 30 ㎊ HR IN 150℃+0/-10℃ AND BE LEFT FOR 48± : Q ≥ 275 + 2.5×C 4HR AT ROOM TEMPERATURE. LESS THAN 10㎊ :Q ≥200 + 10×C *150% Authorization CHAR. Tanδ A,B 25V AND OVER 16V 0.05 MAX 0.05 MAX 0.075 MAX 0.1MAX (C0.47μF 1608 C ≥2.2㎌ 0.05 MAX 0.075 MAX 0.1 MAX 2012 C ≥4.7㎌ CLASSⅡ 3216 C ≥10.0㎌ (A,B,F) CLASSⅡ F Conditions 0.15 MAX 0.195 MAX 3225 C ≥22.0㎌ 4532 C ≥47.0㎌ 0.25 MAX 5750 C ≥100.0㎌ (TWICE OF RATED VOLTAGE WILL BE INSULATION RESISTANCE MINIMUM INSULATION RESISTANCE: APPLIED TO ALL SERIES BUT ABOVE) 1,000 ㏁ OR 50㏁·㎌ PRODUCT ** HOWEVER, WHICHEVER IS SMALLER A/B는1005 C ≥0.22㎌ SEE (FIG.3) APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC CAP. CHANGE WITHIN ±2.5% CAPACITANCE 17 TEMPERATURE CYCLE Q CLASSⅠ Tanδ CLASSⅡ CLASS Ⅰ OR ±0.25㎊ WHICHEVER IS LARGER CLASS A,B WITHIN ±7.5% Ⅱ F WITHIN ±20% 30 ㎊ AND OVER : Q ≥ 1000 CAPACITORS SHALL BE SUBJECTED TO FIVE CYCLES OF THE TEMPERATURE CYCLE AS FOLLOWING STEP 1 2 3 LESS THAN 30㎊:Q ≥400 +20×C TO SATISFY THE SPECIFIED INITIAL VALUE 4 TEMP.(℃) MIN.RATED TEMP.+0/-3 25 MAX.RATED TEMP.+3/-0 25 TIME(MIN) 30 2~3 30 2~3 MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR INSULATION TO SATISFY THE SPECIFIED RESISTANCE INITIAL VALUE CLASSⅠ : 24±2 Hr. CLASSⅡ : 48±4 Hr. - 25 - Multilayer Ceramic Capacitor ■ CHARACTERISTIC GRAPH ● ELECTRICAL CHARACTERISTICS ▶ CAPACITANCE - TEMPERATURE CHARACTERISTICS 10 20 ΔC X7R 0 5 % -5 -10 -60 -20 0 20 60 100 -20 ΔC C0G RH SH TH UJ 0 -40 % -60 Y5V -80 -60 140 -20 Temperature(℃) 0 20 40 80 120 Temperature(℃) ▶ CAPACITANCE - DC VOLTAGE CHARACTERISTICS ▶CAPACITANCE CHANGE - AGING 40 10 20 C0G 50V 0 ΔC % 0 C0G -10 X7R -20 Y5V X7R -20 ΔC 50V -40 % -60 -80 Y5V -100 50V 0 5 10 15 20 25 30 35 -30 0 40 50 100 1000 DC V o l t a g e (V d c ) 10000 Time(Hr) ▶ IMPEDANCE - FREQUENCY CHARACTERISTICS C0G Ohm Ohm 100 100 10 10 X7R/Y5V 0.001㎌ 0.01㎌ 0.1㎌ 1 1 10pF 100pF 0.1 0.1 1000pF 0.01 1.E+06 1MHz 1.E+07 10MHz 1.E+08 100MHz 1.E+09 1GHz 1.E+10 10GHz 0.01 1.E+06 1MHz 1.E+07 10MHz 1.E+08 100MHz 1.E+09 1GHz - 26 - Multilayer Ceramic Capacitor ■ APPLICATION MANUAL ● Storage Condition ▶ Storage Environment The electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity of less than 40℃ and 70%, respectively. Guaranteed storage period is within 6 months from the outgoing date of delivery. ▶ Corrosive Gases Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases. ▶ Temperature Fluctuations Since dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage, it is important to maintain the temperature-controlled environment. ● Design of Land Pattern When designing printed circuit boards, the shape and size of the lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently. Use the following illustrations as guidelines for proper land design. Recommendation of Land Shape and Size Solder Resist Solder Resist T W Solder Land b a 2/3W < b < W 2/3T < a < T ● Adhesives When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions. ▶ Requirements for Adhesives They must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board. They must maintain their adhesive strength when exposed to soldering temperature. They should not spread or run when applied to the circuit board. They should harden quickly. They should not corrode the circuit board or chip material. - 27 - Multilayer Ceramic Capacitor They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be harmful when touched. ▶ Application Method It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor adhesion and overflow into the land, respectively. ▶ Adhesive hardening Characteristics To prevent oxidation of the terminations, the adhesive must harden at 160℃ or less, within 2 minutes or less. ● Mounting ▶ Mounting Head Pressure Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during mounting. ▶ Bending Stress When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the board. When the MLCCs are mounted onto the other side, it is important to support the board as shown in the illustration. If the circuit board is not supported, the crack occur to the ready-installed MLCCs by the bending stress. nozzle force support pin ● Flux Although the solderability increased by the highly-activated flux, increase of activity in flux may also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended that a mildly activated rosin flux(less than 0.2% chlorine) be used. - 28 - Multilayer Ceramic Capacitor ● Soldering Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering, it is exposed to potentially mechanical stress caused by the sudden temperature change. The capacitor may also be subject to silver migration, and to contamination by the flux. Because of these factors, soldering technique is critical. ▶ Soldering Methods Method Classification - Overall heating - Infrared rays - Hot plate - VPS(vapor phase) - Local heating - Air heater - Laser - Light beam Reflow soldering - Single wave - Double wave Flow soldering - * We recommend the reflow soldering method. ▶ Soldering Profile To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. ℃ preheating soldering cooling ℃ 300 300 250 250 200 200 150 150 100 100 50 50 preheating soldering cooling △T≤150℃ 60~120sec 10~20sec Reflow Soldering 60~120sec 3~4sec Flow Soldering ▶ Manual Soldering Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator's carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. - 29 - Multilayer Ceramic Capacitor ▶ Amount of Solder Too much Solder Cracks tend to occur due to large stress Weak holding force may Not enough cause bad connections or Solder detaching of the capacitor Good ▶ Cooling Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference(△T) must be less than 100℃ 6-6. Cleaning If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new. ▶ Notes for Separating Multiple, Shared PC Boards. A multi-PC board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board. - 30 - Multilayer Ceramic Capacitor ■ CROSS REFERENCE P/N COMPANY ① COMPANY ② SIZE (EIA/JIS) ③ MODEL(MLCC) TAIYO SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHM TDK VITRAMON CL - - C CM GRM - ECJ MCH MK C VJ - YUDEN 0201(0603) 03 - - - 03 33 - Z - 063 0603 - 0402(1005) 05 0402 R07 0402 05 36 0402 0 15 105 1005 0402 0603(1608) 10 0603 R14 0603 105 39 0603 1 18 107 1608 0603 0805(2012) 21 0805 R15 0805 21 40 0805 2 21 212 2012 0805 1206(3216) 31 1206 R18 1206 316 42-6 1206 3 31 316 3216 1206 1210(3225) 32 1210 S41 1210 32 42-2 1210 4 32 325 3225 1210 1808(4520) 42 1808 R29 1808 42 - 1808 - - - 4520 1808 1812(4532) 43 1812 S43 1812 43 43-2 1812 - 43 432 4532 1812 2220(5750) 55 - - 2220 55 44-1 2221 - - 550 5650 - COG(NPO) C A N G CG COG/CH N C A C COG/CH A P2H(N150) P S - - P P2H - P - P PH - R2H(N220) R 1 - - R R2H - R - R RH - S2H(N330) S 3 - - S S2H - S - S SH - T2H(N470) T O - - T T2H - T - T TH - U2J(N750) U Z - - U U2J - U UJ U UJ - S2L L Y - - SL SL - G SL SL SL - X7R B C W R(X) X7R X7R B B C BJ X7R(B) Y(X) Z5U E E Z U - Z5U Z - E - Z5U U Y5V F G Y V Y5V Y5V Y F F F Y5V - 0J - TEMPERATURE CHARACTERISTIC ④ NOMINAL CAPACITANCE EX) 103=10,000㎊ ⑤ CAPACITANCE TOLERANCE 6.3V ⑥ RATED VOLTAGE B:±0.1㎊ Q C:±0.25㎊ 221=220㎊ D:±0.5㎊ 225=2,200,000㎊=2.2㎌ F:±1% G:±2% 6 - 9 06 6.3 J:±5% - 1R5=1.5㎊ K:±10% 010=1㎊ M:±20% 0J - Z:-20~+80% J 10 V P Z 100 8 10 10 - 1A 4 L 1A - 16 V O Y 160 4 16 16 160 1C 3 E 1C J 25 V A 3 250 3 25 25 250 1E 2 T 1E X 50 V B 5 500 5 50 50 500 1H 5 U 1H A 100 V C 1 101 1 100 100 101 2A 1 - 2A B 200V D 2 201 2 200 200 201 2D - - - C 250V E V - - 250 250 251 - - - 2E - 500V G 7 501 - 500 500 501 - - - - E 630V H - - - 630 630 - - - - 2J - 1000V I A 102 - 1000 1K 102 - - - 3A G 2000V J G 202 - 2000 2K 202 - - - 3D - 3000V K H 302 - 3000 3K 302 - - - 3F H 4000V - J - 4000 - 402 - - - - - NICKEL BARRIER N T V C A (GRM) N - (MCH) - - X Ag/Pd P 1 - - B (GR) P - (MC) - - F BULK(VINYL) B 9 (NONE) - B PB * X - B B B ⑦ TERMINATION PAPER TAPING C 2, 4 T, R - T, L PT T E,V,W K, L T T C, P PLASTIC TAPING E 1, 3 E, U - H, N PT - F, Y P, Q T - T, R BULK CASE P 7 - - C PC - C C - - G ⑧ PACKAGE - 31 - Multilayer Ceramic Capacitor ▶ SAMSUNG : CL10B104KA8NNNC CL 10 Series Size Dielectric Capacitance Tolerance = = = = = = = = C P R S T U L B A F 2 significant figures + number of zeros Use "R" for decimal point A = ±0.05pF B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% 03 05 10 21 31 32 43 55 B 0201 0402 0603 0805 1206 1210 1812 2220 = = = = = = = = = = 104 C0G P2H R2H S2H T2H U2H S2L X7R X5R Y5V K A Z = +80,-20% 8 N Voltage Thickness Q = 6.3V P = 10V O = 16V A = 25V B = 50V C = 100V D = 200V E = 250V G = 500V H = 630V I = 1000V 3 = 0.30 5 = 0.50 8 = 0.80 A = 0.65 C = 0.85 H = 1.60 I = 2.00 J = 2.50 L = 3.20 Electrode/ Termination/ Plating A = Pd/Ag/ Sn 100% N = Ni/Cu/ Sn 100% G = Cu/Cu/ Sn 100% N N C Products Special Packaging A = Array Various (2-element) B = Array (4-element) C = High - Q L = LICC N = Normal P = Automotive W = 3 terminal chip B P C D = = = = Bulk Cassette Paper 7" Paper 13" (10,000EA) E = Embossing 7" F = Embossing 13" L = Paper 13" (15,000EA) O = Paper 10" S = Embossing 10" ▶ AVX : 06033C104KAT2A 0603 3 C Size Voltage 0201 4 = 4V 6 = 6.3V Z = 10V Y = 16V 3 = 25V B = 50V C = 100V D = 200V E = 250V G = 500V I = 1000V 0402 0603 0805 1206 1210 1812 2220 2225 104 K A T Dielectric Capacitance Tolerance Failure Rate A C D E G 2 significant figures + number of zeros Use "R" for decimal point B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% A = N/A = = = = = C0G X7R X5R Z5U Y5V 2 A Packaging Termination 2 4 7 9 T = Sn 100% 7 = Gold Plated 1 = Pd/Ag = = = = 7" Reel 13" Reel Cassette Bulk Special A T S R = = = = Standard 0.66mm 0.56mm 0.46mm Z = +80, -20% P = GMV,+100,-0% ▶ JOHANSON : 250R14W104KV6T 250 R14 Voltage 2 significant figures + number of zeros Size Dielectric R07 = 0402 R14 R15 R18 S41 S43 S47 S48 S49 S54 = = = = = = = = = W 0603 0805 1206 1210 1812 2220 2225 1825 3640 N = C0G W = X7R X = X5R Z = Z5U Y = Y5V 104 K V Capacitance Tolerance Termination 2 significant figures + number of zeros Use "R" for decimal point B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% 6 T Marking V = Ni Barrier Packaging 4 = No Mark 6 = Marking E = 7" Reel Plastic T = 7" Reel Paper R = 13" Reel Paper U = 13" Reel Plastic None = Bulk A Z = +80, -20% P = GMV,+100,-0% ▶ KEMET : C0603C104K3RAC C Series 0603 Size 0402 0603 0805 1206 1210 1812 2220 2225 C Specification C = Standard A = GR900 P = Mil-C-55681 CDR01-CDR06 N = Mil-C-55681 CDR31-CDR35 Z = Mil-C-123 E = Mil Equivalent (Group A Only) 104 K 3 R Capacitance Tolerance Voltage Dielectric Failure Rate 2 significant figures + number of zeros Use "R" for decimal point B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% G R P U X V A M P R S 9 8 4 3 5 1 2 = = = = = = = 6.3V 10V 16V 25V 50V 100V 200V = = = = = = C0G X7R X5R Z5U BX(Mil) Y5V = = = = = Standard 1.0 (Mil) 0.1 (Mil) 0.01 (Mil) 0.001 (Mil) C Termination C H T G = = = = Ni w/Tin Plate Ni w/Solder Silver Gold Plated Z = +80, -20% P = +100, 0% - 32 - Multilayer Ceramic Capacitor ▶ KYOCERA : CM105X7R104K25AT CM 105 X7R 104 Series K 25 Size Dielectric Capacitance Tolerance 03 = 0201 05 = 0402 105 = 0603 21 = 0805 316 = 1206 32 = 1210 42 = 1808 43 = 1812 55 = 2220 CG X8R X7R X5R Z5U Y5V Y5U 2 significant figures + number of zeros Use "R" for decimal point B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% A Voltage Z = +80, -20% P = +100, 0% T Termination 04 = 4V 06 = 6.3V 10 = 10V 16 = 16V 25 = 25V 50 = 50V 100 = 100V 250 = 250V 500 = 500V 1000 = 1000V Packaging A = Ni Barrier T L H N B C = = = = = = 7" Reel (4mm Pitch) 13" Reel (4mm Pitch) 7" Reel (2mm Pitch) 13" Reel (2mm Pitch) Bulk (Vinyl Bags) Bulk Cassette ▶ MURATA : GRM188R71E104KA01D GRM 18 8 R7 1E 104 K A01 Series Size Thickness Dielectric Voltage Capacitance Tolerance Ni Barrier 03 = 0201 3 = 0.3mm 5 = 0.5mm 8 = 0.8mm A = 1.0mm B = 1.25mm C = 1.6mm D = 2.0mm E = 2.5mm F = 3.2mm 2 significant figures + number of zeros Use "R" for decimal point B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% Individual Specification Code 15 18 21 31 32 42 43 55 = = = = = = = = 0402 0603 0805 1206 1210 1808 1812 2220 5C R7 R6 E4 F5 = = = = = C0G X7R X5R Z5U Y5V 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V 2A = 100V 2E = 250V 2H = 500V 3A = 1000V D Packaging D = 7" Reel Paper L = 7" Reel Plastic J = 13" Reel Paper K = 13" Reel Plastic B = Bulk C = Bulk Cassette T = Bulk Tray Z = +80,-20% P = +100, 0% ▶ NOVACAP : 0603B104K250N_TM 1206 B 104 K 250 N Size Dielectric Capacitance Tolerance Voltage Termination Thickness 0402 0603 0805 1005 1206 1210 1808 1812 2220 N B X Z Y 2 significant figures + number of zeros Use "R" for decimal point B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% 2 significant figures + number of zeros P = Pd/Ag N = Ni Barrier (Sn 100%) Y = Ni Barrier (Sn/Pb) Per Specified = = = = = C0G X7R BX Z5U Y5V - T Packaging M Marking T = Reel None = Bulk W = Waffle Pack Z = +80,-20% P = +100, 0% ▶ PANASONIC : ECJ1EB1E104K ECJ 1 Series Size Z 0 1 2 3 4 = = = = = = 0201 0402 0603 0805 1206 1210 E Packaging X = Bulk E = Paper 2mm V = Paper 4mm F, Y = Plastic 4mm W = Large Reels 2mm Z = Large Reels 4mm C = Bulk Cassette B Dielectric C = C0G B = X7R, X5R F = Y5V 1E 104 K Voltage Capacitance Tolerance 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V 2A = 100V 2D = 200V 2 significant figures + number of zeros Use "R" for decimal point C = ±0.25pF D = ±0.5pF F = ±1% J = ±5% K = ±10% M = ±20% Z = +80, -20% - 33 - Multilayer Ceramic Capacitor ▶ ROHM : MCH182C104KKN MCH 18 2 Series Size Voltag e 15 18 21 31 32 43 = = = = = = 0402 0603 0805 1206 1210 1812 4 3 2 5 = = = = C 10V 16V 25V 50V 104 K K Dielectric Capacitance Tolerance A = C0G C = X7R F = Y5V 2 significant figures + number of zeros Use "R" for decimal point B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% N Packaging Marking/Thickness K = 7" Reel Paper P = 7" Reel Plastic L = 13" Reel Paper Q = 13" Reel Plastic B = Bulk C = Bulk Cassette N = Marked Special Thickness Z = +80,-20% P = +100, 0% ▶ TAIYO-YUDEN : TMK107BJ104K_T T M K 107 Voltage Type Termination Size A = 4V J = 6.3V L = 10V E = 16V T = 25V U = 50V M = Multilayer V = Hi Q K = Ni Barrier 105 107 212 316 325 432 550 = = = = = = = BJ 0402 0603 0805 1206 1210 1812 2220 104 K - T Dielectric Capacitance Tolerance Special Packaging CG = C0G CH = C0H CJ = C0J CK = C0K BJ = X5R, X7R F = Y5V 2 significant figures + number of zeros Use "R" for decimal point C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% Various T = Reel B = Bulk Z = +80,-20% ▶ TDK : C1608X7R1E104KT C Series 1608 X7R 1E 104 Size Dielectric Voltage Capacitance Tolerance Packaging CG X7R Z5U Y5V 0J = 6.3V 1A = 10V 1C = 16V 1E = 25V 1H = 50V 2 significant figures + number of zeros Use "R" for decimal point C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% T = Reel B = Bulk 0603 1005 1608 2012 3216 3225 4532 5650 = = = = = = = = 0201 0402 0603 0805 1206 1210 1812 2220 K T Z = +80, -20% ▶ VITRAMON : VJ0603Y104KXXMC VJ 0603 Y Series Size Dielectric Capacitance Tolerance 0402 0603 0805 1206 1210 1812 2225 X = A,N Y = U = H = 2 significant figures + number of zeros Use "R" for decimal point B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20% BX = C0G X7R Z5U X8R 104 K X Termination X = Silver, Ni Barrier Tin Plated X M Voltage Marking J = 16V X = 25V A = 50V B = 100V C = 200V M = Marking A = No Marking C Packaging C T P R B = = = = = 7" Reel Paper 7" Reel Plastic 13" Reel Paper 13" Reel Plastic Bulk Z = +80, -20% P = +100, 0% - 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