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CL10A226MR8NQNF

CL10A226MR8NQNF

  • 厂商:

    SAMSUNG(三星)

  • 封装:

    0603

  • 描述:

    22 µF ±20% 4V 陶瓷电容器 X5R 0603(1608 公制)

  • 数据手册
  • 价格&库存
CL10A226MR8NQNF 数据手册
SPECIFICATION (Reference sheet)  Supplier : Samsung electro-mechanics  Samsung P/N : CL10A226MR8NQNF  Product : Multi-layer Ceramic Capacitor  Description : CAP, 22㎌, 4V, ±20%, X5R, 0603 A. Samsung Part Number ① Series ② Size CL 10 A 226 M R 8 N Q N F ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor 0603 (inch code) ③ Dielectric X5R ④ Capacitance 22 ㎌ ±20 % ⑤ Capacitance L: 1.60 ± 0.15 tolerance 4V ⑥ Rated Voltage ⑦ Thickness 0.80 ± 0.15 mm mm W: 0.80 ± 0.15 mm ⑧ Inner electrode Ni Termination Cu Plating Sn 100% (Pb Free) ⑨ Product Size Control Code ⑩ Special Reserved for future use ⑪ Packaging Embossed Type, 13" reel B. Samsung Reliability Test and Judgement condition Performance Test condition 120㎐±20% Capacitance Tan δ (DF) Insulation Within specified tolerance 0.1 max. 0.5±0.1Vrms *A capacitor prior to measuring the capacitance is heat treated at 150℃+0/-10℃, and maintained in ambient air for 24±2 hours. Rated Voltage Resistance 10,000Mohm or 50Mohm㎌ Whichever is Smaller Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Microscope (10) 250% of the rated voltage Voltage mechanical breakdown Temperature X5R Characterisitcs Adhesive Strength (From -55℃ to 85℃, Capacitance change should be within ±15%) No peeling shall be occur on the 500gF, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. within ±12.5% 60~120 sec. Bending to the limit (1mm) with 1.0mm/sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat Tan δ, IR : initial spec. within ±7.5% Solder pot : 270±5℃, 10±1sec. Performance Vibration Test Capacitance change : within ±5% Test condition Amplitude : 1.5mm Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.) Moisture Capacitance change : 2hours  3 direction (x, y, z) With rated voltage Resistance Tan δ : IR : 0.25 max 40±2℃, 90~95%RH, 500+12/-0hrs 500Mohm or 8.8Mohm  ㎌ Whichever is Smaller High Temperature Capacitance change : Resistance Tan δ : IR : within ±12.5% within ±12.5% 0.25 max Capacitance change : Cycling Tan δ, IR : initial spec. of the rated voltage Max. operating temperature 1,000Mohm or 17.7Mohm  ㎌ Whichever is Smaller Temperature With 100% within ±10% 1000+48/-0hrs 1 cycle condition Min. operating temperature 25℃ → 25℃ → Max. operating temperature → 5 cycle test C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) Product specifications included in the specifications are effective as of March 1, 2013. Please be advised that they are standard product specifications for reference only. We modify discontinue the product without W may change, h dif or di ti th d t specifications ifi ti ith t notice ti att any titime. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers.
CL10A226MR8NQNF 价格&库存

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