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CL31B104KEHSFNE

CL31B104KEHSFNE

  • 厂商:

    SAMSUNG(三星)

  • 封装:

    1206

  • 描述:

    贴片电容(MLCC) 1206 100nF ±10% 250V X7R

  • 数据手册
  • 价格&库存
CL31B104KEHSFNE 数据手册
SPECIFICATION  Supplier : Samsung electro-mechanics  Samsung P/N : CL31B104KEHSFNE  Product : Multi-layer Ceramic Capacitor  Description : CAP, 100㎋, 250V, ±10%, X7R, 1206 A. Samsung Part Number ① Series CL 31 B 104 K E H S F N E ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor ② Size 1206 (inch code) ③ Dielectric X7R ④ Capacitance ⑤ Capacitance L: 3.2 ± 0.2 tolerance 250 V ⑦ Thickness 1.6 ± 0.2 mm 1.6 ± 0.2 W: mm Ni ⑧ Inner electrode 100 ㎋ ±10 % ⑥ Rated Voltage mm Termination Cu/Ag-Epoxy Plating Sn 100% (Pb Free) ⑨ Product Product for POWER application ⑩ Special Reserved for future use ⑪ Packaging Embossed Type, 7" reel B. Samsung Reliablility Test and Judgement condition Performance 1.0±0.2Vrms Rated Voltage 60~120 sec. Resistance 10,000Mohm or 500Mohm㎌ Whichever is Smaller Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Microscope (10) 200% of the rated voltage Voltage mechanical breakdown Temperature X7R Characterisitcs Adhesive Strength (From -55℃ to 125℃, Capacitance change shoud be within ±15%) No peeling shall be occur on the 500gF, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Tan δ (DF) Insulation Within specified tolerance Test condition 1㎑±10% Capacitance 0.025 max. within ±12.5% Bending to the limit (1mm) with 1.0mm/sec. Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat Tan δ, IR : initial spec. within ±7.5% Solder pot : 270±5℃, 10±1sec. Performance Vibration Test Capacitance change : within ±5% Tan δ, IR : initial spec. Moisture Capacitance change : Resistance Tan δ : IR : Amplitude : 1.5mm From 10㎐ to 55㎐ (return : 1min.) 2hours  3 direction (x, y, z) within ±12.5% With rated voltage 0.05 max 40±2℃, 90~95%RH, 500+12/-0hrs 500Mohm or 25Mohm  ㎌ Whichever is Smaller High Temperature Capacitance change : Resistance Tan δ : IR : Test condition within ±12.5% With 150% 0.05 max Max. operating temperature 1000Mohm or 50Mohm  ㎌ Whichever is Smaller Temperature Capacitance change : Cycling Tan δ, IR : initial spec. of the rated voltage within ±7.5% 1000+48/-0hrs 1 cycle condition Min. operating temperature 25℃ → 25℃ → Max. operating temperature → 5 cycle test C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) * For the more detail Specification, Please refer to the Samsung MLCC catalogue.
CL31B104KEHSFNE 价格&库存

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