SPECIFICATION
· Supplier : Samsung electro-mechanics
· Product : Multi-layer Ceramic Capacitor
(Reference sheet)
CL10A226MO7JZNC
CAP, 22㎌, 16V, ±20%, X5R, 0603
· Samsung P/N :
· Description :
A. Samsung Part Number
CL
①
① Series
② Size
③ Dielectric
④ Capacitance
⑤ Capacitance
tolerance
⑥ Rated Voltage
⑦ Thickness
10
②
A
③
226
④
M
⑤
O
⑥
7
⑦
J
⑧
Z
⑨
N
⑩
C
⑪
Samsung Multi-layer Ceramic Capacitor
0603 (inch code)
L : 1.60 ± 0.30
W : 0.80 ± 0.30
Low profile
⑧ Thickness division
Ni
X5R
Inner electrode
Cu
22 ㎌
Termination
Sn 100%
±20 %
(Pb Free)
Plating
Size control code
⑨ Product
16 V
Reserved for future use
⑩ Special
Cardboard Type, 7" reel
0.70 ± 0.10
⑪ Packaging
B. Structure & Dimension
Dimension(㎜)
Samsung P/N
CL10A226MO7JZNC
L
W
T
BW
1.60 ± 0.30
0.80 ± 0.30
0.70 ± 0.10
0.30 ± 0.20
1
C. Samsung Reliablility Test and Judgement Condition
Judgement
Capacitance
Tan δ (DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characteristics
Adhesive Strength
of Termination
Bending Strength
Solderability
Test condition
120㎐ ±20% / 0.5±0.1Vrms
*A capacitor prior to measuring the capacitance is heat
treated at 150℃+0/-10℃ for 1hour and maintained in
ambient air for 24±2 hours.
Rated Voltage 60~120 sec
Within specified tolerance
0.15 max.
10,000Mohm or 10Mohm×㎌
Whichever is smaller
No abnormal exterior appearance
Microscope (×10)
250% of the rated voltage
No dielectric breakdown or
mechanical breakdown
X5R
(From -55℃ to 85℃, Capacitance change should be within ±15%)
No peeling shall be occur on the
500g·f, for 10±1 sec.
terminal electrode
Capacitance change :
within ±12.5%
Bending to the limit (1㎜)
with 1.0mm/sec.
More than 75% of terminal surface
SnAg3.0Cu0.5 solder
is to be soldered newly
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Soldering Heat
Vibration Test
Moisture
Resistance
High Temperature
Resistance
Temperature
Cycling
Capacitance change :
Tan δ, IR : initial spec.
Capacitance change :
Tan δ, IR : initial spec.
within ±15%
Solder pot : 270±5℃, 10±1sec.
initial spec.
Amplitude : 1.5mm
Capacitance change :
within ±12.5%
Tan δ :
0.25 max
IR :
500Mohm or 1Mohm × ㎌
Whichever is smaller
Capacitance change :
within ±12.5%
Tan δ :
0.25 max
IR :
1,000Mohm or 2Mohm × ㎌
Whichever is smaller
Capacitance change :
within ±15%
Tan δ, IR : initial spec.
From 10㎐ to 55㎐ (return : 1min.)
2hours × 3 direction (x, y, z)
With rated voltage
40±2℃, 90~95%RH, 500+12/-0hrs
With 100% of the rated voltage
Max. operating temperature
1,000+48/-0hrs
1 cycle condition
Min. operating temperature
Max. operating temperature
→
5 cycle test
※ The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260±5℃, 30sec. )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
2
→
→
25℃
25℃
MLCC Pro
oduct Manual
E. Recomm
mended TE
EST PCB
( Adhesive strength of termination))
Size cod
de
Sizze (mm)
a
b
c
02
0..4 × 0.2
0.20
0.1
17
0.26
03
0..6 × 0.3
0.30
0.3
30
0.30
05
1.0
0. × 0.5
0.40
0.5
55
0.50
10
1..6 × 0.8
1.00
1.0
00
1.20
21
2.0
0 × 1.25
1.20
1.4
40
1.65
31
3..2 × 1.6
2.20
1.4
40
2.00
32
3..2 × 2.5
2.20
1.4
40
2.90
43
4..5 × 3.2
3.50
1.7
75
3.70
55
5..7 × 5.0
4.50
1.7
75
5.60
c
b
a
d
e
(Subsstrate for be
ending strength test)
☞
☞
(Su
ubstrate for R
Reliability te
est)
Sizze code
Size (mm)
a
b
c
d
e
02
0.4 × 0.2
0.2
0.6
0.2
2
5.0
5.5
03
0.6 × 0.3
0.3
0.9
0.3
3
5.0
5.5
05
1.0 × 0.5
0.4
1.5
0.5
5
5.0
5.5
10
1.6 × 0.8
1.0
3.0
1.2
2
5.0
5.5
21
2.0 × 1.25
1.2
4.0
1.6
65
5.0
5.5
31
3.2 × 1.6
2.2
5.0
2.0
0
5.0
5.5
32
3.2 × 2.5
2.2
5.0
2.9
9
5.0
5.5
43
4.5 × 3.2
3.5
7.0
3.7
7
5.0
5.5
55
5.7 × 5.0
4.5
8.0
5.6
6
5.0
5.5
al : Glass epoxy substratte
Materia
: Copper foil
f (T=0.035
5 ㎜)
☞ TThickness : T=1.6
T
㎜ (T= 0.8 ㎜ for 003/05)
☞
: So
older resist
KSD 6704) with
w 3% silverr is used.
☞ Caution : Abnormaliity can occur if lead-bassed solder (K
3
MLCC Pro
oduct Manual
1. Packag
ging
This spe
ecification applies
a
to ta
aping of MLLCC
When ccustomers re
equire, the specification
s
n may be ch
hanged und
der the agreeement.
1-1. Figure
1-2. Quan
ntity
[unit:pcs]
Type
Size Code
Chip
Inch(mm)
Thickness
Plastic
Plasttic
7 inches reel
10 inches reel
13 inches reel
0402 (01005)
2mm
20k
-
100K
K
PAPER
2mm
10K
-
50K
K
PAPER
2mm
10K
-
50K
K
0.8 mm
PAPER
4mm
4K
10K
15K / 10K
1
T≤0.85 mm
PAPER
4mm
4K
10K
15K / 10K
1
T≥1.0 mm
EMBOSSED
D
4mm
2K
6K
10K
K
T≤0.85 mm
PAPER
4mm
4K
10K
10K
K
T≥1.0 mm
EMBOSSED
D
4mm
2K
4K
10K
K
T≤1.6 mm
EMBOSSED
D
4mm
2K
4K
10K
K
T≥2.0 mm
EMBOSSED
D
4mm
1K
4K
4K
T≤1.6 mm
EMBOSSED
D
8mm
2k
-
8k
T≥2.0 mm
EMBOSSED
D
8mm
1k
-
4k
T≤2.0 mm
EMBOSSED
D
8mm
-
-
4K
T>2.0 mm
EMBOSSED
D
8mm
-
-
2K
T≥2.5 mm
EMBOSSED
D
8mm
-
-
2K
Pitch
0.2 mm
PAPER
0603 (0201)
0.3 mm
1005 (0402)
0.5 mm
1608 (0603)
2012 (0805)
MLCC
Plastic
Taping Typ
pe
3216 (1206)
3225 (1210)
4520 (1808)
4532 (1812)
5750 (2220)
4
MLCC Product Manual
1-3. Tape Size
1-3-1. Cardboard(Paper) tape : 4mm pitch
[unit:mm]
Size
Inch(mm)
0603
(1608)
0805
(2012)
1206
(3216)
A
B
W
F
E
P1
P2
P0
D
t
1.00
±0.10
1.55
±0.10
2.05
±0.10
1.90
±0.10
2.30
±0.10
3.60
±0.10
8.00
±0.30
3.50
±0.05
1.75
±0.10
4.00
±0.10
2.00
±0.05
4.00
±0.10
φ1.50
+0.10/-0
1.1
Below
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
1-3-2. Cardboard(Paper) tape : 2mm pitch
[unit:mm]
Size
Inch(mm)
A
B
01005
(0402)
0.25
±0.02
0.46
±0.02
0201
(0603)
0.38
±0.03
0.68
±0.03
0402
(1005)
0.62
±0.05
1.12
±0.05
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10
W
F
E
P1
P2
P0
D
t
0.25
±0.02
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0.35
±0.03
0.60
±0.05
0.37
±0.03
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
5
MLCC Product Manual
1-3-3. Embossed(Plastic) tape
[unit:mm]
Size
A
B
W
F
E
P1
P2
P0
D
01005
0.23
0.45
4.00
1.80
0.90
1.00
1.00
2.00
φ0.80
(0402)
±0.02
±0.02
±0.05
±0.02
±0.05
±0.02
±0.02
±0.03
±0.04
Inch(mm)
φ1.50
t1
0.35
0.50
Below
Below
015008
0.32
0.58
2.00
(05025)
±0.03
±0.03
±0.05
0603
1.05
1.90
(1608)
±0.15
±0.15
0805
1.45
2.30
(2012)
±0.20
±0.20
1206
1.90
3.50
(3216)
±0.20
±0.20
1210
2.80
3.60
(3225)
±0.20
±0.20
1.75
2.00
4.00
1808
2.30
4.90
±0.10
±0.05
±0.10
(4520)
±0.20
±0.20
1812
3.60
4.90
12.0
5.60
8.00
(4532)
±0.20
±0.20
±0.30
±0.05
±0.10
Below
2220
5.50
6.20
(5750)
±0.20
±0.20
0.62
1.12
+0.05
+0.05
/-0.10
/-0.10
8.00
3.50
4.00
2.50
0306
1.10
1.90
±0.30
±0.05
±0.10
Below
(0816)
±0.20
±0.20
0204
(0510)
8.00
3.50
±0.30
±0.05
+0.10
t0
/-0.03
4.00
2.50
±0.10
Below
φ1.50
0.60
+0.10
/-0
Below
3.80
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
6
MLCC Pro
oduct Manual
1-3-4. Reel Size
[unit:mm]
Symbol
7”Reel
10”Reel
13”Reel
Tape Widtth
A
B
C
D
E
W
t
4mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
5±0.5
1.2±0.2
8mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
10±1.5
0.9±0.2
12mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
13±0.5
1.2±0.2
8mm
φ258±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
10±1.5
1.8±0.2
8mm
φ330±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
10±1.5
1.8±0.2
12mm
φ330±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
13±0.5
2.2±0.2
1-4. Coverr tape peel-off force
1-4-1. Peel--off force
10 g.f ≤ peel-offf force ≤ 70
0 g.f
1-4-2. Meassurement Method
ping Packaging design : Packaging design follows IEC 6028
86-3 standard
d.
-Tap
(IEC 60286-3 Packaging
P
off componen ts for autom
matic handlin
ng - parts 3)
* If the static ele
ectricity of SM
MT process causes any problems, please contacct us.
7
MLCC Pro
oduct Manual
1-5. BOX package
1-5-1. Packkaging Label
REELL & Box Type
e
Labe
el includes th
he informatio
on as below.
w.
1) Chip size
2) Temperature
e Characterisstics
3) Nominal Ca
apacitance
4) Model Nam
me
5) LOT Numbe
er & Reel Nu
umber
6) Q’ty
1-5-2. Box Packaging
1) Double packagin
of inner boxx and outer box.
ng with the paper type o
b
2) Avoiid any dama
ages during transportatio
on by car, aiirplane and ship.
s
3) Rem
mark informattion of contents on inneer box and outer
o
box
※ If sp
pecial packag
ging is required, please ccontact us.
1-5-3. 7" Bo
ox packaging
g
[ Unit : mm
m ]
- Inner Box (7"" x 10 REEL)
- Innerr Box (7" x 5 REEL )
- Outerr Box (7" x 20
2 REEL)
- Outer Box (7" x 60 REEEL)
8
MLCC Product Manual
1-5-4. 13” Box packaging
- Inner Box (13" x 4 REEL)
- Outer Box (13" x 20 REEL)
1-6. Chip Weight
Size(L/W)
Size(T)
Inch(mm)
(mm)
Temp.
Weight
Size(L/W)
Size(T)
(mg/pc)
Inch(mm)
(mm)
0.20
C0G
0.082
0.20
X7R
0.083
0.20
X5R
0.093
0.50
C0G
1.182
0.50
X7R
1.559
0.50
X5R
1.560
0.65
C0G
7.192
1.25
X7R
16.523
1.25
X5R
16.408
1210
2.50
X7R
116.197
(3225)
2.50
X5R
121.253
1.25
X7R
96.697
01005
(0402)
0402
(1005)
0805
(2012)
1812
(4532)
Temp.
Weight
(mg/pc)
0.30
C0G
0.233
0.30
X7R
0.285
0.30
X5R
0.317
0.80
C0G
4.615
0.80
X7R
5.522
0.80
X5R
5.932
1.25
C0G
28.086
1.60
X7R
54.050
1.60
X5R
45.600
1808
1.25
C0G
47.382
(4520)
1.25
X7R
63.136
1.60
X7R
260.897
0201
(0603)
0603
(1608)
1206
(3216)
2220
(5750)
The weight of product is typical value per size, for more details, please contact us.
9
MLCC Product Manual
2. Product Characteristic data
2-1. Capacitance
The capacitance is the ratio of the change in an electric charge according to voltage change.
Due to the fact that the capacitance may be subject to change with the measured voltage and
frequency, it is highly recommended to measure the capacitance based on the following
conditions.
2-1-1. Measure capacitance with voltage and frequency specified in this document.
Regarding the voltage/frequency condition for capacitance measurement of each MLCC model,
please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document.
The following table shows the voltage and frequency condition according to the capacitance
range.
[The voltage and frequency condition according to MLCC the capacitance range]
◆ Class I
Capacitance
Frequency
≤ 1,000 pF
1 MHz ± 10%
> 1,000 pF
1 kHz ± 10%
Voltage
0.5 ~ 5 Vrms
◆ Class II
Capacitance
Frequency
Voltage
≤ 10 ㎌
1 kHz ± 10%
1.0 ± 0.2 Vrms
> 10 ㎌
120 Hz ± 20%
0.5 ± 0.1 Vrms
Exception*
1 kHz ± 10%
0.5 ± 0.1 Vrms
Capacitance shall be measured after the heat treatment of 150+0/-10℃
for 1hr, leaving at room temperature for 24±2hr. (Class II)
2-1-2. It is recommended to use measurement equipment with the ALC (Auto Level Control) option.
The reason is that when capacitance or measurement frequency is high, the output voltage of
measurement equipment can be lower than the setting voltage due to the equipment limitation.
Note that when capacitance or measurement frequency is excessively high, the measurement
equipment may show ALC off warning and provide a lower output voltage than the setting
voltage even with ALC option selected. It is necessary to ensure the output voltage of
measurement equipment is the same as the setting voltage before measuring capacitance.
10
MLCC Product Manual
2-1-3. Capacitance value of high dielectric constant (Class II) MLCC changes with applied AC and DC
voltage. Therefore, it is necessary to take into account MLCC’s AC voltage characteristics and DCbias voltage characteristics when applying MLCC to the actual circuit.
2-1-4. The capacitance is in compliance with the EIA RS-198-1-F-2002.
2-2. Tan δ (DF)
2-2-1. An ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of
electrode. DF (Dissipation Factor) is defined as the ratio of loss energy to stored energy and
typically being calculated as percentage.
2-2-2. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy.
The equation can be described as 1/DF. Normally the loss characteristic of Class I MLCC is
presented in Q, since the DF value is so small whereas the loss characteristic of Class II MLCC is
presented in DF.
2-2-3. It is recommended to use Class I MLCC for applications to require good linearity and low loss
such as coupling circuit, filter circuit and time constant circuit.
2-3. Insulation Resistance
Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties.
Insulation resistance is defined as the ratio of a leakage current to DC voltage.
2-3-1. When applying DC voltage to MLCC, a charging current and a leakage current flow together at
the initial stage of measurement. While the charging current decreases, and insulation resistance
(IR) in MLCC is saturated by time. Therefore, insulation resistance shall be measured 1 minute after
applying the rated voltage.
2-4. Capacitance Aging
The aging characteristic is that the high dielectric (Class II) MLCC decreases capacitance
value over time. It is also necessary to consider the aging characteristic with voltage and
temperature characteristics when Class II MLCC is used in circuitry.
11
MLCC Pro
oduct Manual
2-4-1. In ge
eneral, aging
g causes cap
pacitance to decrease lin
nearly with th
he log of tim
me as shown
n in the
follow
wing graph. Please checck with SEMC
CO for more
e details, since the valuee may vary between
b
different models.
2-4-2. Afterr heat treatm
ment (150 °C
C, 1hour), thee capacitancce decreased
d by aging iss recovered, so aging
shou
uld be consid
dered again from the tim
me of heat treatment.
[ Example of Capacitan
nce Aging ]
* Samp
ple : C0G, X7
7R, X5R
2-5. Temp
perature Ch
haracteristiics of Capa
acitance (T
TCC)
e consider te
emperature characteristi cs of capacitance since the electricaal characterisstics such ass
Please
capacitance chang
ges which is caused by a change in ceramic die
electric consttant by temp
perature.
2-5-1. It is necessary to
o check the values
v
speci fied in sectio
on “C. Reliab
bility test Co
ondition–Tem
mperature
f the temp
perature and capacitance
e change ran
nge of MLCC
C.
Charracteristics” for
[ Example of Temperature Characteristics (X
X5R) ]
d voltage 6.3
* Sample : 10uF, Rated
3V
[ Ex
xample of Biaas TCC ]
oltage 6.3V
* Sample : 10uF, Rated vo
12
MLCC Pro
oduct Manual
2-5-2. Whe
en selecting MLCC, it is necessary
n
to consider th
he heat chara
acteristics off a system, room
temp
perature and
d TCC of MLC
CC, since thee applied tem
mperature may
m change the capacita
ance of
MLCC
C.
2-5-3. In ad
ddition, Bias TCC of MLC
CC should bee taken into account when DC volta ge is applied
d to MLCC.
2-6. Self-h
heating Temperature
It is n
necessary to
o design the system, with
h considering self-heatin
ng generated
d by the ESR
R
(Equivalent Seriess Resistance)) of MLCC w
when AC volttage or pulse voltage is applied to MLCC.
M
en MLCC is used
u
in an AC voltage orr pulse volta
age circuit, se
elf-heating i s generated when AC
2-6-1. Whe
or pu
ulse current flows throug
gh MLCC. Sh
hort-circuit may
m be occu
urred by the degradation
n of MLCC’s
insulating properties.
2-6-2. The reliability of MLCC may be affected by MLCC be
eing used in an AC voltaage or pulse
e voltage
w
the ra
ange of rated
d voltage.
circuit, even the AC voltage or the pulsee voltage is within
efore, make sure to checck the follow
wing conditions.
There
1) Th
he surface te
emperature of
o MLCC mu
ust stay within the maxim
mum operatiing tempera
ature after
AC
C or Pulse vo
oltage is app
plied.
2) Th
he rise in inccrease by sellf-heating off MLCC mustt not exceed
d 20℃
[ Examp le of Ripple current ]
* Sample
S
: X5R
R 10uF, Rate
ed voltage 6..3V
13
MLCC Pro
oduct Manual
2-7. DC & AC Voltag
ge Charactteristics
It is rrequired to consider
c
volttage charactteristics in th
he circuit sin
nce the capaacitance value of high
dielecctric constan
nt MLCC(Class II) is chan
nged by app
plied DC & AC
A voltage.
2-7-1. Pleasse ensure the capacitancce change iss within the allowed ope
erating rangee of a system
m. In
particular, when high dielectric constant type MLCC (Class II) is used in circu
uit with narrrow allowed
be designed
d with consid
dering DC vo
oltage, temp
perature
capacitance tolerrance, a systtem should b
acteristics an
nd aging cha
aracteristics of MLCC.
chara
[ Example off DC Bias cha
aracteristics ]
* Sample : X5 R 10uF, Rated voltage 6.3
3V
2-7-2. It is necessary to
o consider th
he AC voltag
ge characteristics of MLC
CC and the A
AC voltage of
o a system,
e the capacittance value of high dieleectric consta
ant type MLC
CC (Class II) varies with the applied
since
AC vvoltage.
[ Example
E
of A
AC voltage characteristic
c
cs ]
* Sample
S
: X5R
R 10uF, Rate
ed voltage 6..3V
14
MLCC Pro
oduct Manual
2-8. Impedance Characteristic
Electrrical impedance (Z) of MLCC
M
is the m
measuremen
nt of the opp
position thatt MLCC pressents to a
curre
ent (I) when a voltage (V
V) is applied. It is defined
d as the ratio
o of the volttage to the current
c
(Z=V//I). Impedan
nce extends the
t concept of resistancce to AC circuits and is a complex number
consiisting of the real part off resistance ((R) and the imaginary
i
pa
art of reactaance (X) as Z=R+jX.
Z
There
efore, it is re
equired to de
esign circuit with consid
deration of th
he impedancce characterristics of
MLCC
C based on the
t frequenccy ( Z = R + jX )
2-8-1. MLCC operates as
a a capacito
or in the low
w frequency and its reactance (XC) d
decreases ass frequency
incre
eases ( X_C=1/j2πfC ) wh
here f is freq
quency and C is capacita
ance.
The resistance (E
ESR; Equivale
ent Series Reesistance) off MLCC in th
he low frequeency mainly comes
from
m the loss of its dielectricc material.
2-8-2. MLCC operates as
a an inducttor in the hig
gh frequency
y and the inductance off MLCC is ca
alled ESL
(Equiivalent Serie
es Inductance
e). The reacttance (XL) off MLCC in th
he high frequ
uency increa
ases as
frequ
uency increases ( X_L=j2
2πf∙ESL ). Thee resistance (ESR) of ML
LCC in the hiigh frequenccy mainly
come
es from the loss of its electrode meetal.
2-8-3. SRF (Self Resona
ant Frequenccy) of MLCC is the frequ
uency where its capacitivve reactance (XC) and
inducctive reactan
nce(XL) cancel each otheer and the im
mpedance of MLCC has only ESR at SRF.
o MLCC can
n be measurred by a nettwork analyzer or an imp
pedance ana
alyzer.
2-8-4. The impedance of
When using the network ana
alyzer, pleas e note that the small-sig
gnal input m
may lead to the
impe
edance of low
w capacitance caused b
by the AC vo
oltage charac
cteristic of M
MLCC.
[ Example of IImpedance characteristics
c
s]
* Sample : X5
5R 1uF, Rated
d voltage 6.3V
15
MLCC Pro
oduct Manual
3. Electriccal & Mecchanical Caution
C
3-1. Deratting
MLCC
C with the test voltage att 100% of th
he rated volttage in the high
h
temperrature resista
ance test
are labeled as “de
erated MLCC
C.” For this tyype of MLCC
C, the voltag
ge and temp
perature should be
derate
ed as shown
n in the follo
owing graph for the equivalent life time of a norrmal MLCC with
w the
test vo
oltage at 150% of the ra
ated voltagee in the high
h temperaturre resistancee test.
3-1-1. The derated MLC
CC should be
b applied w
with the derating voltage and tempe rature as shown in the
follow
wing graph.
3-1-2. The “Temperaturre of MLCC” in the x-axiis of the graph below indicates the surface temperature of
MLCC
C including self-heating effect. The “Voltage De
erating Ratio
o” in the y-axxis of the grraph below
givess the maximum operatin
ng voltage o
of MLCC with
h reference to
t the maxim
mum voltage
e (Vmax) as
defin
ned in sectio
on “3-2. Applied Voltagee.”
mple of deratting graph for
f derated MLCC]
M
[Exam
* Vmax ≤ Derated Voltage
* Only the D
Derating marked modelss
16
MLCC Pro
oduct Manual
3-2. Appliied Voltage
e
The a
actual applie
ed voltage on
o MLCC sho
ould not excceed the rate
ed voltage sset in the spe
ecifications.
3-2-1. Cauttions by type
es of voltage
e applied to MLCC
· Forr DC voltage
e or DC+AC voltage, DC voltage or the
t maximum
m value of D
DC + AC voltage should
no
ot exceed the
e rated volta
age of MLCC
C.
· Forr AC voltage or pulse vo
oltage, the p eak-to-peak
k value of AC
C voltage or pulse voltag
ge
sho
ould not excceed the rate
ed voltage o
of MLCC.
· Abn
normal volta
age such as surge voltag
ge, static ele
ectricity shou
uld not exceeed the rated
d voltage of
MLLCC.
pes of Voltag
ge Applied to
t the Capac
citor]
[Typ
DC Vo
oltage
AC Voltage
DC
C+AC Voltag
ge 1
DC+A
AC Voltage 2
DC+Pulse Voltage
3-2-2. Effecct of EOS (Electrical Overstress)
· Elecctrical Oversstress such as
a a surge vo
oltage or EO
OS can cause
e damages to
o MLCC, resulting in
the
e electrical short
s
failure caused by tthe dielectricc breakdown
n in MLCC.
· Dow
wn time of MLCC
M
is varied with the applied volttage and the
e room temp
perature and
da
diele
ectric shock caused
c
by EOS can acceelerate heating on the dielectric. Theerefore, it ca
an bring
abou
ut a failure of
o MLCC in a market at tthe early stage.
· Plea
ase use cauttion not to apply
a
excess ive electrical overstress including sp
pike voltage MLCC when
n
pre
eparing MLC
CC for testing
g or evaluatiing.
(1) Surge
e
When
n the overcu
urrent caused
d by surge iss applied to MLCC, the influx of currrent into ML
LCC can
inducce the overshooting phe
enomenon o
of voltage as shown in th
he graph beelow and result in the
electrrical short fa
ailure in MLC
CC. Thereforee, it is necesssary to be careful
c
to pre
revent the influx of
surge
e current into
o MLCC.
(2) ESD (Electrostaticc Discharge)
Since
e the voltage
e of the static electricity is very high
h but the quantity of eleectric charge is small
comp
pared to the surge, ESD can cause d
damage to MLCC
M
with lo
ow capacitan
nce as shown
n in the
17
MLCC Pro
oduct Manual
follow
wing graph, whereas surrge with lotss of electric charge
c
quan
ntity can cau
use damagess to even
high capacitance MLCC.
[ Exxample of Su
urge applied to MLCC ]
[ Example of ESD appl ied to MLCC
C]
* Simulatio
on for ESD 8kV
8
3-3. Vibra
ation
Pleasse check the
e types of vib
bration and shock, and the status of resonance..
Mana
age MLCC not
n to genera
ate resonancce and avoid
d any kind of
o impact to terminals.
When MLCC is used
u
in a vibration enviro
onment, plea
ase make su
ure to contacct us for the
e situation
ecial MLCC such
s
as Soft--term, etc.
and consider spe
3-4. Shock
k
Mecha
anical stress caused by a drop may cause dama
ages to a die
electric or a crack in MLCC
Do no
ot use a drop
pped MLCC to avoid anyy quality and
d reliability deterioration
d
n.
When
n piling up or
o handling printed
p
circu it boards, do
o not hit ML
LCC with thee corners of a PCB to
nt cracks or any other damages
d
to tthe MLCC.
preven
3-5. Piezo
o-electric Phenomeno
on
ate a noise due
d to vibra tion at specific frequenc
cy when usin
ng the high dielectric
MLCC may genera
ant MLCC (C
Class Ⅱ) at AC
A or Pulse ccircuits.
consta
MLCC may cause a noise if MLCC
M
is affeccted by any mechanical vibrations
v
orr shocks.
18
MLCC Pro
oduct Manual
4. Processs of Mounting and
d Soldering
g
4-1. Moun
nting
4-1-1. Mounting positio
on
It is rrecommended to locate
e the major aaxis of MLCC
C in parallel to the directtion in which the stress
is ap
pplied.
Reco
ommended
ed
Not recommende
n
the cuto
out
4-1-2. Cauttions during mounting near
Pleasse take the following
f
me
easures to eeffectively red
duce the stress generateed from the cutting of
PCB. Select the mounting
m
location show
wn below, sin
nce the mech
hanical stresss is affected
d by a
M
mountted near the
e cutting line
e.
locattion and a direction of MLCC
n
screw
4-1-3. Cauttions during mounting near
If MLLCC is moun
nted near a screw
s
hole, tthe board deflection ma
ay be occurre
red by screw
w torque.
Mount MLCC as far from the
e screw holees as possible.
Not
N recomm
mended
19
Recommended
MLCC Product Manual
4-2. Caution before Mounting
4-2-1. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from
the reel.
4-2-2. Check the capacitance characteristics under actual applied voltage.
4-2-3. Check the mechanical stress when actual process and equipment is in use.
4-2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly.
Heat treatment must be done prior to measurement of capacitance.
4-2-5. Check the solderability of MLCC that has passed shelf life before use.
4-2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC.
4-3. Cautions during Mounting with Mounting (pick-and-place) Machines
4-3-1. Mounting Head Pressure
Excessive pressure may cause cracks in MLCC.
It is recommended to adjust the nozzle pressure within the maximum value of 300g.f.
Additional conditions must be set for both thin film and special purpose MLCC.
4-3-2. Bending Stress
When using a two-sided substrate, it is required to mount MLCC on one side first before
mounting on the other side due to the bending of the substrate caused by the mounting head.
Support the substrate as shown in the picture below when MLCC is mounted on the other side.
If the substrate is not supported, bending of the substrate may cause cracks in MLCC.
4-3-3. Suction nozzle
Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of
the nozzle. This may cause cracks in MLCC due to the excessive force during mounting.
If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during
positioning.
A regular inspection such as maintenance, monitor and replacement for the suction nozzle and
mounting claw should be conducted.
20
MLCC Pro
oduct Manual
4-4. Reflo
ow solderin
ng
MLCC is in a direcct contact with the disso
olved solder during soldering, which
h may be exposed to
poten
ntial mechanical stress ca
aused by thee sudden tem
mperature change.
Thereffore, MLCC may
m be conttaminated b
by the locatio
on movemen
nt and flux.
For th
he reason, th
he mounting process mu
ust be closely monitored
d.
Method
M
Classification
n
In
nfrared rays
Overaall heating
Hot plate
VPS
S(Vapor phasse)
Reflo
ow soldering
g
Air heater
Locaal heating
Laser
Light
L
beam
4-4-1. Reflo
ow Profile
[Reflow S
Soldering Co
onditions]
he peak tem
mperature (26
60℃) and tim
me (30sec) aas shown.
Use ccaution not to exceed th
Pre-h
heating is ne
ecessary for all constitueents includin
ng the PCB to prevent th
he mechaniccal damages
on M
MLCC. The te
emperature difference
d
beetween the PCB and the
e componen
nt surface mu
ust be kept
to th
he minimum..
As fo
or reflow soldering, it is recommend
ded to keep the numberr of reflow so
oldering to less than
three
e times. Plea
ase check witth us when the number of reflow so
oldering neeeds to exceed three
timess. Care mustt be exercise
ed especiallyy for the ultrra-small size,, thin film an
nd high capacitance
MLCC
C as they ca
an be affecte
ed by thermaal stress mo
ore easily.
21
MLCC Product Manual
4-4-2. Reflow temperature
The following quality problem may occur when MLCC is mounted with a lower temperature than
the reflow temperature recommended by a solder manufacturer. The specified peak temperature
must be maintained after taking into consideration the factors such as the placement of
peripheral constituent and the reflow temperature.
･Drop in solder wettability
･Solder voids
･Potential occurrence of whisker
･Drop in adhesive strength
･Drop in self-alignment properties
･Potential occurrence of tombstones
4-4-3. Cooling
Natural cooling with air is recommended.
4-4-4. Optimum solder flux for reflow soldering
· Overly the thick application of solder pastes results in an excessive solder fillet height.
This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which
may cause cracks in MLCC.
· Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to
isolate from PCB
· Check if solder has been applied uniformly after soldering is completed.
Not enough solder
Too Much Solder
Weak holding force may cause bad
large stress may cause cracks
connections or detaching of the capacitor
· It is required to design a PCB with consideration of a solder land pattern and its size to apply an
appropriate amount of solder to MLCC. The amount of the solder at the edge may impact
directly on cracks in MLCC.
· The design of a suitable solder land is necessary since the more the solder amount is,
the larger the force MLCC experiences and the higher the chance MLCC cracks.
22
MLCC Pro
oduct Manual
4-5. Flow soldering
4-5-1. Flow
w profile
[Flow So
oldering Con
nditions]
Ta
mperature (260℃) and time (5sec) ass shown.
ake caution not to exceed peak tem
In
n case of flow soldering,, only 1608(0
0603inch), 2012(0805inch), 3216(12006inch) case size are
re
ecommended to use.
Please contacct us before use the typ e of high ca
apacitance an
nd thin film MLCC for so
ome
exxceptions th
hat may be caused.
c
F
solderin
ng
4-5-2. Cauttion before Flow
· Wh
hen a sudden
n heat is applied to MLC
CC, the mechanical rigidity of MLCC is deteriora
ated by the
internal deforma
ation of MLC
CC. Preheatin
ng all the constituents in
ncluding PCB
B is required to prevent
mechanical damages
d
on MLCC. The temperature
e difference between thee solder and
d the
the m
surfa
ace of MLCC must be kept to the m inimum.
e is too long
g or the flow
w temperaturre is too high, the adhessive strength
h with PCB
· If the flow time
ated by the leaching ph enomenon of
o the outer termination
n, or the capacitance
may be deteriora
e may be dro
opped by weak adhesio
on between the
t internal termination and the outter
value
termination.
23
MLCC Product Manual
4-6. Soldering Iron
Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature
soldering iron tip may come into a direct contact with the ceramic body of MLCC due to the
carelessness of an operator. Therefore, the soldering iron must be handled carefully, and close
attention must be paid to the selection of the soldering iron tip and to temperature control of the
tip.
4-6-1. How to use a soldering Iron
· In order to minimize damages on MLCC, preheating MLCC and PCB is necessary.
A hot plate and a hot air type preheater should be used for preheating
. Do not cool down MLCC and PCB rapidly after soldering.
· Keep the contact time between the outer termination of MLCC and the soldering iron as short as
possible. Long soldering time may cause problems such as adhesion deterioration by the
leaching phenomenon of the outer termination.
Variation of
Soldering
Pre-heating
Soldering
Cooling
Temp.
Temp.(℃)
Time(sec)
Time(sec)
Time(sec)
ΔT ≤ 130
300±10℃ max
≥60
≤4
-
* Control Δ T in the solder iron and preheating temperature.
Condition of Iron facilities
Wattage
Tip diameter
Soldering time
20W max
3 ㎜ max
4sec max
* Caution - Iron tip should not contact with ceramic body directly
Lead-free solder: Sn-3.0Ag-0.5CU
4-6-2. How to use a spot heater
Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and
the PCB, which is likely to lessen the thermal shocks.
For a high density PCB, a spot heater can prevent the problem to connect between a solder iron
and MLCC directly.
· If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the
thermal stress. Follow the conditions set in the table below to prevent this problem.
· The spot heater application angle as shown in the figure is recommended to create a suitable
solder fillet shape.
24
MLCC Product Manual
Distance
5㎜ ≤
Hot Air Application angle
45℃
Hot Air Temperature Nozzle Outlet
400℃ ≥
Application Time
10s＞
4-6-3. Cautions for re-work
· Too much solder amount will increase the risk of PCB bending or cause other damages.
· Too little solder amount will result in MLCC breaking loose from the PCB due to the
inadequate adhesive strength.
· Check if the solder has been applied properly and ensure the solder fillet has a proper shape.
* Soldering wire below ø0.5mm is required for soldering.
4-7. Cleaning
4-7-1. In general, cleaning is unnecessary if rosin flux is used.
When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning
fluids, thereby affecting the performance of MLCC.
This means that the cleansing solution must be carefully selected and should always be new.
4-7-2. Cautions for cleaning
MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong
during cleaning. When high pressure cleaning equipment is used, test should be done for the
cleaning equipment and its process before the cleaning in order to avoid damages on MLCC.
25
MLCC Product Manual
4-8. Cautions for using electrical measuring probes
· Confirm the position of the support pin or jig when checking the electrical performance of MLCC
after mounting on the PCB.
· Watch for PCB bending caused by the pressure of a test-probe or other equipment.
· If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may
be damaged.
· Avoid PCB flexing by using the support pin on the back side of the PCB.
· Place equipment with the support pin as close to the test-probe as possible.
· Prevent shock vibrations of the board when the test-probe contacts a PCB.
Not recommended
Recommended
4-9. Printed Circuit Board Cropping
· Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC
on the PCB.
· The stress as shown may cause cracks in MLCC when cutting the board.
· Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit.
· Avoid these types of stresses applied to MLCC.
[Bending]
[Twisting]
4-9-1. Cautions for cutting PCB
Check a cutting method of PCB in advance.
The high density board is separated into many individual boards after the completion of soldering.
If the board is bent or deformed during separation, MLCC may be cracked.
Carefully select a separation method that minimizes the deformation of the PCB.
26
MLCC Product Manual
4-10. Assembly Handling
4-10-1. Cautions for PCB handling
Hold the edges of the board mounted with MLCC with both hands since holding with one hand
may bend the board.
Do not use dropped boards, which may degrade the quality of MLCC.
4-10-2. Mounting other components
Pay attention to the following conditions when mounting other components on the back side of
The board after MLCC has been mounted on the front side.
When the suction nozzle is placed too close to the board, board deflection stress may be
applied to MLCC on the back side, resulting in cracks in MLCC.
Check if proper value is set on each chip mounter for a suction location, a mounting gap and a
suction gap by the thickness of components.
4-10-3. Board mounting components with leads
If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder
joint may be cracked.
Pay attention to the following:
· Reduce the stress on the board during insertion by increasing the size of the lead insertion
hole.
· Insert components with leads into the board after fixing the board with support pins or a
dedicated jig.
· Support the bottom side of the board to avoid bending the board.
· Check the status of the height of each support pin regularly when the support pins are used.
Not recommended
Recommended
27
MLCC Product Manual
4-10-4. Socket and / or connector attach / detach
Since the insertion or removal from sockets and connectors may cause the board to bent, make
sure that MLCC mounted on the board should not be damaged in this process.
4-10-5. Fastening screw
When attaching a shield on a board, the board may be bent during a screw tightening work
Pay attention to the following conditions before performing the work.
· Plan the work to prevent the board from bending
· Use a torque driver to prevent over-tightening of the screw.
· Since the board may be bent by soldering, use caution in tightening the screw.
4-11. Adhesive selection
Pay attention to the following if an adhesive is used to position MLCC on the board before
soldering.
4-11-1. Requirements for Adhesives
· They must have enough adhesive strength to prevent MLCC from slipping or moving during
the handling the board.
· They must maintain their adhesive strength when exposed to soldering temperatures.
· They should not spread when applied to the PCB.
· They should have a long pot life.
· They should hardened quickly.
· They should not corrode the board or MLCC materials.
· They should be an insulator type that does not affect the characteristic of MLCC.
· They should be non-toxic, not harmful, and particularly safe when workers touch the adhesives.
4-11-2. Caution before Applying Adhesive
Check the correct application conditions before attaching MLCC to the board with an adhesive.
If the dimension of land, the type of adhesives, the amount of coating, the contact surface areas,
the curing temperature, or other conditions are not appropriate, it may degrade the MLCC
performance.
28
MLCC Product Manual
4-11-3. Cautions for selecting Adhesive
Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded.
In addition, MLCC may be cracked by the difference in contractile stress caused by the different
contraction rate between MLCC and the adhesive.
4-11-4. Cautions for the amount of applied adhesive and curing temperature
· The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the a
mounting defect in MLCC
· Excessive use of the adhesive may cause a soldering defect, loss of electrical connection,
incorrect curing, or slippage of a mounting position, thereby an inflow of the adhesive onto a
land section should be avoided.
· If the curing temperature is too high or the curing time is too long, the adhesive strength will
be degraded. In addition, oxidation both on the outer termination (Sn) of MLCC and the
surface of the board may deteriorate the solderability.
4-12. Flux
4-12-1. The excessive amount of flux generates excessive flux gases which may deteriorate solderability.
Therefore, apply the flux thin and evenly as a whole.
4-12-2. Flux with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not
done properly. Therefore, use flux with a halogen content of 0.1% max.
4-12-3. Strong acidic flux can degrade the MLCC performance
4-12-4. Check the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the
mounting process.
4-13. Coating
4-13-1. Crack caused by Coating
A crack may be caused in the MLCC due to amount of the resin and stress of thermal
contraction of the resin during coating process.
During the coating process, the amount of resin and the stress of thermal contraction of the
resin may cause cracks in MLCC
The difference of thermal expansion coefficient between the coating, or a molding resin may
cause destruction, deterioration of insulation resistance or dielectric breakdown of MLCC such
as cracks or detachment, etc.
29
MLCC Product Manual
4-13-2. Recommended Coating material
· A thermal expansion coefficient should be as close to that of MLCC as possible.
· A silicone resin can be used as an under-coating to buffer the stress.
· The resin should have a minimum curing contraction rate.
· The resin should have a minimum sensitivity (ex. Epoxy resin).
· The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is
used in a high humidity condition.
· Do not use strong acid substances due to the fact that coating materials inducing a family of
halogen substances and organic acid may corrode MLCC.
30
MLCC Product Manual
5. Design
5-1. Circuit design
When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the
drop in insulation resistance. Therefore, it is required to install safety equipment such as a fuse to
prevent additional accidents when MLCC is short-circuited, otherwise, electric short and fire may
occur. This product is not a safety guaranteed product..
5-2. PCB Design
5-2-1. Unlike lead type components, SMD type components that are designed to be mounted directly
on the board are fragile to the stress. In addition, they are more sensitive to mechanical and
thermal stress than lead type components.
5-2-2. MLCC crack by PCB material type
A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal
expansion and contraction, resulting in cracks in MLCC. Even though MLCC is mounted on a
board with a fluorine resin or on a single-layered glass epoxy, cracks in MLCC may occur.
5-3. Design system evaluation
5-3-1. Evaluate the actual design with MLCC to make sure there is no functional issue or violation of
specifications of the finished goods.
5-3-2. Please note that the capacitance may differ based on the operating condition of the actual system
since Class 2 MLCC capacitance varies with applied voltage and temperature.
5-3-3. Surge resistance must be evaluated since the excessive surge caused by the inductance of the
actual system may apply to MLCC.
5-3-4. Note the actual MLCC size and the termination shape.
31
MLCC Pro
oduct Manual
5-4 Land d
dimension
The reccommended
d land dimen
nsion is deteermined by evaluating
e
th
he actual SETT and a board.
R
Reflow Foo
otprint
Chip Size
Chip Tol.
a
b
c
(a+2b)
(a+2b)
[mm]
[mm]
[mm]
[mm]
[mm]
min
0402
± 0.02
0.14~0.20
0.14~0.22
0.20~0.26
0.42
max
0.64
± 0.03
0.16~0.20
0.24~0.32
0.30~0.35
0.64
0.84
± 0.05
0.18~0.26
0.24~0.32
0.32~0.37
0.66
0.9
± 0.07
0.20~0.28
0.25~0.35
0.35~0.39
0.7
0.98
± 0.09
0.22~0.30
0.25~0.35
0.35~0.39
0.72
1
± 0.05
0.35~0.40
0.37~0.47
0.50~0.55
1.09
1.34
± 0.07
0.37~0.42
0.37~0.47
0.52~0.58
1.11
1.36
± 0.10
0.40~0.45
0.37~0.47
0.55~0.60
1.14
1.39
± 0.15
0.40~0.45
0.40~0.50
0.60~0.65
1.2
1.45
± 0.20
0.45~0.50
0.40~0.50
0.65~0.70
1.25
1.5
± 0.30
0.45~0.50
0.42~0.52
0.70~0.75
1.29
1.54
± 0.40
0.50~0.55
0.45~0.55
0.75~0.80
1.4
1.65
± 0.10
0.50~0.55
0.60~0.65
0.80~0.85
1.7
1.85
± 0.15
0.55~0.60
0.62~0.67
0.85~0.90
1.79
1.94
± 0.20
0.60~0.65
0.65~0.70
0.90~0.95
1.9
2.05
± 0.25
0.65~0.70
0.70~0.75
0.95~1.00
2.05
2.2
± 0.30
0.70~0.75
0.75~0.80
1.00~1.05
2.2
2.35
±0.10
0.70~0.75
0.75~0.80
1.25~1.30
2.2
2.35
±0.15
0.75~0.80
0.80~0.85
1.30~1.35
2.35
2.5
±0.20
0.80~0.85
0.85~0.90
1.35~1.40
2.5
2.65
±0.25
0.85~0.90
0.95~1.00
1.40~1.45
2.75
2.9
±0.30
0.90~0.95
1.05~1.10
1.45~1.50
3
3.15
±0.20
1.70~1.90
0.85~1.00
1.60~1.80
3.4
3.9
±0.30
1.80~2.00
0.95~1.10
1.70~1.90
3.7
4.2
3225
-
2.00~2.40
1.00~1.40
1.80~2.20
4
5.2
4532
-
2.80~3.20
1.40~1.80
2.40~3.00
5.6
6.8
5750
-
4.00~4.60
1.70~2.30
4.10~4.90
7.4
9.2
Chip Size
Chip Tol.
a
b
c
(a+2b)
(a+2b)
[mm]
[mm]
[mm]
[mm]
[mm]
min
max
1608
-
0.60~1.00
0.60~0.80
0.60~0.80
1.8
2.6
2012
-
1.00~1.20
0.80~1.20
0.80~1.20
2.6
3.6
3216
-
2.00~2.40
1.00~1.20
1.00~1.40
4.0
4.8
0603
1005
1608
2012
3216
F
Flow Footp
print
32
MLCC Product Manual
6. Others
6-1. Storage environment
6-1-1. Recommendation for temperature/humidity
Even taping and packaging materials are designed to endure a long-term storage, they should
be stored with a temperature of 0~40°C and an RH of 0~70% otherwise, too high temperatures
or humidity may deteriorate the quality of the product rapidly.
As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is,
the better the solderability is.
As the temperature difference may cause dew condensation during the storage of the product,
it is a must to maintain a temperature control environment
6-1-2. Shelf Life
An allowable storage period should be within 6 months from the outgoing date of delivery in
consideration of solderability. As for products in storage over 6 months, please check solderability
before use.
6-2. Caution for corrosive environment
As corrosive gases may deteriorate the solderability of MLCC outer termination, it is a must to
store MLCC in an environment without gases. MLCC that is exposed to corrosive gases may cause
its quality issues due to the corrosion of plating layers and the penetration of moisture.
6-3. Equipment in operation
6-3-1. Do not touch MLCC directly with bare hands to prevent an electric shock or damage.
6-3-2. The termination of MLCC shall not be contacted with a conductive object (short –circuit).
Do not expose MLCC to conductive liquid containing acidic or alkaline material.
6-3-3. Do not use the equipment in the following conditions.
(1) Exposure to water or oil
(2) Exposure to direct sunlight
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MLCC Product Manual
(3) Exposure to Ozone or ultra-violet radiation.
(4) Exposure to corrosive gas (e.g. hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas)
(5) Exposure to vibration or mechanical shock exceeding specified limit
(6) Exposure to high humidity
6-3-4. If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug
from the power source.
If the equipment is not switched off or unplugged, serious damage may occur due to the
continuous power supply. Please be careful with the high temperature in this condition.
6-4. Waste treatment
In case of scrapping MLCC, it is incinerated or buried by a licensed industrial waste company.
When scrapping MLCC, it is recommended to incinerate or bury the scrappage by a licensed
industrial waste company.
6-5. Operating temperature
The operating temperature limit is determined by the specification of each models.
6-5-1. Do not use MLCC over the maximum operating temperature.
Pay attention to equipment’s temperature distribution and the seasonal fluctuation of ambient
temperature.
6-5-2. The surface temperature of MLCC cannot exceed the maximum operating temperature including
self-heating effects.
6-6. Transportation
The performance of MLCC may be affected by transportation conditions.
6-6-1. MLCC shall be protected from excessive temperature, humidity and a mechanical force during
transportation.
34
MLCC Product Manual
During transportation, the cartons shall not be deformed and the inner packaging shall be
protected from excessive external forces.
6-6-2. Do not apply excessive vibrations, shocks or excessive forces to MLCC.
· If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack.
· When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a
tweezer, etc, MLCC may crack or become short-circuited.
6-6-3. MLCC may crack and become non-functional due to the excessive shocks or dropping during
transportation.
6-7. Notice
Some special products are excluded from this document.
Please be advised that this is a standard product specification for a reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
35
MLCC Product Manual
Caution of Application
Disclaimer
The products listed as follows are NOT designed and manufactured for any use and applications set
forth below.
Please note that any misuse of the products deviating from products specifications or information
provided in this Spec sheet may cause serious property damages or personal injury.
① Aerospace/Aviation equipment
② Automotive of Transportation equipment (vehicles，trains，ships，etc)
③ Military equipment
④ Atomic energy-related equipment
⑤ Undersea equipment
⑥ Any other applications with the same as or similar complexity or reliability to the applications
Limitation
Please contact us with usage environment information such as voltage, current, temperature, or other
special conditions before using our products for the applications listed below. The below application
conditions require especially high reliability products to prevent defects that may directly cause damages
or loss to third party's life, body or property.
If you have any questions regarding this 'Limitation'，you should first contact our sales
personnel or application engineers.
① Medical equipment
② Disaster prevention/crime prevention equipment
③ Power plant control equipment
④ Traffic signal equipment
⑤ Data-processing equipment
⑥ Electric heating apparatus，burning equipment
⑦ Safety equipment
⑧ Any other applications with the same as or similar complexity or reliability to the applications
36
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