CL21X475KQFNNNE

SPECIFICATION • Samsung P/N : CL21X475KQFNNNE ㎌, 6.3V, ±10%, X6S, 0805 • Description : CAP, 4.7㎌ • Supplier : Samsung electro-mechanics • Product : Multi-layer Ceramic Capacitor A. Samsung Part Number ① Series ② Size ③ Dielectric ④ Capacitance ⑤ Capacitance tolerance ⑥ Rated Voltage ⑦ Thickness CL 21 X 475 K Q F N N N E ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor 0805 (inch code) L: 2.0 ± 0.1 1.25 ± 0.1 W: ⑧ Inner electrode Termination X6S 4.7 ㎌ ±10 % mm mm Ni Cu Sn 100% Plating 6.3 V 1.25 ± 0.1 mm (Pb Free) ⑨ Product ⑩ Special Normal ⑪ Packaging Embossed Type, 7" reel Reserved for future use B. Samsung Reliablility Test and Judgement condition Performance 1.0±0.2Vrms Rated Voltage 60~120 sec. Resistance 10,000Mohm or 100Mohm⋅㎌ Whichever is Smaller Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Microscope (×10) 250% of the rated voltage Voltage mechanical breakdown Temperature X6S Characterisitcs Adhesive Strength (From -55℃ to 105℃, Capacitance change shoud be within ±22%) No peeling shall be occur on the 500g⋅F, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Tan δ (DF) Insulation Within specified tolerance Test condition 1㎑±10% Capacitance 0.1 max. within ±12.5% Bending to the limit (1mm) with 1.0mm/sec. Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat Tan δ, IR : initial spec. within ±15% Solder pot : 270±5℃, 10±1sec. Performance Vibration Test Capacitance change : within ±10% Tan δ, IR : initial spec. Moisture Capacitance change : Resistance Tan δ : 0.125 max IR : Amplitude : 1.5mm From 10㎐ to 55㎐ (return : 1min.) 2hours × 3 direction (x, y, z) within ±12.5% With rated voltage 40±2℃, 90~95%RH, 500+12/-0hrs 12.5㏁·㎌ or Over High Temperature Capacitance change : Resistance Tan δ : 0.125 max IR : Test condition within ±12.5% With 150% of the rated voltage Max. operating temperature 25㏁·㎌ or Over 1000+48/-0hrs Temperature Capacitance change : Cycling Tan δ, IR : initial spec. within ±15% 1 cycle condition Min. operating temperature→ → 25℃ Max. operating temperature → 25℃ 5 cycle test C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) * For the more detail Specification, Please refer to the Samsung MLCC catalogue.