CL10C8R2CB8NNND

SPECIFICATION · Supplier : Samsung electro-mechanics · Product : Multi-layer Ceramic Capacitor (Reference sheet) CL10C8R2CB8NNND · Samsung P/N : · Description : CAP, 8.2㎊, 50V, ± 0.25㎊, C0G, 0603 A. Samsung Part Number CL 10 C 8R2 C B 8 N N N D ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor 0603 (inch code) L: 1.60 ± 0.10 mm ① Series ② Size ③ Dielectric ④ Capacitance ⑤ Capacitance tolerance ⑥ Rated Voltage ⑦ Thickness C0G 8.2 ㎊ ± 0.25㎊ W: 0.80 ± 0.10 mm ⑧ Inner electrode Termination Plating ⑨ Product ⑩ Special ⑪ Packaging 50 V 0.80 ± 0.10 mm Ni Cu Sn 100% (Pb Free) Normal Reserved for future use Cardboard Type, 13" reel B. Structure and dimension Samsung P/N (Lead Free) CL10C8R2CB8NNND Dimension(㎜) L W T BW 1.60 ± 0.10 0.80 ± 0.10 0.80 ± 0.10 0.30 ± 0.20 C. Samsung Reliability Test and Judgement condition Performance Capacitance Q Insulation Resistance Appearance Withstanding Voltage Temperature Characteristics Adhesive Strength of Termination Bending Strength Solderability Within specified tolerance 564 min 10,000Mohm or 500Mohm×㎌ Whichever is smaller No abnormal exterior appearance No dielectric breakdown or mechanical breakdown C0G Test condition 1㎒±10% / 0.5~5Vrms Rated Voltage 60~120 sec. Microscop (X10) 300% of the rated voltage (From -55℃ to 125℃, Capacitance change should be within ±30PPM/℃) No peeling shall be occur on the 500g×F, for 10±1 sec. terminal electrode Capacitance change : Bending to the limit (1mm) with 1.0mm/sec. within ±5% or ±0.5㎊ whichever is larger More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Soldering heat Vibration Test Moisture Resistance High Temperature Resistance Temperature Cycling Capacitance change : Solder pot : 270±5℃, 10±1sec. within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Capacitance change : Amplitude : 1.5mm within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Capacitance change : From 10㎐ to 55㎐ (return : 1min.) 2hours ´ 3 direction (x, y, z) With rated voltage within ±7.5% or ±0.75㎊ whichever is larger Q: 127.33 min IR : 500Mohm or 25Mohm × ㎌ Whichever is smaller Capacitance change : 40±2℃, 90~95%RH, 500+12/-0hrs within ±3% or ±0.3㎊ whichever is larger Q: 282 min IR : 1,000Mohm or 50Mohm × ㎌ Whichever is smaller Capacitance change : within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. With 200% of the rated voltage Max. operating temperature 1000+48/-0hrs 1 cycle condition Min. operating temperature Max. operating temperature → 5 cycle test ※ The reliability test condition can be replaced by the corresponding accelerated test condition. D. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) Product specifications included in the specifications are effective as of March 1, 2013. Please be advised that they are standard product specifications for reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers. → → 25℃ 25℃ - Disclaimer & Limitation of Use and Application The products listed in this Specification sheet are NOT designed and manufactured for any use and applications set forth below. Please note that any misuse of the products deviating from products specifications or information provided in this Spec sheet may cause serious property damages or personal injury. We will NOT be liable for any damages resulting from any misuse of the products, specifically including using the products for high reliability applications as listed below. If you have any questions regarding this 'Limitation of Use and Application', you should first contact our sales personnel or application engineers. ① ② ③ ④ ⑤ ⑥ Aerospace/Aviation equipment Automotive or Transportation equipment (vehicles, trains, ships, etc) Medical equipment Military equipment Disaster prevention/crime prevention equipment Any other applications with the same as or similar complexity or reliability to the applications set forth above.