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CL31F104ZACNBNC

CL31F104ZACNBNC

  • 厂商:

    SAMSUNG(三星)

  • 封装:

    1206(3216公制)

  • 描述:

    排容 1206 4 100nF -20~+80% 3.20 x 1.60mm 25V

  • 数据手册
  • 价格&库存
CL31F104ZACNBNC 数据手册
SPECIFICATION • Supplier : Samsung electro-mechanics • Product : Multi-layer Ceramic Capacitor • Samsung P/N: • Descriptiont : CL31F104ZACNBNC CAP,100㎋ ㎋, -20+80%, 25V, Y5V, 1206 A. Samsung Part Number ① Series ② Size ③ Dielectric ④ Capacitance ⑤ Capacitance tolerance ⑥ Rated Voltage ⑦ Thickness CL 31 F 104 Z A C N B N C ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor 1206 (inch code) L: 3.2 ± 0.15 mm 1.6 W: ⑧ Inner electrode Termination Y5V 100 ㎋ -20/+80 % Ni Cu Sn 100% Plating 25 V 0.85 ± 0.15 mm ± 0.15 mm (Pb Free) ⑨ Product ⑩ Special Array(4-element) ⑪ Packaging Cardboard Type, 7" reel Reserved for future use B. Samsung Reliablility Test and Judgement condition Performance 1.0±0.2Vrms Rated Voltage 60~120 sec. Resistance 10,000Mohm or 500Mohm⋅㎌ Whichever is Smaller Appearance No abnormal exterior appearance Withstanding No dielectric breakdown or Microscope (×10) 250% of the rated voltage Voltage mechanical breakdown Temperature Y5V Characterisitcs Adhesive Strength (From -30℃ to 85℃, Capacitance change shoud be within -80~+22%) No peeling shall be occur on the 500g⋅F, for 10±1 sec. of Termination terminal electrode Bending Strength Capacitance change : Tan δ (DF) Insulation Within specified tolerance Test condition 1㎑±10% Capacitance 0.05 max. within ±30% Bending to the limit (1mm) with 1.0mm/sec. Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder is to be soldered newly 245±5℃, 3±0.3sec. (preheating : 80~120℃ for 10~30sec.) Resistance to Capacitance change : Soldering heat Tan δ, IR : initial spec. within ±20% Solder pot : 270±5℃, 10±1sec. Performance Vibration Test Moisture Resistance Capacitance change : within ±20% Test condition Amplitude : 1.5mm Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.) Capacitance change : 2hours × 3 direction (x, y, z) With rated voltage Tan δ : IR : 0.075 max 40±2℃, 90~95%RH, 500+12/-0hrs 500Mohm or 25Mohm ⋅ ㎌ Whichever is Smaller High Temperature Capacitance change : Resistance Tan δ : IR : within ±30% within ±30% 0.075 max Capacitance change : Cycling Tan δ, IR : initial spec. of the rated voltage Max. operating temperature 1000Mohm or 50Mohm ⋅ ㎌ Whichever is Smaller Temperature With 200% within ±20% 1000+48/-0hrs 1 cycle condition Min. operating temperature→ → 25℃ Max. operating temperature → 25℃ 5 cycle test C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) * For the more detail Specification, Please refer to the Samsung MLCC catalogue.
CL31F104ZACNBNC 价格&库存

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