CL10C151JB8NNND

SPECIFICATION (Reference sheet) · Supplier : Samsung electro-mechanics · Samsung P/N : CL10C151JB8NNND · Product : Multi-layer Ceramic Capacitor · Description : CAP, 150㎊, 50V, ± 5%, C0G, 0603 A. Samsung Part Number CL 10 C 151 J B 8 N N N D ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor ① Series 0603 ② Size (inch code) C0G ③ Dielectric ⑤ Capacitance tolerance 50 V ⑥ Rated Voltage 0.80 ± 0.10 mm W: 0.80 ± 0.10 mm ⑧ Inner electrode Ni Termination Cu Plating Sn 100% 150 ㎊ ±5 % ④ Capacitance ⑦ Thickness L: 1.60 ± 0.10 mm ⑨ Product Normal ⑩ Special Reserved for future use ⑪ Packaging Cardboard Type, 13" reel B. Structure and dimension Samsung P/N (Lead Free) CL10C151JB8NNND (Pb Free) Dimension(㎜) L W T BW 1.60 ± 0.10 0.80 ± 0.10 0.80 ± 0.10 0.30 ± 0.20 C. Samsung Reliability Test and Judgement condition Performance 1㎒±10% 0.5~5Vrms Rated Voltage 60~120 sec. Resistance 10,000Mohm or 500Mohm×㎌ Whichever is smaller Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Microscope (´10) 300% of the rated voltage Voltage mechanical breakdown Temperature C0G Characteristics Adhesive Strength (From -55℃ to 125℃, Capacitance change should be within ±30PPM/℃) No peeling shall be occur on the 500g×F, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Bending to the limit (1mm) with 1.0mm/sec. Solderability within ±5% or ±0.5㎊ whichever is larger More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. Capacitance Within specified tolerance Test condition 1000 min Q Insulation (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Vibration Test Capacitance change : Amplitude : 1.5mm within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.) 2hours ´ 3 direction (x, y, z) Moisture Capacitance change : With rated voltage Resistance within ±7.5% or ±0.75㎊ whichever is larger Q: 200 min 40±2℃, 90~95%RH, 500+12/-0hrs IR : Solder pot : 270±5℃, 10±1sec. 500Mohm or 25Mohm × ㎌ Whichever is smaller 200% High Temperature Capacitance change : With Resistance within ±3% or ±0.3㎊ whichever is larger Q: 350 min Max. operating temperature IR : of the rated voltage 1000+48/-0hrs 1,000Mohm or 50Mohm × ㎌ Whichever is smaller Temperature Capacitance change : 1 cycle condition Cycling within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Min. operating temperature 25℃ → 25℃ → Max. operating temperature → 5 cycle test ※ The reliability test condition can be replaced by the corresponding accelerated test condition. D. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) Product specifications included in the specifications are effective as of March 1, 2013. Please be advised that they are standard product specifications for reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers. - Disclaimer & Limitation of Use and Application The products listed in this Specification sheet are NOT designed and manufactured for any use and applications set forth below. Please note that any misuse of the products deviating from products specifications or information provided in this Spec sheet may cause serious property damages or personal injury. We will NOT be liable for any damages resulting from any misuse of the products, specifically including using the products for high reliability applications as listed below. If you have any questions regarding this 'Limitation of Use and Application', you should first contact our sales personnel or application engineers. ① ② ③ ④ ⑤ ⑥ Aerospace/Aviation equipment Automotive or Transportation equipment (vehicles, trains, ships, etc) Medical equipment Military equipment Disaster prevention/crime prevention equipment Any other applications with the same as or similar complexity or reliability to the applications set forth above.