CL10A106MA

SPECIFICATION · Supplier : Samsung electro-mechanics · Product : Multi-layer Ceramic Capacitor (Reference sheet) CL10A106MA8NRNC CAP, 10㎌, 25V, ±20%, X5R, 0603 · Samsung P/N : · Description : A. Samsung Part Number CL ① ① Series ② Size ③ Dielectric ④ Capacitance ⑤ Capacitance tolerance ⑥ Rated Voltage ⑦ Thickness 10 ② A ③ 106 ④ M ⑤ A ⑥ 8 ⑦ N ⑧ R ⑨ Samsung Multi-layer Ceramic Capacitor 0603 (inch code) L : 1.60 ± 0.20 ㎜ X5R 10 ㎌ ±20 % C ⑪ W : 0.80 ± 0.20 ㎜ Inner electrode Termination Plating ⑨ Product ⑩ Special ⑪ Packaging ⑧ 25 V 0.80 ± 0.20 ㎜ N ⑩ Ni Cu Sn 100% (Pb Free) Size control code Control code Cardboard Type, 7" reel B. Structure & Dimension Dimension(㎜) Samsung P/N CL10A106MA8NRNC L W T BW 1.60 ± 0.20 0.80 ± 0.20 0.80 ± 0.20 0.30 ± 0.20 C. Samsung Reliablility Test and Judgement Condition Judgement Capacitance Tan δ (DF) Within specified tolerance Test condition 1㎑ ±10% / 1.0±0.2Vrms *A capacitor prior to measuring the capacitance is heat treated at 150℃+0/-10℃ for 1hour and maintained in ambient air for 24±2 hours. Rated Voltage 60~120 sec 0.1 max. Insulation Resistance Appearance Withstanding Voltage Temperature Characteristics Adhesive Strength of Termination Bending Strength 10,000Mohm or 100Mohm×㎌ Whichever is smaller No abnormal exterior appearance Microscope (×10) 250% No dielectric breakdown or of the rated voltage mechanical breakdown X5R 1㎑ ±10% / 0.5±0.1Vrms (From -55℃ to 85℃, Capacitance change should be within ±15%) No peeling shall be occur on the 500g·f, for 10±1 sec. terminal electrode Capacitance change : within ±12.5% Bending to the limit (1mm) with 1.0mm/sec. Solderability More than 75% of terminal surface is to be soldered newly SnAg3.0Cu0.5 solder Capacitance change : Tan δ, IR : initial spec. Capacitance change : Tan δ, IR : initial spec. within ±7.5% Solder pot : 270±5℃, 10±1sec. within ± 5% Amplitude : 1.5mm Resistance to Soldering Heat Vibration Test Moisture Resistance High Temperature Resistance Temperature Cycling Capacitance change : within ±12.5% Tan δ : 0.125 max IR : 500Mohm or 12.5Mohm×㎌ Whichever is smaller Capacitance change : within ±12.5% Tan δ : 0.125 max IR : 1,000Mohm or 25Mohm×㎌ Whichever is smaller Capacitance change : within ±10% Tan δ, IR : initial spec. 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) From 10㎐ to 55㎐ (return : 1min.) 2hours × 3 direction (x, y, z) With rated voltage 40±2℃, 90~95%RH, 500+12/-0hrs 100% of the rated voltage With Max. operating temperature 1,000+48/-0hrs 1 cycle condition Min. operating temperature Max. operating temperature → 5 cycle test ※ The reliability test condition can be replaced by the corresponding accelerated test condition. D. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260±5℃, 30sec. ) Product specifications included in the specifications are effective as of March 1, 2013. Please be advised that they are standard product specifications for reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers. → → 25℃ 25℃ MLCC Pro oduct Manual E. Recomm mended TE EST PCB ( Adhesive strength of termination)) Size cod de Sizze (mm) a b c 02 0..4 × 0.2 0.20 0.1 17 0.26 03 0..6 × 0.3 0.30 0.3 30 0.30 05 1.0 0. × 0.5 0.40 0.5 55 0.50 10 1..6 × 0.8 1.00 1.0 00 1.20 21 2.0 0 × 1.25 1.20 1.4 40 1.65 31 3..2 × 1.6 2.20 1.4 40 2.00 32 3..2 × 2.5 2.20 1.4 40 2.90 43 4..5 × 3.2 3.50 1.7 75 3.70 55 5..7 × 5.0 4.50 1.7 75 5.60 c b a d e (Subsstrate for be ending strength test) ☞ ☞ (Su ubstrate for R Reliability te est) Sizze code Size (mm) a b c d e 02 0.4 × 0.2 0.2 0.6 0.2 2 5.0 5.5 03 0.6 × 0.3 0.3 0.9 0.3 3 5.0 5.5 05 1.0 × 0.5 0.4 1.5 0.5 5 5.0 5.5 10 1.6 × 0.8 1.0 3.0 1.2 2 5.0 5.5 21 2.0 × 1.25 1.2 4.0 1.6 65 5.0 5.5 31 3.2 × 1.6 2.2 5.0 2.0 0 5.0 5.5 32 3.2 × 2.5 2.2 5.0 2.9 9 5.0 5.5 43 4.5 × 3.2 3.5 7.0 3.7 7 5.0 5.5 55 5.7 × 5.0 4.5 8.0 5.6 6 5.0 5.5 al : Glass epoxy substratte Materia : Copper foil f (T=0.035 5 ㎜) ☞ TThickness : T=1.6 T ㎜ (T= 0.8 ㎜ for 003/05) ☞ : So older resist KSD 6704) with w 3% silverr is used. ☞ Caution : Abnormaliity can occur if lead-bassed solder (K 3 MLCC Pro oduct Manual 1. Packag ging This spe ecification applies a to ta aping of MLLCC When ccustomers re equire, the specification s n may be ch hanged und der the agreeement. 1-1. Figure 1-2. Quan ntity [unit:pcs] Type Size Code Chip Inch(mm) Thickness Plastic Plasttic 7 inches reel 10 inches reel 13 inches reel 0402 (01005) 2mm 20k - 100K K PAPER 2mm 10K - 50K K PAPER 2mm 10K - 50K K 0.8 mm PAPER 4mm 4K 10K 15K / 10K 1 T≤0.85 mm PAPER 4mm 4K 10K 15K / 10K 1 T≥1.0 mm EMBOSSED D 4mm 2K 6K 10K K T≤0.85 mm PAPER 4mm 4K 10K 10K K T≥1.0 mm EMBOSSED D 4mm 2K 4K 10K K T≤1.6 mm EMBOSSED D 4mm 2K 4K 10K K T≥2.0 mm EMBOSSED D 4mm 1K 4K 4K T≤1.6 mm EMBOSSED D 8mm 2k - 8k T≥2.0 mm EMBOSSED D 8mm 1k - 4k T≤2.0 mm EMBOSSED D 8mm - - 4K T>2.0 mm EMBOSSED D 8mm - - 2K T≥2.5 mm EMBOSSED D 8mm - - 2K Pitch 0.2 mm PAPER 0603 (0201) 0.3 mm 1005 (0402) 0.5 mm 1608 (0603) 2012 (0805) MLCC Plastic Taping Typ pe 3216 (1206) 3225 (1210) 4520 (1808) 4532 (1812) 5750 (2220) 4 MLCC Product Manual 1-3. Tape Size 1-3-1. Cardboard(Paper) tape : 4mm pitch [unit:mm] Size Inch(mm) 0603 (1608) 0805 (2012) 1206 (3216) A B W F E P1 P2 P0 D t 1.00 ±0.10 1.55 ±0.10 2.05 ±0.10 1.90 ±0.10 2.30 ±0.10 3.60 ±0.10 8.00 ±0.30 3.50 ±0.05 1.75 ±0.10 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 φ1.50 +0.10/-0 1.1 Below ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances. 1-3-2. Cardboard(Paper) tape : 2mm pitch [unit:mm] Size Inch(mm) A B 01005 (0402) 0.25 ±0.02 0.46 ±0.02 0201 (0603) 0.38 ±0.03 0.68 ±0.03 0402 (1005) 0.62 ±0.05 1.12 ±0.05 0204 (0510) 0.62 +0.05 /-0.10 1.12 +0.05 /-0.10 W F E P1 P2 P0 D t 0.25 ±0.02 8.00 ±0.30 3.50 ±0.05 1.75 ±0.10 2.00 ±0.05 2.00 ±0.05 4.00 ±0.10 φ1.50 +0.10 /-0.03 0.35 ±0.03 0.60 ±0.05 0.37 ±0.03 ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances. 5 MLCC Product Manual 1-3-3. Embossed(Plastic) tape [unit:mm] Size A B W F E P1 P2 P0 D 01005 0.23 0.45 4.00 1.80 0.90 1.00 1.00 2.00 φ0.80 (0402) ±0.02 ±0.02 ±0.05 ±0.02 ±0.05 ±0.02 ±0.02 ±0.03 ±0.04 Inch(mm) φ1.50 t1 0.35 0.50 Below Below 015008 0.32 0.58 2.00 (05025) ±0.03 ±0.03 ±0.05 0603 1.05 1.90 (1608) ±0.15 ±0.15 0805 1.45 2.30 (2012) ±0.20 ±0.20 1206 1.90 3.50 (3216) ±0.20 ±0.20 1210 2.80 3.60 (3225) ±0.20 ±0.20 1.75 2.00 4.00 1808 2.30 4.90 ±0.10 ±0.05 ±0.10 (4520) ±0.20 ±0.20 1812 3.60 4.90 12.0 5.60 8.00 (4532) ±0.20 ±0.20 ±0.30 ±0.05 ±0.10 Below 2220 5.50 6.20 (5750) ±0.20 ±0.20 0.62 1.12 +0.05 +0.05 /-0.10 /-0.10 8.00 3.50 4.00 2.50 0306 1.10 1.90 ±0.30 ±0.05 ±0.10 Below (0816) ±0.20 ±0.20 0204 (0510) 8.00 3.50 ±0.30 ±0.05 +0.10 t0 /-0.03 4.00 2.50 ±0.10 Below φ1.50 0.60 +0.10 /-0 Below 3.80 ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances. 6 MLCC Pro oduct Manual 1-3-4. Reel Size [unit:mm] Symbol 7”Reel 10”Reel 13”Reel Tape Widtth A B C D E W t 4mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 5±0.5 1.2±0.2 8mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 10±1.5 0.9±0.2 12mm φ178±2.0 MINφ50 φ13±0.5 21±0.8 2.0±0.5 13±0.5 1.2±0.2 8mm φ258±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 10±1.5 1.8±0.2 8mm φ330±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 10±1.5 1.8±0.2 12mm φ330±2.0 MINφ70 φ13±0.5 21±0.8 2.0±0.5 13±0.5 2.2±0.2 1-4. Coverr tape peel-off force 1-4-1. Peel--off force 10 g.f ≤ peel-offf force ≤ 70 0 g.f 1-4-2. Meassurement Method ping Packaging design : Packaging design follows IEC 6028 86-3 standard d. -Tap (IEC 60286-3 Packaging P off componen ts for autom matic handlin ng - parts 3) * If the static ele ectricity of SM MT process causes any problems, please contacct us. 7 MLCC Pro oduct Manual 1-5. BOX package 1-5-1. Packkaging Label REELL & Box Type e Labe el includes th he informatio on as below. w. 1) Chip size 2) Temperature e Characterisstics 3) Nominal Ca apacitance 4) Model Nam me 5) LOT Numbe er & Reel Nu umber 6) Q’ty 1-5-2. Box Packaging 1) Double packagin of inner boxx and outer box. ng with the paper type o b 2) Avoiid any dama ages during transportatio on by car, aiirplane and ship. s 3) Rem mark informattion of contents on inneer box and outer o box ※ If sp pecial packag ging is required, please ccontact us. 1-5-3. 7" Bo ox packaging g [ Unit : mm m ] - Inner Box (7"" x 10 REEL) - Innerr Box (7" x 5 REEL ) - Outerr Box (7" x 20 2 REEL) - Outer Box (7" x 60 REEEL) 8 MLCC Product Manual 1-5-4. 13” Box packaging - Inner Box (13" x 4 REEL) - Outer Box (13" x 20 REEL) 1-6. Chip Weight Size(L/W) Size(T) Inch(mm) (mm) Temp. Weight Size(L/W) Size(T) (mg/pc) Inch(mm) (mm) 0.20 C0G 0.082 0.20 X7R 0.083 0.20 X5R 0.093 0.50 C0G 1.182 0.50 X7R 1.559 0.50 X5R 1.560 0.65 C0G 7.192 1.25 X7R 16.523 1.25 X5R 16.408 1210 2.50 X7R 116.197 (3225) 2.50 X5R 121.253 1.25 X7R 96.697 01005 (0402) 0402 (1005) 0805 (2012) 1812 (4532) Temp. Weight (mg/pc) 0.30 C0G 0.233 0.30 X7R 0.285 0.30 X5R 0.317 0.80 C0G 4.615 0.80 X7R 5.522 0.80 X5R 5.932 1.25 C0G 28.086 1.60 X7R 54.050 1.60 X5R 45.600 1808 1.25 C0G 47.382 (4520) 1.25 X7R 63.136 1.60 X7R 260.897 0201 (0603) 0603 (1608) 1206 (3216) 2220 (5750) The weight of product is typical value per size, for more details, please contact us. 9 MLCC Product Manual 2. Product Characteristic data 2-1. Capacitance The capacitance is the ratio of the change in an electric charge according to voltage change. Due to the fact that the capacitance may be subject to change with the measured voltage and frequency, it is highly recommended to measure the capacitance based on the following conditions. 2-1-1. Measure capacitance with voltage and frequency specified in this document. Regarding the voltage/frequency condition for capacitance measurement of each MLCC model, please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document. The following table shows the voltage and frequency condition according to the capacitance range. [The voltage and frequency condition according to MLCC the capacitance range] ◆ Class I Capacitance Frequency ≤ 1,000 pF 1 MHz ± 10% > 1,000 pF 1 kHz ± 10% Voltage 0.5 ~ 5 Vrms ◆ Class II Capacitance Frequency Voltage ≤ 10 ㎌ 1 kHz ± 10% 1.0 ± 0.2 Vrms > 10 ㎌ 120 Hz ± 20% 0.5 ± 0.1 Vrms Exception* 1 kHz ± 10% 0.5 ± 0.1 Vrms Capacitance shall be measured after the heat treatment of 150+0/-10℃ for 1hr, leaving at room temperature for 24±2hr. (Class II) 2-1-2. It is recommended to use measurement equipment with the ALC (Auto Level Control) option. The reason is that when capacitance or measurement frequency is high, the output voltage of measurement equipment can be lower than the setting voltage due to the equipment limitation. Note that when capacitance or measurement frequency is excessively high, the measurement equipment may show ALC off warning and provide a lower output voltage than the setting voltage even with ALC option selected. It is necessary to ensure the output voltage of measurement equipment is the same as the setting voltage before measuring capacitance. 10 MLCC Product Manual 2-1-3. Capacitance value of high dielectric constant (Class II) MLCC changes with applied AC and DC voltage. Therefore, it is necessary to take into account MLCC’s AC voltage characteristics and DCbias voltage characteristics when applying MLCC to the actual circuit. 2-1-4. The capacitance is in compliance with the EIA RS-198-1-F-2002. 2-2. Tan δ (DF) 2-2-1. An ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of electrode. DF (Dissipation Factor) is defined as the ratio of loss energy to stored energy and typically being calculated as percentage. 2-2-2. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy. The equation can be described as 1/DF. Normally the loss characteristic of Class I MLCC is presented in Q, since the DF value is so small whereas the loss characteristic of Class II MLCC is presented in DF. 2-2-3. It is recommended to use Class I MLCC for applications to require good linearity and low loss such as coupling circuit, filter circuit and time constant circuit. 2-3. Insulation Resistance Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties. Insulation resistance is defined as the ratio of a leakage current to DC voltage. 2-3-1. When applying DC voltage to MLCC, a charging current and a leakage current flow together at the initial stage of measurement. While the charging current decreases, and insulation resistance (IR) in MLCC is saturated by time. Therefore, insulation resistance shall be measured 1 minute after applying the rated voltage. 2-4. Capacitance Aging The aging characteristic is that the high dielectric (Class II) MLCC decreases capacitance value over time. It is also necessary to consider the aging characteristic with voltage and temperature characteristics when Class II MLCC is used in circuitry. 11 MLCC Pro oduct Manual 2-4-1. In ge eneral, aging g causes cap pacitance to decrease lin nearly with th he log of tim me as shown n in the follow wing graph. Please checck with SEMC CO for more e details, since the valuee may vary between b different models. 2-4-2. Afterr heat treatm ment (150 °C C, 1hour), thee capacitancce decreased d by aging iss recovered, so aging shou uld be consid dered again from the tim me of heat treatment. [ Example of Capacitan nce Aging ] * Samp ple : C0G, X7 7R, X5R 2-5. Temp perature Ch haracteristiics of Capa acitance (T TCC) e consider te emperature characteristi cs of capacitance since the electricaal characterisstics such ass Please capacitance chang ges which is caused by a change in ceramic die electric consttant by temp perature. 2-5-1. It is necessary to o check the values v speci fied in sectio on “C. Reliab bility test Co ondition–Tem mperature f the temp perature and capacitance e change ran nge of MLCC C. Charracteristics” for [ Example of Temperature Characteristics (X X5R) ] d voltage 6.3 * Sample : 10uF, Rated 3V [ Ex xample of Biaas TCC ] oltage 6.3V * Sample : 10uF, Rated vo 12 MLCC Pro oduct Manual 2-5-2. Whe en selecting MLCC, it is necessary n to consider th he heat chara acteristics off a system, room temp perature and d TCC of MLC CC, since thee applied tem mperature may m change the capacita ance of MLCC C. 2-5-3. In ad ddition, Bias TCC of MLC CC should bee taken into account when DC volta ge is applied d to MLCC. 2-6. Self-h heating Temperature It is n necessary to o design the system, with h considering self-heatin ng generated d by the ESR R (Equivalent Seriess Resistance)) of MLCC w when AC volttage or pulse voltage is applied to MLCC. M en MLCC is used u in an AC voltage orr pulse volta age circuit, se elf-heating i s generated when AC 2-6-1. Whe or pu ulse current flows throug gh MLCC. Sh hort-circuit may m be occu urred by the degradation n of MLCC’s insulating properties. 2-6-2. The reliability of MLCC may be affected by MLCC be eing used in an AC voltaage or pulse e voltage w the ra ange of rated d voltage. circuit, even the AC voltage or the pulsee voltage is within efore, make sure to checck the follow wing conditions. There 1) Th he surface te emperature of o MLCC mu ust stay within the maxim mum operatiing tempera ature after AC C or Pulse vo oltage is app plied. 2) Th he rise in inccrease by sellf-heating off MLCC mustt not exceed d 20℃ [ Examp le of Ripple current ] * Sample S : X5R R 10uF, Rate ed voltage 6..3V 13 MLCC Pro oduct Manual 2-7. DC & AC Voltag ge Charactteristics It is rrequired to consider c volttage charactteristics in th he circuit sin nce the capaacitance value of high dielecctric constan nt MLCC(Class II) is chan nged by app plied DC & AC A voltage. 2-7-1. Pleasse ensure the capacitancce change iss within the allowed ope erating rangee of a system m. In particular, when high dielectric constant type MLCC (Class II) is used in circu uit with narrrow allowed be designed d with consid dering DC vo oltage, temp perature capacitance tolerrance, a systtem should b acteristics an nd aging cha aracteristics of MLCC. chara [ Example off DC Bias cha aracteristics ] * Sample : X5 R 10uF, Rated voltage 6.3 3V 2-7-2. It is necessary to o consider th he AC voltag ge characteristics of MLC CC and the A AC voltage of o a system, e the capacittance value of high dieleectric consta ant type MLC CC (Class II) varies with the applied since AC vvoltage. [ Example E of A AC voltage characteristic c cs ] * Sample S : X5R R 10uF, Rate ed voltage 6..3V 14 MLCC Pro oduct Manual 2-8. Impedance Characteristic Electrrical impedance (Z) of MLCC M is the m measuremen nt of the opp position thatt MLCC pressents to a curre ent (I) when a voltage (V V) is applied. It is defined d as the ratio o of the volttage to the current c (Z=V//I). Impedan nce extends the t concept of resistancce to AC circuits and is a complex number consiisting of the real part off resistance ((R) and the imaginary i pa art of reactaance (X) as Z=R+jX. Z There efore, it is re equired to de esign circuit with consid deration of th he impedancce characterristics of MLCC C based on the t frequenccy ( Z = R + jX ) 2-8-1. MLCC operates as a a capacito or in the low w frequency and its reactance (XC) d decreases ass frequency incre eases ( X_C=1/j2πfC ) wh here f is freq quency and C is capacita ance. The resistance (E ESR; Equivale ent Series Reesistance) off MLCC in th he low frequeency mainly comes from m the loss of its dielectricc material. 2-8-2. MLCC operates as a an inducttor in the hig gh frequency y and the inductance off MLCC is ca alled ESL (Equiivalent Serie es Inductance e). The reacttance (XL) off MLCC in th he high frequ uency increa ases as frequ uency increases ( X_L=j2 2πf∙ESL ). Thee resistance (ESR) of ML LCC in the hiigh frequenccy mainly come es from the loss of its electrode meetal. 2-8-3. SRF (Self Resona ant Frequenccy) of MLCC is the frequ uency where its capacitivve reactance (XC) and inducctive reactan nce(XL) cancel each otheer and the im mpedance of MLCC has only ESR at SRF. o MLCC can n be measurred by a nettwork analyzer or an imp pedance ana alyzer. 2-8-4. The impedance of When using the network ana alyzer, pleas e note that the small-sig gnal input m may lead to the impe edance of low w capacitance caused b by the AC vo oltage charac cteristic of M MLCC. [ Example of IImpedance characteristics c s] * Sample : X5 5R 1uF, Rated d voltage 6.3V 15 MLCC Pro oduct Manual 3. Electriccal & Mecchanical Caution C 3-1. Deratting MLCC C with the test voltage att 100% of th he rated volttage in the high h temperrature resista ance test are labeled as “de erated MLCC C.” For this tyype of MLCC C, the voltag ge and temp perature should be derate ed as shown n in the follo owing graph for the equivalent life time of a norrmal MLCC with w the test vo oltage at 150% of the ra ated voltagee in the high h temperaturre resistancee test. 3-1-1. The derated MLC CC should be b applied w with the derating voltage and tempe rature as shown in the follow wing graph. 3-1-2. The “Temperaturre of MLCC” in the x-axiis of the graph below indicates the surface temperature of MLCC C including self-heating effect. The “Voltage De erating Ratio o” in the y-axxis of the grraph below givess the maximum operatin ng voltage o of MLCC with h reference to t the maxim mum voltage e (Vmax) as defin ned in sectio on “3-2. Applied Voltagee.” mple of deratting graph for f derated MLCC] M [Exam * Vmax ≤ Derated Voltage * Only the D Derating marked modelss 16 MLCC Pro oduct Manual 3-2. Appliied Voltage e The a actual applie ed voltage on o MLCC sho ould not excceed the rate ed voltage sset in the spe ecifications. 3-2-1. Cauttions by type es of voltage e applied to MLCC · Forr DC voltage e or DC+AC voltage, DC voltage or the t maximum m value of D DC + AC voltage should no ot exceed the e rated volta age of MLCC C. · Forr AC voltage or pulse vo oltage, the p eak-to-peak k value of AC C voltage or pulse voltag ge sho ould not excceed the rate ed voltage o of MLCC. · Abn normal volta age such as surge voltag ge, static ele ectricity shou uld not exceeed the rated d voltage of MLLCC. pes of Voltag ge Applied to t the Capac citor] [Typ DC Vo oltage AC Voltage DC C+AC Voltag ge 1 DC+A AC Voltage 2 DC+Pulse Voltage 3-2-2. Effecct of EOS (Electrical Overstress) · Elecctrical Oversstress such as a a surge vo oltage or EO OS can cause e damages to o MLCC, resulting in the e electrical short s failure caused by tthe dielectricc breakdown n in MLCC. · Dow wn time of MLCC M is varied with the applied volttage and the e room temp perature and da diele ectric shock caused c by EOS can acceelerate heating on the dielectric. Theerefore, it ca an bring abou ut a failure of o MLCC in a market at tthe early stage. · Plea ase use cauttion not to apply a excess ive electrical overstress including sp pike voltage MLCC when n pre eparing MLC CC for testing g or evaluatiing. (1) Surge e When n the overcu urrent caused d by surge iss applied to MLCC, the influx of currrent into ML LCC can inducce the overshooting phe enomenon o of voltage as shown in th he graph beelow and result in the electrrical short fa ailure in MLC CC. Thereforee, it is necesssary to be careful c to pre revent the influx of surge e current into o MLCC. (2) ESD (Electrostaticc Discharge) Since e the voltage e of the static electricity is very high h but the quantity of eleectric charge is small comp pared to the surge, ESD can cause d damage to MLCC M with lo ow capacitan nce as shown n in the 17 MLCC Pro oduct Manual follow wing graph, whereas surrge with lotss of electric charge c quan ntity can cau use damagess to even high capacitance MLCC. [ Exxample of Su urge applied to MLCC ] [ Example of ESD appl ied to MLCC C] * Simulatio on for ESD 8kV 8 3-3. Vibra ation Pleasse check the e types of vib bration and shock, and the status of resonance.. Mana age MLCC not n to genera ate resonancce and avoid d any kind of o impact to terminals. When MLCC is used u in a vibration enviro onment, plea ase make su ure to contacct us for the e situation ecial MLCC such s as Soft--term, etc. and consider spe 3-4. Shock k Mecha anical stress caused by a drop may cause dama ages to a die electric or a crack in MLCC Do no ot use a drop pped MLCC to avoid anyy quality and d reliability deterioration d n. When n piling up or o handling printed p circu it boards, do o not hit ML LCC with thee corners of a PCB to nt cracks or any other damages d to tthe MLCC. preven 3-5. Piezo o-electric Phenomeno on ate a noise due d to vibra tion at specific frequenc cy when usin ng the high dielectric MLCC may genera ant MLCC (C Class Ⅱ) at AC A or Pulse ccircuits. consta MLCC may cause a noise if MLCC M is affeccted by any mechanical vibrations v orr shocks. 18 MLCC Pro oduct Manual 4. Processs of Mounting and d Soldering g 4-1. Moun nting 4-1-1. Mounting positio on It is rrecommended to locate e the major aaxis of MLCC C in parallel to the directtion in which the stress is ap pplied. Reco ommended ed Not recommende n the cuto out 4-1-2. Cauttions during mounting near Pleasse take the following f me easures to eeffectively red duce the stress generateed from the cutting of PCB. Select the mounting m location show wn below, sin nce the mech hanical stresss is affected d by a M mountted near the e cutting line e. locattion and a direction of MLCC n screw 4-1-3. Cauttions during mounting near If MLLCC is moun nted near a screw s hole, tthe board deflection ma ay be occurre red by screw w torque. Mount MLCC as far from the e screw holees as possible. Not N recomm mended 19 Recommended MLCC Product Manual 4-2. Caution before Mounting 4-2-1. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from the reel. 4-2-2. Check the capacitance characteristics under actual applied voltage. 4-2-3. Check the mechanical stress when actual process and equipment is in use. 4-2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly. Heat treatment must be done prior to measurement of capacitance. 4-2-5. Check the solderability of MLCC that has passed shelf life before use. 4-2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC. 4-3. Cautions during Mounting with Mounting (pick-and-place) Machines 4-3-1. Mounting Head Pressure Excessive pressure may cause cracks in MLCC. It is recommended to adjust the nozzle pressure within the maximum value of 300g.f. Additional conditions must be set for both thin film and special purpose MLCC. 4-3-2. Bending Stress When using a two-sided substrate, it is required to mount MLCC on one side first before mounting on the other side due to the bending of the substrate caused by the mounting head. Support the substrate as shown in the picture below when MLCC is mounted on the other side. If the substrate is not supported, bending of the substrate may cause cracks in MLCC. 4-3-3. Suction nozzle Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of the nozzle. This may cause cracks in MLCC due to the excessive force during mounting. If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during positioning. A regular inspection such as maintenance, monitor and replacement for the suction nozzle and mounting claw should be conducted. 20 MLCC Pro oduct Manual 4-4. Reflo ow solderin ng MLCC is in a direcct contact with the disso olved solder during soldering, which h may be exposed to poten ntial mechanical stress ca aused by thee sudden tem mperature change. Thereffore, MLCC may m be conttaminated b by the locatio on movemen nt and flux. For th he reason, th he mounting process mu ust be closely monitored d. Method M Classification n In nfrared rays Overaall heating Hot plate VPS S(Vapor phasse) Reflo ow soldering g Air heater Locaal heating Laser Light L beam 4-4-1. Reflo ow Profile [Reflow S Soldering Co onditions] he peak tem mperature (26 60℃) and tim me (30sec) aas shown. Use ccaution not to exceed th Pre-h heating is ne ecessary for all constitueents includin ng the PCB to prevent th he mechaniccal damages on M MLCC. The te emperature difference d beetween the PCB and the e componen nt surface mu ust be kept to th he minimum.. As fo or reflow soldering, it is recommend ded to keep the numberr of reflow so oldering to less than three e times. Plea ase check witth us when the number of reflow so oldering neeeds to exceed three timess. Care mustt be exercise ed especiallyy for the ultrra-small size,, thin film an nd high capacitance MLCC C as they ca an be affecte ed by thermaal stress mo ore easily. 21 MLCC Product Manual 4-4-2. Reflow temperature The following quality problem may occur when MLCC is mounted with a lower temperature than the reflow temperature recommended by a solder manufacturer. The specified peak temperature must be maintained after taking into consideration the factors such as the placement of peripheral constituent and the reflow temperature. ･Drop in solder wettability ･Solder voids ･Potential occurrence of whisker ･Drop in adhesive strength ･Drop in self-alignment properties ･Potential occurrence of tombstones 4-4-3. Cooling Natural cooling with air is recommended. 4-4-4. Optimum solder flux for reflow soldering · Overly the thick application of solder pastes results in an excessive solder fillet height. This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which may cause cracks in MLCC. · Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to isolate from PCB · Check if solder has been applied uniformly after soldering is completed. Not enough solder Too Much Solder Weak holding force may cause bad large stress may cause cracks connections or detaching of the capacitor · It is required to design a PCB with consideration of a solder land pattern and its size to apply an appropriate amount of solder to MLCC. The amount of the solder at the edge may impact directly on cracks in MLCC. · The design of a suitable solder land is necessary since the more the solder amount is, the larger the force MLCC experiences and the higher the chance MLCC cracks. 22 MLCC Pro oduct Manual 4-5. Flow soldering 4-5-1. Flow w profile [Flow So oldering Con nditions] Ta mperature (260℃) and time (5sec) ass shown. ake caution not to exceed peak tem In n case of flow soldering,, only 1608(0 0603inch), 2012(0805inch), 3216(12006inch) case size are re ecommended to use. Please contacct us before use the typ e of high ca apacitance an nd thin film MLCC for so ome exxceptions th hat may be caused. c F solderin ng 4-5-2. Cauttion before Flow · Wh hen a sudden n heat is applied to MLC CC, the mechanical rigidity of MLCC is deteriora ated by the internal deforma ation of MLC CC. Preheatin ng all the constituents in ncluding PCB B is required to prevent mechanical damages d on MLCC. The temperature e difference between thee solder and d the the m surfa ace of MLCC must be kept to the m inimum. e is too long g or the flow w temperaturre is too high, the adhessive strength h with PCB · If the flow time ated by the leaching ph enomenon of o the outer termination n, or the capacitance may be deteriora e may be dro opped by weak adhesio on between the t internal termination and the outter value termination. 23 MLCC Product Manual 4-6. Soldering Iron Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature soldering iron tip may come into a direct contact with the ceramic body of MLCC due to the carelessness of an operator. Therefore, the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. 4-6-1. How to use a soldering Iron · In order to minimize damages on MLCC, preheating MLCC and PCB is necessary. A hot plate and a hot air type preheater should be used for preheating . Do not cool down MLCC and PCB rapidly after soldering. · Keep the contact time between the outer termination of MLCC and the soldering iron as short as possible. Long soldering time may cause problems such as adhesion deterioration by the leaching phenomenon of the outer termination. Variation of Soldering Pre-heating Soldering Cooling Temp. Temp.(℃) Time(sec) Time(sec) Time(sec) ΔT ≤ 130 300±10℃ max ≥60 ≤4 - * Control Δ T in the solder iron and preheating temperature. Condition of Iron facilities Wattage Tip diameter Soldering time 20W max 3 ㎜ max 4sec max * Caution - Iron tip should not contact with ceramic body directly Lead-free solder: Sn-3.0Ag-0.5CU 4-6-2. How to use a spot heater Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and the PCB, which is likely to lessen the thermal shocks. For a high density PCB, a spot heater can prevent the problem to connect between a solder iron and MLCC directly. · If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the thermal stress. Follow the conditions set in the table below to prevent this problem. · The spot heater application angle as shown in the figure is recommended to create a suitable solder fillet shape. 24 MLCC Product Manual Distance 5㎜ ≤ Hot Air Application angle 45℃ Hot Air Temperature Nozzle Outlet 400℃ ≥ Application Time 10s＞ 4-6-3. Cautions for re-work · Too much solder amount will increase the risk of PCB bending or cause other damages. · Too little solder amount will result in MLCC breaking loose from the PCB due to the inadequate adhesive strength. · Check if the solder has been applied properly and ensure the solder fillet has a proper shape. * Soldering wire below ø0.5mm is required for soldering. 4-7. Cleaning 4-7-1. In general, cleaning is unnecessary if rosin flux is used. When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the performance of MLCC. This means that the cleansing solution must be carefully selected and should always be new. 4-7-2. Cautions for cleaning MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong during cleaning. When high pressure cleaning equipment is used, test should be done for the cleaning equipment and its process before the cleaning in order to avoid damages on MLCC. 25 MLCC Product Manual 4-8. Cautions for using electrical measuring probes · Confirm the position of the support pin or jig when checking the electrical performance of MLCC after mounting on the PCB. · Watch for PCB bending caused by the pressure of a test-probe or other equipment. · If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may be damaged. · Avoid PCB flexing by using the support pin on the back side of the PCB. · Place equipment with the support pin as close to the test-probe as possible. · Prevent shock vibrations of the board when the test-probe contacts a PCB. Not recommended Recommended 4-9. Printed Circuit Board Cropping · Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC on the PCB. · The stress as shown may cause cracks in MLCC when cutting the board. · Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit. · Avoid these types of stresses applied to MLCC. [Bending] [Twisting] 4-9-1. Cautions for cutting PCB Check a cutting method of PCB in advance. The high density board is separated into many individual boards after the completion of soldering. If the board is bent or deformed during separation, MLCC may be cracked. Carefully select a separation method that minimizes the deformation of the PCB. 26 MLCC Product Manual 4-10. Assembly Handling 4-10-1. Cautions for PCB handling Hold the edges of the board mounted with MLCC with both hands since holding with one hand may bend the board. Do not use dropped boards, which may degrade the quality of MLCC. 4-10-2. Mounting other components Pay attention to the following conditions when mounting other components on the back side of The board after MLCC has been mounted on the front side. When the suction nozzle is placed too close to the board, board deflection stress may be applied to MLCC on the back side, resulting in cracks in MLCC. Check if proper value is set on each chip mounter for a suction location, a mounting gap and a suction gap by the thickness of components. 4-10-3. Board mounting components with leads If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder joint may be cracked. Pay attention to the following: · Reduce the stress on the board during insertion by increasing the size of the lead insertion hole. · Insert components with leads into the board after fixing the board with support pins or a dedicated jig. · Support the bottom side of the board to avoid bending the board. · Check the status of the height of each support pin regularly when the support pins are used. Not recommended Recommended 27 MLCC Product Manual 4-10-4. Socket and / or connector attach / detach Since the insertion or removal from sockets and connectors may cause the board to bent, make sure that MLCC mounted on the board should not be damaged in this process. 4-10-5. Fastening screw When attaching a shield on a board, the board may be bent during a screw tightening work Pay attention to the following conditions before performing the work. · Plan the work to prevent the board from bending · Use a torque driver to prevent over-tightening of the screw. · Since the board may be bent by soldering, use caution in tightening the screw. 4-11. Adhesive selection Pay attention to the following if an adhesive is used to position MLCC on the board before soldering. 4-11-1. Requirements for Adhesives · They must have enough adhesive strength to prevent MLCC from slipping or moving during the handling the board. · They must maintain their adhesive strength when exposed to soldering temperatures. · They should not spread when applied to the PCB. · They should have a long pot life. · They should hardened quickly. · They should not corrode the board or MLCC materials. · They should be an insulator type that does not affect the characteristic of MLCC. · They should be non-toxic, not harmful, and particularly safe when workers touch the adhesives. 4-11-2. Caution before Applying Adhesive Check the correct application conditions before attaching MLCC to the board with an adhesive. If the dimension of land, the type of adhesives, the amount of coating, the contact surface areas, the curing temperature, or other conditions are not appropriate, it may degrade the MLCC performance. 28 MLCC Product Manual 4-11-3. Cautions for selecting Adhesive Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded. In addition, MLCC may be cracked by the difference in contractile stress caused by the different contraction rate between MLCC and the adhesive. 4-11-4. Cautions for the amount of applied adhesive and curing temperature · The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the a mounting defect in MLCC · Excessive use of the adhesive may cause a soldering defect, loss of electrical connection, incorrect curing, or slippage of a mounting position, thereby an inflow of the adhesive onto a land section should be avoided. · If the curing temperature is too high or the curing time is too long, the adhesive strength will be degraded. In addition, oxidation both on the outer termination (Sn) of MLCC and the surface of the board may deteriorate the solderability. 4-12. Flux 4-12-1. The excessive amount of flux generates excessive flux gases which may deteriorate solderability. Therefore, apply the flux thin and evenly as a whole. 4-12-2. Flux with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not done properly. Therefore, use flux with a halogen content of 0.1% max. 4-12-3. Strong acidic flux can degrade the MLCC performance 4-12-4. Check the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the mounting process. 4-13. Coating 4-13-1. Crack caused by Coating A crack may be caused in the MLCC due to amount of the resin and stress of thermal contraction of the resin during coating process. During the coating process, the amount of resin and the stress of thermal contraction of the resin may cause cracks in MLCC The difference of thermal expansion coefficient between the coating, or a molding resin may cause destruction, deterioration of insulation resistance or dielectric breakdown of MLCC such as cracks or detachment, etc. 29 MLCC Product Manual 4-13-2. Recommended Coating material · A thermal expansion coefficient should be as close to that of MLCC as possible. · A silicone resin can be used as an under-coating to buffer the stress. · The resin should have a minimum curing contraction rate. · The resin should have a minimum sensitivity (ex. Epoxy resin). · The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is used in a high humidity condition. · Do not use strong acid substances due to the fact that coating materials inducing a family of halogen substances and organic acid may corrode MLCC. 30 MLCC Product Manual 5. Design 5-1. Circuit design When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the drop in insulation resistance. Therefore, it is required to install safety equipment such as a fuse to prevent additional accidents when MLCC is short-circuited, otherwise, electric short and fire may occur. This product is not a safety guaranteed product.. 5-2. PCB Design 5-2-1. Unlike lead type components, SMD type components that are designed to be mounted directly on the board are fragile to the stress. In addition, they are more sensitive to mechanical and thermal stress than lead type components. 5-2-2. MLCC crack by PCB material type A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal expansion and contraction, resulting in cracks in MLCC. Even though MLCC is mounted on a board with a fluorine resin or on a single-layered glass epoxy, cracks in MLCC may occur. 5-3. Design system evaluation 5-3-1. Evaluate the actual design with MLCC to make sure there is no functional issue or violation of specifications of the finished goods. 5-3-2. Please note that the capacitance may differ based on the operating condition of the actual system since Class 2 MLCC capacitance varies with applied voltage and temperature. 5-3-3. Surge resistance must be evaluated since the excessive surge caused by the inductance of the actual system may apply to MLCC. 5-3-4. Note the actual MLCC size and the termination shape. 31 MLCC Pro oduct Manual 5-4 Land d dimension The reccommended d land dimen nsion is deteermined by evaluating e th he actual SETT and a board. R Reflow Foo otprint Chip Size Chip Tol. a b c (a+2b) (a+2b) [mm] [mm] [mm] [mm] [mm] min 0402 ± 0.02 0.14~0.20 0.14~0.22 0.20~0.26 0.42 max 0.64 ± 0.03 0.16~0.20 0.24~0.32 0.30~0.35 0.64 0.84 ± 0.05 0.18~0.26 0.24~0.32 0.32~0.37 0.66 0.9 ± 0.07 0.20~0.28 0.25~0.35 0.35~0.39 0.7 0.98 ± 0.09 0.22~0.30 0.25~0.35 0.35~0.39 0.72 1 ± 0.05 0.35~0.40 0.37~0.47 0.50~0.55 1.09 1.34 ± 0.07 0.37~0.42 0.37~0.47 0.52~0.58 1.11 1.36 ± 0.10 0.40~0.45 0.37~0.47 0.55~0.60 1.14 1.39 ± 0.15 0.40~0.45 0.40~0.50 0.60~0.65 1.2 1.45 ± 0.20 0.45~0.50 0.40~0.50 0.65~0.70 1.25 1.5 ± 0.30 0.45~0.50 0.42~0.52 0.70~0.75 1.29 1.54 ± 0.40 0.50~0.55 0.45~0.55 0.75~0.80 1.4 1.65 ± 0.10 0.50~0.55 0.60~0.65 0.80~0.85 1.7 1.85 ± 0.15 0.55~0.60 0.62~0.67 0.85~0.90 1.79 1.94 ± 0.20 0.60~0.65 0.65~0.70 0.90~0.95 1.9 2.05 ± 0.25 0.65~0.70 0.70~0.75 0.95~1.00 2.05 2.2 ± 0.30 0.70~0.75 0.75~0.80 1.00~1.05 2.2 2.35 ±0.10 0.70~0.75 0.75~0.80 1.25~1.30 2.2 2.35 ±0.15 0.75~0.80 0.80~0.85 1.30~1.35 2.35 2.5 ±0.20 0.80~0.85 0.85~0.90 1.35~1.40 2.5 2.65 ±0.25 0.85~0.90 0.95~1.00 1.40~1.45 2.75 2.9 ±0.30 0.90~0.95 1.05~1.10 1.45~1.50 3 3.15 ±0.20 1.70~1.90 0.85~1.00 1.60~1.80 3.4 3.9 ±0.30 1.80~2.00 0.95~1.10 1.70~1.90 3.7 4.2 3225 - 2.00~2.40 1.00~1.40 1.80~2.20 4 5.2 4532 - 2.80~3.20 1.40~1.80 2.40~3.00 5.6 6.8 5750 - 4.00~4.60 1.70~2.30 4.10~4.90 7.4 9.2 Chip Size Chip Tol. a b c (a+2b) (a+2b) [mm] [mm] [mm] [mm] [mm] min max 1608 - 0.60~1.00 0.60~0.80 0.60~0.80 1.8 2.6 2012 - 1.00~1.20 0.80~1.20 0.80~1.20 2.6 3.6 3216 - 2.00~2.40 1.00~1.20 1.00~1.40 4.0 4.8 0603 1005 1608 2012 3216 F Flow Footp print 32 MLCC Product Manual 6. Others 6-1. Storage environment 6-1-1. Recommendation for temperature/humidity Even taping and packaging materials are designed to endure a long-term storage, they should be stored with a temperature of 0~40°C and an RH of 0~70% otherwise, too high temperatures or humidity may deteriorate the quality of the product rapidly. As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is, the better the solderability is. As the temperature difference may cause dew condensation during the storage of the product, it is a must to maintain a temperature control environment 6-1-2. Shelf Life An allowable storage period should be within 6 months from the outgoing date of delivery in consideration of solderability. As for products in storage over 6 months, please check solderability before use. 6-2. Caution for corrosive environment As corrosive gases may deteriorate the solderability of MLCC outer termination, it is a must to store MLCC in an environment without gases. MLCC that is exposed to corrosive gases may cause its quality issues due to the corrosion of plating layers and the penetration of moisture. 6-3. Equipment in operation 6-3-1. Do not touch MLCC directly with bare hands to prevent an electric shock or damage. 6-3-2. The termination of MLCC shall not be contacted with a conductive object (short –circuit). Do not expose MLCC to conductive liquid containing acidic or alkaline material. 6-3-3. Do not use the equipment in the following conditions. (1) Exposure to water or oil (2) Exposure to direct sunlight 33 MLCC Product Manual (3) Exposure to Ozone or ultra-violet radiation. (4) Exposure to corrosive gas (e.g. hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas) (5) Exposure to vibration or mechanical shock exceeding specified limit (6) Exposure to high humidity 6-3-4. If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug from the power source. If the equipment is not switched off or unplugged, serious damage may occur due to the continuous power supply. Please be careful with the high temperature in this condition. 6-4. Waste treatment In case of scrapping MLCC, it is incinerated or buried by a licensed industrial waste company. When scrapping MLCC, it is recommended to incinerate or bury the scrappage by a licensed industrial waste company. 6-5. Operating temperature The operating temperature limit is determined by the specification of each models. 6-5-1. Do not use MLCC over the maximum operating temperature. Pay attention to equipment’s temperature distribution and the seasonal fluctuation of ambient temperature. 6-5-2. The surface temperature of MLCC cannot exceed the maximum operating temperature including self-heating effects. 6-6. Transportation The performance of MLCC may be affected by transportation conditions. 6-6-1. MLCC shall be protected from excessive temperature, humidity and a mechanical force during transportation. 34 MLCC Product Manual During transportation, the cartons shall not be deformed and the inner packaging shall be protected from excessive external forces. 6-6-2. Do not apply excessive vibrations, shocks or excessive forces to MLCC. · If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack. · When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a tweezer, etc, MLCC may crack or become short-circuited. 6-6-3. MLCC may crack and become non-functional due to the excessive shocks or dropping during transportation. 6-7. Notice Some special products are excluded from this document. Please be advised that this is a standard product specification for a reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers. 35 MLCC Product Manual Caution of Application Disclaimer The products listed as follows are NOT designed and manufactured for any use and applications set forth below. Please note that any misuse of the products deviating from products specifications or information provided in this Spec sheet may cause serious property damages or personal injury. ① Aerospace/Aviation equipment ② Automotive of Transportation equipment (vehicles，trains，ships，etc) ③ Military equipment ④ Atomic energy-related equipment ⑤ Undersea equipment ⑥ Any other applications with the same as or similar complexity or reliability to the applications Limitation Please contact us with usage environment information such as voltage, current, temperature, or other special conditions before using our products for the applications listed below. The below application conditions require especially high reliability products to prevent defects that may directly cause damages or loss to third party's life, body or property. If you have any questions regarding this 'Limitation'，you should first contact our sales personnel or application engineers. ① Medical equipment ② Disaster prevention/crime prevention equipment ③ Power plant control equipment ④ Traffic signal equipment ⑤ Data-processing equipment ⑥ Electric heating apparatus，burning equipment ⑦ Safety equipment ⑧ Any other applications with the same as or similar complexity or reliability to the applications 36