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CL31B474MAFNNNE

CL31B474MAFNNNE

  • 厂商:

    SAMSUNG(三星)

  • 封装:

    1206

  • 描述:

    贴片电容(MLCC) 1206 470nF ±20% 25V X7R

  • 数据手册
  • 价格&库存
CL31B474MAFNNNE 数据手册
SPECIFICATION • Supplier : Samsung electro-mechanics • Samsung P/N : CL31B474MAFNNNE • Product : Multi-layer Ceramic Capacitor • Description : CAP, 470㎋, 25V, ±20%, X7R, 1206 A. Samsung Part Number ① Series CL 31 B 474 M A F N N N E ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor ② Size 1206 (inch code) ③ Dielectric X7R ④ Capacitance ⑤ Capacitance L: 3.2 ± 0.15 25 V ⑥ Rated Voltage ⑦ Thickness 1.25 ± 0.15 mm 1.6 W: ± 0.15 mm ⑧ Inner electrode Ni Termination Cu Plating Sn 100% 470 ㎋ ±20 % tolerance mm (Pb Free) ⑨ Product Normal ⑩ Special Reserved for future use ⑪ Packaging Embossed Type, 7" reel B. Samsung Reliablility Test and Judgement condition Performance 1.0±0.2Vrms Rated Voltage 60~120 sec. Resistance 10,000Mohm or 500Mohm⋅㎌ Whichever is Smaller Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Microscope (×10) 250% of the rated voltage Voltage mechanical breakdown Temperature X7R Characterisitcs Adhesive Strength (From -55℃ to 125℃, Capacitance change shoud be within ±15%) No peeling shall be occur on the 500g⋅F, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Tan δ (DF) Insulation Within specified tolerance Test condition 1㎑±10% Capacitance 0.025 max. within ±12.5% Bending to the limit (1mm) with 1.0mm/sec. Solderability More than 75% of terminal surface 1) Sn63Pb37 solder is to be soldered newly 235±5℃, 5±0.5sec. 2) SnAg3.0Cu0.5 solder 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat Tan δ, IR : initial spec. within ±7.5% Solder pot : 270±5℃, 10±1sec. Performance Vibration Test Capacitance change : within ±5% Tan δ, IR : initial spec. Test condition Amplitude : 1.5mm From 10㎐ to 55㎐ (return : 1min.) 2hours × 3 direction (x, y, z) Humidity Capacitance change : within ±12.5% 40±2℃, 90~95%RH, 500+12/-0hrs 0.05 max Tan δ : IR : 1000Mohm or 50Mohm ⋅ ㎌ Whichever is Smaller Moisture Capacitance change : Resistance Tan δ : IR : 0.05 max 40±2℃, 90~95%RH, 500+12/-0hrs 500Mohm or 25Mohm ⋅ ㎌ Whichever is Smaller High Temperature Capacitance change : Resistance Tan δ : IR : within ±12.5% With rated voltage within ±12.5% With 200% 0.05 max Max. operating temperature 1000Mohm or 50Mohm ⋅ ㎌ Whichever is Smaller Temperature Capacitance change : Cycling Tan δ, IR : initial spec. of the rated voltage within ±7.5% 1000+48/-0hrs 1 cycle condition Min. operating temperature→ → 25℃ Max. operating temperature → 25℃ 5 cycle test C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) * For the more detail Specification, Please refer to the Samsung MLCC catalogue.
CL31B474MAFNNNE 价格&库存

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