CL21C300KBANNNC

SPECIFICATION · Supplier : Samsung electro-mechanics · Product : Multi-layer Ceramic Capacitor (Reference sheet) CL21C300KBANNNC · Samsung P/N : · Description : CAP, 30㎊, 50V, ± 10%, C0G, 0805 A. Samsung Part Number CL 21 C 300 K B A N N N C ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor 0805 (inch code) L: 2.00 ± 0.10 mm ① Series ② Size ③ Dielectric ④ Capacitance ⑤ Capacitance tolerance ⑥ Rated Voltage ⑦ Thickness C0G 30 ㎊ ± 10% W: 1.25 ± 0.10 mm ⑧ Inner electrode Termination Plating ⑨ Product ⑩ Special ⑪ Packaging 50 V 0.65 ± 0.10 mm Ni Cu Sn 100% (Pb Free) Normal Reserved for future use Cardboard Type, 7" reel B. Structure and dimension Samsung P/N (Lead Free) CL21C300KBANNNC Dimension(㎜) L W T BW 2.00 ± 0.10 1.25 ± 0.10 0.65 ± 0.10 0.50+0.20/-0.30 C. Samsung Reliability Test and Judgement condition Performance Capacitance Q Insulation Resistance Appearance Withstanding Voltage Temperature Characteristics Adhesive Strength of Termination Bending Strength Solderability Within specified tolerance 1,000 min 10,000Mohm or 500Mohm×㎌ Whichever is smaller No abnormal exterior appearance No dielectric breakdown or mechanical breakdown C0G Test condition 1㎒±10% / 0.5~5Vrms Rated Voltage 60~120 sec. Microscop (X10) 300% of the rated voltage (From -55℃ to 125℃, Capacitance change should be within ±30PPM/℃) No peeling shall be occur on the 500g×F, for 10±1 sec. terminal electrode Capacitance change : Bending to the limit (1mm) with 1.0mm/sec. within ±5% or ±0.5㎊ whichever is larger More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Soldering heat Vibration Test Moisture Resistance High Temperature Resistance Temperature Cycling Capacitance change : Solder pot : 270±5℃, 10±1sec. within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Capacitance change : Amplitude : 1.5mm within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. Capacitance change : From 10㎐ to 55㎐ (return : 1min.) 2hours ´ 3 direction (x, y, z) With rated voltage within ±7.5% or ±0.75㎊ whichever is larger Q: 200 min IR : 500Mohm or 25Mohm × ㎌ Whichever is smaller Capacitance change : 40±2℃, 90~95%RH, 500+12/-0hrs within ±3% or ±0.3㎊ whichever is larger Q: 350 min IR : 1,000Mohm or 50Mohm × ㎌ Whichever is smaller Capacitance change : within ±2.5% or ±0.25㎊ whichever is larger Tan δ, IR : initial spec. With 200% of the rated voltage Max. operating temperature 1000+48/-0hrs 1 cycle condition Min. operating temperature Max. operating temperature → 5 cycle test ※ The reliability test condition can be replaced by the corresponding accelerated test condition. D. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) Product specifications included in the specifications are effective as of March 1, 2013. Please be advised that they are standard product specifications for reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers. → → 25℃ 25℃