CL32B104KEJNNNE

Carbon Footprint 1.86g bon November 2019 MLCC(02A104M) 1piece MULTILAYER CERAMIC CAPACITORS for AUTOMOTIVE To ensure safe drive CL 10 B 104 K 1 2 3 4 B 5 8 6 W 7 P 8 N 9 6 RATED VOLTAGE CODE C 10 R = 4V 11 Q = 6.3V P = 10V O = 16V 1005(0402) 1 SERIES CODE CL = Multilayer Ceramic Capacitors 1608(0603) 2 SIZE CODE 2012(0805) inch(mm) Code inch(mm) Code inch(mm) 05 0402(1005) 21 0805(2012) 32 1210(3225) 10 0603(1608) 31 1206(3216) B = 50V C = 100V 7 THICKNESS CODE Size mm(inch) Code A = 25V 3216(1206) 3225(1210) 3 DIELECTRIC CODE Code Thickness* Tolerance 5 0.50 ± 0.05 6 0.50 ± 0.20 8 0.80 ± 0.10 9 0.90 ± 0.10 F 1.25 ± 0.10 Q 1.25 ± 0.15 Y 1.25 ± 0.20 H 1.60 ± 0.20 K 1.60 ± 0.30 J 2.50 ± 0.20 V 2.50 ± 0.30 * In case of High Bending Strength, ESD protection capacitors, Please refer to individual specifications. ※ This code has only typical specifications. Please refer to individual specifications. Class I Symbol EIA Code Operation Temperature Range(℃) Temperature Coeffcient(ppm / ℃) C C0G -55 ~ +125 0 ± 30 Premium Capacitors for Automotive Applications Premium Capacitors for Automotive Applications 8 DESIGN CODE Class II Symbol EIA Code Operation Temperature Range(℃) Capacitance Change(ΔC %) B X7R -55 ~ +125 ± 15 Y X7S -55 ~ +125 ± 22 Z X7T -55 ~ +125 -33 ~ +22 4 CAPACITANCE CODE Code Inner electrode Termination Plating material Design 1 Ni Cu Ni_Sn 100% Standard V Ni Cu/Metal Epoxy Ni_Sn 100% Standard W Ni Cu/Metal Epoxy Ni_Sn 100% Open Mode X Ni Cu/Metal Epoxy Ni_Sn 100% Float Mode 9 PRODUCT CODE OR SIZE CONTROL CODE Capacitance expressed in pF. 2 significant digits plus number of zeros. example) 106=10×106=10,000,000pF P = Automotive product meet AEC - Q200. For Values < 10pF, Letter R denotes decimal point example) 1R5 =1.5pF 10 CONTROL CODE N = Standard 5 TOLERANCE CODE J = High Bending Strength E = ESD Protection 11 PACKAGING CODE Capacitance Tolerance Code Capacitance Tolerance TC Capacitance series Remark Code Type Code Type C ± 0.25pF C0G E-12 series* under 5pF C Cardbord Tape, 7"reel E Embossed Tape, 7"reel D ± 0.5pF C0G E-12 series* 5pF < Cp < 10pF D/L Cardbord Tape, 13"reel (Quantity option) F Embossed Tape, 13"reel J ± 5% C0G E-12 series ≥10pF K ± 10% X7R/X7S E-6 series M ± 20% X7R/X7S E-6 series ※ If you want to know the code or quantity in detail, please see page 21 In order to move to the page directly. please click here ↑ * E-24 series is also available ※ This code has only typical specifications. Please refer to individual specifications. Code Capacitance Step 1.0 E-3 E-12 E-24 02 2.2 1.0 E-6 1.5 4.7 2.2 3.3 4.7 6.8 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 1.0 1.1 1.2 1.3 2.2 2.4 2.7 3.0 4.7 5.1 5.6 6.2 1.5 1.6 1.8 2.0 3.3 3.6 3.9 4.3 6.8 7.5 8.2 9.1 03 - ‌Automotive products are manufactured in state of the art facilities recommend for registration to ISO 9001 & IATF 16949. - Automotive products meet AEC-Q200 requirements. - Automotive products are RoHS compliant. - Automotive products meet JEDEC-020-D requirements. - ‌X7R dielectric components have BME and metal-epoxy terminations with a Ni/Sn plated overcoat. - ‌C0G dielectric components contain BME and copper terminations with a Ni/Sn plated overcoat. Size 0603/0805/1206 is suitable for flow and reflow soldering. Size 0402 and smaller (≤0402) and 1210 and bigger (≥1210) is suitable for reflow soldering. Feature Automotive Capacitance Table (X7R/X7S/X7T) Size inch Thickness (mm) (mm) 0402 (1005) 0.50 22 47 100 220 470 1 X7S X7S X7S 16 X7S 2.2 4.7 10 22 47 25 50 X7T 6.3 Structure and Dimensions 0603 (1608) Ceramic Body Electrode(Ni) C0G 10 uF 10 10 BW Capacitance nF 100 - ‌ Automotive Electronic Equipment (Powertrain, Safety, Body & Chassis, Convenience, Infotainment) Application Rated Voltage (Vdc) 0.80 X7S 16 25 50 100 T Plating(Sn) Plating(Ni) Termination(Cu) W L Ceramic Body Electrode(Ni) X7R Standard 0805 (2012) Ceramic Body Electrode(Ni) X7R Open mode 05 X7S 16 X7S 25 100 1.60 [VPN] EIA Code X7S 10 50 Plating(Sn) Plating(Ni) Termination(Metal - Epoxy) Termination(Cu) Size Code 1.25 6.3 Premium Capacitors for Automotive Applications General Automotive Capacitors [WPN] 1.15 1206 (3216) Dimension(mm) 1.60 10 16 25 50 L W T BW 0402 1.00±0.05 0.50±0.05 0.50±0.05 0.25±0.10 100 10 0603 1.60±0.10 0.80±0.10 0.80±0.10 0.30±0.20 6.3 X7S 21 0805 2.00±0.10 1.25±0.10 1.25±0.10 10 X7S 31 32 2.00±0.15 1.25±0.15 1.25±0.15 1206 3.20±0.20 1.60±0.20 1.60±0.20 1210 3.20±0.30 2.50±0.20 2.00±0.20 2.50±0.20 0.5+0.2/-0.3 0.5±0.3 0.6±0.3 1210 (3225) 2.50 16 25 X7S 50 100 Automotive Capacitance Table (C0G) Size inch (mm) 04 Thickness (mm) 0402 (1005) 0.50 0603 (1608) 0.80 0805 (2012) 0.60 0.85 1.25 Rated Voltage (Vdc) Capacitance pF 100 220 nF 470 1 2.2 4.7 10 22 47 100 220 50 100 50 100 270 50 100 05 General Automotive Capacitors Product Line up (Automotive Capacitors_ C0G) ■ Size : 1.00×0.50mm (inch : 0402) 06 ■ Size : 1.60×0.80mm (inch : 0603) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG 1pF 1.2pF 1.2pF 1.5pF 1.5pF 1.8pF 2pF 2.2pF 3pF 3.3pF 3.9pF 4pF 4.7pF 5pF 5pF 5.6pF 6pF 6pF 6.8pF 6.8pF 8pF 8.2pF 8.2pF 9pF 9pF 10pF 10pF 12pF 15pF 18pF 20pF 22pF 27pF 20pF 33pF 39pF 47pF 56pF 68pF 68pF 82pF 100pF 120pF 150pF 150pF 220pF 2.2pF 4.7pF 10pF 12pF 15pF 18pF 22pF 27pF 33pF 39pF 47pF 56pF 68pF 82pF 100pF ±0.25pF ±0.25pF ±0.1% ±0.25pF ±0.1% ±0.1% ±0.1% ±0.25pF ±0.25pF ±0.1% ±0.25pF ±0.25pF ±0.25pF ±0.25pF ±0.5pF ±0.25pF ±0.25pF ±0.5pF ±0.5pF ±0.25pF ±0.5pF ±0.25pF ±0.1% ±0.25pF ±0.5pF ±2% ±5% ±5% ±5% ±5% ±2% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±1% ±5% ±5% ±5% ±5% ±1% ±5% ±0.25pF ±0.25pF ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% CL05C010CB51PN □ CL05C1R2CB51PN □ CL05C1R2BB51PN □ CL05C1R5CB51PN □ CL05C1R5BB51PN □ CL05C1R8BB51PN □ CL05C020BB51PN □ CL05C2R2CB51PN □ CL05C030CB51PN □ CL05C3R3BB51PN □ CL05C3R9CB51PN □ CL05C040CB51PN □ CL05C4R7CB51PN □ CL05C050CB51PN □ CL05C050DB51PN □ CL05C5R6CB51PN □ CL05C060CB51PN □ CL05C060DB51PN □ CL05C6R8DB51PN □ CL05C6R8CB51PN □ CL05C080DB51PN □ CL05C8R2CB51PN □ CL05C8R2BB51PN □ CL05C090CB51PN □ CL05C090DB51PN □ CL05C100GB51PN □ CL05C100JB51PN □ CL05C120JB51PN □ CL05C150JB51PN □ CL05C180JB51PN □ CL05C200GB51PN □ CL05C220JB51PN □ CL05C270JB51PN □ CL05C200JB51PN □ CL05C330JB51PN □ CL05C390JB51PN □ CL05C470JB51PN □ CL05C560JB51PN □ CL05C680JB51PN □ CL05C680FB51PN □ CL05C820JB51PN □ CL05C101JB51PN □ CL05C121JB51PN □ CL05C151JB51PN □ CL05C151FB51PN □ CL05C221JB51PN □ CL05C2R2CC51PN □ CL05C4R7CC51PN □ CL05C100JC51PN □ CL05C120JC51PN □ CL05C150JC51PN □ CL05C180JC51PN □ CL05C220JC51PN □ CL05C270JC51PN □ CL05C330JC51PN □ CL05C390JC51PN □ CL05C470JC51PN □ CL05C560JC51PN □ CL05C680JC51PN □ CL05C820JC51PN □ CL05C101JC51PN □ Remark No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 100 100 100 COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG COG 1pF 1.2pF 1.2pF 1.5pF 1.8pF 1.8pF 2pF 2.2pF 2.7pF 3pF 3.3pF 4pF 4pF 4.7pF 5pF 5.6pF 5.6pF 6pF 6pF 6.8pF 7pF 8pF 8.2pF 9pF 10pF 10pF 10pF 12pF 15pF 18pF 20pF 22pF 27pF 33pF 39pF 39pF 47pF 47pF 56pF 75pF 82pF 91pF 100pF 100pF 120pF 150pF 180pF 220pF 270pF 300pF 330pF 390pF 470pF 560pF 680pF 68pF 820pF 1nF 5.6pF 10pF 12pF ±0.25pF ±0.25pF ±0.1% ±0.25pF ±0.25pF ±0.1% ±0.25pF ±0.25pF ±0.25pF ±0.25pF ±0.25pF ±0.25pF ±0.5pF ±0.25pF ±0.25pF ±0.25pF ±0.5pF ±0.25pF ±0.5pF ±0.25pF ±0.5pF ±0.5pF ±0.25pF ±0.5pF ±0.25pF ±0.5pF ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±1% ±5% ±1% ±5% ±5% ±5% ±5% ±5% ±1% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±0.25pF ±5% ±5% CL10C010CB81PN □ CL10C1R2CB81PN □ CL10C1R2BB81PN □ CL10C1R5CB81PN □ CL10C1R8CB81PN □ CL10C1R8BB81PN □ CL10C020CB81PN □ CL10C2R2CB81PN □ CL10C2R7CB81PN □ CL10C030CB81PN □ CL10C3R3CB81PN □ CL10C040CB81PN □ CL10C040DB81PN □ CL10C4R7CB81PN □ CL10C050CB81PN □ CL10C5R6CB81PN □ CL10C5R6DB81PN □ CL10C060CB81PN □ CL10C060DB81PN □ CL10C6R8CB81PN □ CL10C070DB81PN □ CL10C080DB81PN □ CL10C8R2CB81PN □ CL10C090DB81PN □ CL10C100CB81PN □ CL10C100DB81PN □ CL10C100JB81PN □ CL10C120JB81PN □ CL10C150JB81PN □ CL10C180JB81PN □ CL10C200JB81PN □ CL10C220JB81PN □ CL10C270JB81PN □ CL10C330JB81PN □ CL10C390FB81PN □ CL10C390JB81PN □ CL10C470FB81PN □ CL10C470JB81PN □ CL10C560JB81PN □ CL10C750JB81PN □ CL10C820JB81PN □ CL10C910JB81PN □ CL10C101FB81PN □ CL10C101JB81PN □ CL10C121JB81PN □ CL10C151JB81PN □ CL10C181JB81PN □ CL10C221JB81PN □ CL10C271JB81PN □ CL10C301JB81PN □ CL10C331JB81PN □ CL10C391JB81PN □ CL10C471JB81PN □ CL10C561JB81PN □ CL10C681JB81PN □ CL10C680JB81PN □ CL10C821JB81PN □ CL10C102JB81PN □ CL10C5R6CC81PN □ CL10C100JC81PN □ CL10C120JC81PN □ Remark Premium Capacitors for Automotive Applications Product Line up (Automotive Capacitors_ C0G) 07 General Automotive Capacitors Product Line up (Automotive Capacitors_ X7R/X7S/X7T) ■ Size : 1.60×0.80mm (inch : 0603) ■ Size : 1.00×0.50mm (inch : 0402) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 62 63 64 65 66 67 68 69 70 71 72 73 74 75 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 100 100 100 100 100 100 100 100 100 100 100 100 100 100 COG COG COG COG COG COG COG COG COG COG COG COG COG COG 15pF 18pF 20pF 27pF 39pF 47pF 50pF 56pF 82pF 100pF 120pF 150pF 180pF 220pF ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% CL10C150JC81PN □ CL10C180JC81PN □ CL10C200JC81PN □ CL10C270JC81PN □ CL10C390JC81PN □ CL10C470JC81PN □ CL10C500JC81PN □ CL10C560JC81PN □ CL10C820JC81PN □ CL10C101JC81PN □ CL10C121JC81PN □ CL10C151JC81PN □ CL10C181JC81PN □ CL10C221JC81PN □ Remark ■ Size : 2.00×1.25mm (inch : 0805) 08 No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 50 50 50 50 50 50 50 50 100 COG COG COG COG COG COG COG COG COG 1nF 1.8nF 2.2nF 3.3nF 4.7nF 6.8nF 8.2nF 10nF 1nF ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% CL21C102JBF1PN □ CL21C182JBF1PN □ CL21C222JBF1PN □ CL21C332JBF1PN □ CL21C472JBF1PN □ CL21C682JBF1PN □ CL21C822JBF1PN □ CL21C103JBF1PN □ CL21C102JCF1PN □ Remark No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 0.55 0.55 0.70 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.70 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 6.3 6.3 6.3 6.3 10 10 10 10 10 10 10 16 16 16 16 16 16 16 16 16 16 16 16 16 16 25 25 25 25 25 25 25 25 25 25 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 100 100 X7S X7S X7S X7S X7R X7R X7S X7R X7R X7S X7S X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7S X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R 220nF 470nF 1uF 2.2uF 33nF 100nF 220nF 220nF 220nF 470nF 1uF 1nF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 22nF 33nF 47nF 68nF 82nF 100nF 220nF 1nF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 22nF 33nF 47nF 330pF 470pF 560pF 680pF 1nF 1.2nF 1.5nF 1.8nF 2.2nF 2.7nF 3.3nF 3.3nF 4.7nF 5.6nF 6.8nF 6.8nF 8.2nF 10nF 15nF 22nF 47nF 2.2nF 1nF ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±20% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±5% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL05Y224KQ5VPN □ CL05Y474KQ5VPN □ CL05Y105KQ6VPN □ CL05Y225KQ5VPN □ CL05B333KP5VPN □ CL05B104KP5VPN □ CL05Y224KP5VPN □ CL05B224KP5VPN □ CL05B224MP54PN □ CL05Y474KP5VPN □ CL05Y105KP6VPN □ CL05B102KO5VPN □ CL05B152KO5VPN □ CL05B222KO5VPN □ CL05B332KO5VPN □ CL05B472KO5VPN □ CL05B682KO5VPN □ CL05B103KO5VPN □ CL05B223KO5VPN □ CL05B333KO54PN □ CL05B473KO5VPN □ CL05B683KO5VPN □ CL05B823KO5VPN □ CL05B104KO5VPN □ CL05Y224KO5VPN □ CL05B102KA5VPN □ CL05B152KA5VPN □ CL05B222KA5VPN □ CL05B332KA5VPN □ CL05B472KA5VPN □ CL05B682KA5VPN □ CL05B103KA5VPN □ CL05B223KA5VPN □ CL05B333KA5VPN □ CL05B473KA5VPN □ CL05B331KB5VPN □ CL05B471KB5VPN □ CL05B561KB5VPN □ CL05B681KB5VPN □ CL05B102KB5VPN □ CL05B122KB5VPN □ CL05B152KB5VPN □ CL05B182KB5VPN □ CL05B222KB5VPN □ CL05B272KB5VPN □ CL05B332KB5VPN □ CL05B332JB5VPN □ CL05B472KB5VPN □ CL05B562KB5VPN □ CL05B682KB5VPN □ CL05B682KB54PN □ CL05B822KB5VPN □ CL05B103KB5VPN □ CL05B153KB5VPN □ CL05B223KB5VPN □ CL05B473KB5VPN □ CL05B222KC5VPN □ CL05B102KC5VPN □ Remark Premium Capacitors for Automotive Applications Product Line up (Automotive Capacitors_ C0G) 09 General Automotive Capacitors Product Line up (Automotive Capacitors_ X7R/X7S/X7T) ■ Size : 1.60×0.80mm (inch : 0603) 10 ■ Size : 1.60×0.80mm (inch : 0603) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 0.90 1.00 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 6.3 6.3 10 10 10 10 10 16 16 16 16 16 16 16 16 16 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 25 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 X7R X7T X7R X7R X7R X7R X7S X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R 1uF 4.7uF 220nF 470nF 680nF 1uF 2.2uF 68nF 100nF 150nF 220nF 270nF 330nF 470nF 680nF 1uF 1nF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 15nF 22nF 33nF 47nF 100nF 100nF 150nF 220nF 330nF 470nF 680nF 1uF 220pF 470pF 1nF 1nF 1.5nF 1.8nF 2.2nF 2.7nF 3.3nF 3.9nF 4.7nF 4.7nF 4.7nF 5.6nF 6.8nF 8.2nF 10nF 15nF 22nF 27nF 33nF 39nF 47nF 56nF 68nF 82nF ±10% ±20% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±5% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±5% ±5% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL10B105KQ8VPN □ CL10Z475MQ9VPN □ CL10B224KP8VPN □ CL10B474KP8VPN □ CL10B684KP8VPN □ CL10B105KP8VPN □ CL10Y225KP84PN □ CL10B683KO8WPN □ CL10B104KO8WPN □ CL10B154KO8VPN □ CL10B224KO8VPN □ CL10B274KO8VPN □ CL10B334KO8VPN □ CL10B474KO8VPN □ CL10B684KO8VPN □ CL10B105KO8VPN □ CL10B102KA8WPN □ CL10B152KA8WPN □ CL10B222KA8WPN □ CL10B332KA8WPN □ CL10B472KA8WPN □ CL10B682KA8WPN □ CL10B103KA8WPN □ CL10B153KA8WPN □ CL10B223KA8WPN □ CL10B333KA85PN □ CL10B473KA85PN □ CL10B104KA8WPN □ CL10B104KA8VPN □ CL10B154KA8VPN □ CL10B224KA8VPN □ CL10B334KA8VPN □ CL10B474KA8VPN □ CL10B684KA8VPN □ CL10B105KA8VPN □ CL10B221KB8WPN □ CL10B471KB8WPN □ CL10B102KB8WPN □ CL10B102JB8WPN □ CL10B152KB8WPN □ CL10B182KB8WPN □ CL10B222KB8WPN □ CL10B272KB8WPN □ CL10B332KB8WPN □ CL10B392KB8WPN □ CL10B472KB8WPN □ CL10B472JB8WPN □ CL10B472JB8VPN □ CL10B562KB8WPN □ CL10B682KB8WPN □ CL10B822KB8WPN □ CL10B103KB8WPN □ CL10B153KB8WPN □ CL10B223KB8WPN □ CL10B273KB8WPN □ CL10B333KB8WPN □ CL10B393KB8WPN □ CL10B473KB8WPN □ CL10B563KB8WPN □ CL10B683KB8WPN □ CL10B823KB8WPN □ Remark No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 50 50 50 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R 100nF 150nF 220nF 220pF 270pF 330pF 470pF 560pF 680pF 1nF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF 15nF 22nF 33nF 47nF 68nF 100nF ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL10B104KB8WPN □ CL10B154KB8VPN □ CL10B224KB8VPN □ CL10B221KC8WPN □ CL10B271KC8WPN □ CL10B331KC8WPN □ CL10B471KC8WPN □ CL10B561KC8WPN □ CL10B681KC8WPN □ CL10B102KC8WPN □ CL10B152KC8WPN □ CL10B222KC8WPN □ CL10B332KC8WPN □ CL10B472KC8WPN □ CL10B682KC8WPN □ CL10B103KC8WPN □ CL10B153KC8WPN □ CL10B223KC8WPN □ CL10B333KC8WPN □ CL10B473KC8WPN □ CL10B683KC8WPN □ CL10B104KC8VPN □ Remark Premium Capacitors for Automotive Applications Product Line up (Automotive Capacitors_ X7R/X7S/X7T) 11 General Automotive Capacitors Product Line up (Automotive Capacitors_ X7R/X7S/X7T) ■ Size : 2.00×1.25mm (inch : 0805) 12 ■ Size : 3.20×1.60mm (inch : 1206) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 1.40 1.40 1.35 1.35 1.40 1.40 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.40 1.40 1.40 1.40 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.35 1.40 6.3 6.3 10 10 10 10 16 16 16 16 16 16 16 16 16 16 16 16 16 25 25 25 25 25 25 25 50 50 50 50 50 50 50 50 50 100 100 100 100 X7R X7S X7R X7R X7R X7S X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7S X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R 4.7uF 10uF 1uF 2.2uF 4.7uF 10uF 150nF 220nF 270nF 330nF 390nF 470nF 680nF 1uF 2.2uF 2.2uF 3.3uF 4.7uF 10uF 150nF 220nF 330nF 470nF 560nF 1uF 2.2uF 100nF 120nF 150nF 180nF 220nF 330nF 470nF 680nF 1uF 22nF 47nF 100nF 220nF ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL21B475KQQVPN □ CL21Y106KQQVPN □ CL21B105KPFVPN □ CL21B225KPFVPN □ CL21B475KPQVPN □ CL21Y106KPQVPN □ CL21B154KOFVPN □ CL21B224KOFVPN □ CL21B274KOFVPN □ CL21B334KOFVPN □ CL21B394KOFVPN □ CL21B474KOFVPN □ CL21B684KOFVPN □ CL21B105KOFVPN □ CL21B225KOFVPN □ CL21B225KOQVPN □ CL21B335KOQVPN □ CL21B475KOQVPN □ CL21Y106KOQ4PN □ CL21B154KAFVPN □ CL21B224KAFVPN □ CL21B334KAFVPN □ CL21B474KAFVPN □ CL21B564KAFVPN □ CL21B105KAFVPN □ CL21B225KAFVPN □ CL21B104KBFWPN □ CL21B124KBFVPN □ CL21B154KBFVPN □ CL21B184KBFVPN □ CL21B224KBFVPN □ CL21B334KBFVPN □ CL21B474KBFVPN □ CL21B684KBFVPN □ CL21B105KBFVPN □ CL21B223KCFWPN □ CL21B473KCFWPN □ CL21B104KCFWPN □ CL21B224KCQVPN □ Remark No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 1.80 1.80 1.80 1.80 1.80 1.90 1.80 1.80 1.80 1.80 1.90 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 1.80 10 10 16 16 16 16 16 25 25 25 25 25 50 50 50 50 50 50 50 100 100 X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R 4.7uF 10uF 2.2uF 4.7uF 6.8uF 10uF 10uF 2.2uF 3.3uF 4.7uF 10uF 10uF 330nF 470nF 680nF 1uF 1.5uF 2.2uF 4.7uF 470nF 1uF ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL31B475KPHVPN □ CL31B106KPHVPN □ CL31B225KOHVPN □ CL31B475KOHVPN □ CL31B685KOHVPN □ CL31B106KOKVPN □ CL31B106KOHVPN □ CL31B225KAHVPN □ CL31B335KAHVPN □ CL31B475KAHVPN □ CL31B106KAKVPN □ CL31B106KAHVPN □ CL31B334KBHWPN □ CL31B474KBHWPN □ CL31B684KBHWPN □ CL31B105KBHWPN □ CL31B155KBHVPN □ CL31B225KBHVPN □ CL31B475KBHVPN □ CL31B474KCHWPN □ CL31B105KCHVPN □ Remark Premium Capacitors for Automotive Applications Product Line up (Automotive Capacitors_ X7R/X7S/X7T) ■ Size : 3.20×2.50mm (inch : 1210) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 2.80 2.70 2.80 2.70 2.70 2.70 2.70 2.80 2.70 2.70 2.70 2.70 2.70 2.70 2.70 6.3 10 10 16 16 25 25 25 50 50 50 50 50 50 100 X7S X7R X7S X7R X7R X7R X7R X7S X7R X7R X7R X7R X7S X7S X7R 47uF 22uF 47uF 22uF 22uF 4.7uF 10uF 22uF 1uF 3.3uF 4.7uF 6.8uF 6.8uF 10uF 2.2uF ±20% ±10% ±20% ±10% ±20% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL32Y476MQVVPN □ CL32B226KPJVPN □ CL32Y476MPVVPN □ CL32B226KOJVPN □ CL32B226MOJVPN □ CL32B475KAJVPN □ CL32B106KAJVPN □ CL32Y226KAVVPN □ CL32B105KBJ4PN □ CL32B335KBJVPN □ CL32B475KBJVPN □ CL32B685KBJVPN □ CL32Y685KBJVPN □ CL32Y106KBJ4PN □ CL32B225KCJVPN □ Remark 13 High Bending Strength ESD Protection Feature - AEC-Q200 qualified, 5mm bending strength guaranteed. - Strong thermo-mechanical properties. - Soft termination has been tested according to the VW 80808-2. Application - ‌Critical circuits and battery line circuits. (Prevent a module/sub-system failure in the event of a cracked/shorted capacitor) Structure and Dimensions Standard Design BW L [VPJ] [WPJ] Dimension(mm) W T 05 10 0402 0603 1.00±0.10 1.60±0.20 0.50±0.05 0.80±0.10 21 0805 2.00±0.30 1.25±0.20 31 32 1206 1210 3.20±0.30 3.20±0.40 1.60±0.30 2.50±0.30 L 0402 (1005) 0.50 0603 (1608) 0.80 0805 (2012) 1.25 1206 (3216) 1.60 1210 (3225) 14 2.50 Rated Voltage (Vdc) 10 16 25 50 16 25 50 100 10 16 25 50 100 10 16 25 50 6.3 10 16 25 50 10 22 47 nF 0.50±0.05 0.80±0.10 0.85±0.10 1.25±0.20 1.60±0.30 2.50±0.30 Capacitance 100 220 X7S 470 X7S 1 X7S Plating(Sn) Plating(Ni) Termination(Metal - Epoxy) Termination(Cu) L BW 2.2 4.7 uF 10 Size Code EIA Code 10 0603 0.25±0.10 0.30±0.20 Dimension(mm) L W T BW 1.70±0.10 0.90±0.10 0.90±0.10 0.30±0.20 15 33 0.5+0.2/-0.3 0.5±0.3 0.6±0.3 High Bending Strength Capacitance Table (X7R/X7S) Size inch Thickness (mm) (mm) Ceramic Body Electrode(Ni) W Electrode(Ni) Ceramic Body EIA Code - ‌Input and output sections in a wide range of automotive electronics. T Electrode(Ni) Ceramic Body Size Code Application BW Plating(Sn) Plating(Ni) Termination(Soft Termination) Termination(Cu) W - Compliance with the IEC 61000-4-2 standard for ESD immunity. - Enhanced DC-Bias & Breakdown voltage. Structure and Dimensions Open mode Design T Feature Premium Capacitors for Automotive Applications Special Automotive Capacitors 22 ESD Protection Capacitance Table (X7R) Size inch (mm) Thickness (mm) Rated Voltage (Vdc) 0603(1608) 0.80 100 Capacitance nF 1 1.5 2.2 3.3 4.7 6.8 10 22 47 47 X7S X7S X7S 15 Special Automotive Capacitors Product Line up (High Bending Strength Capacitors) ■ Size : 1.00×0.50mm (inch : 0402) ■ Size : 3.20×1.60mm (inch : 1206) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 0.55 0.55 0.55 0.55 0.55 0.55 0.55 0.55 16 16 16 16 25 25 50 50 X7R X7R X7R X7R X7R X7R X7R X7R 10nF 22nF 47nF 100nF 22nF 10nF 10nF 22nF ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL05B103KO5VPJ □ CL05B223KO5VPJ □ CL05B473KO5VPJ □ CL05B104KO5VPJ □ CL05B223KA5VPJ □ CL05B103KA5VPJ □ CL05B103KB5VPJ □ CL05B223KB5VPJ □ Remark ■ Size : 1.60×0.80mm (inch : 0603) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 0.90 6.3 10 16 16 16 25 25 25 50 50 50 50 50 50 50 50 50 50 100 100 100 100 100 100 X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R 1uF 1uF 47nF 470nF 1uF 47nF 100nF 1uF 1nF 1.5nF 2.2nF 4.7nF 22nF 33nF 47nF 68nF 100nF 220nF 1nF 2.2nF 4.7nF 10nF 22nF 47nF ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL10B105KQ8VPJ □ CL10B105KP8VPJ □ CL10B473KO8VPJ □ CL10B474KO8VPJ □ CL10B105KO8VPJ □ CL10B473KA8VPJ □ CL10B104KA8VPJ □ CL10B105KA8VPJ □ CL10B102KB8WPJ □ CL10B152KB8WPJ □ CL10B222KB8WPJ □ CL10B472KB8WPJ □ CL10B223KB8VPJ □ CL10B333KB8VPJ □ CL10B473KB8VPJ □ CL10B683KB8VPJ □ CL10B104KB8VPJ □ CL10B224KB8VPJ □ CL10B102KC8WPJ □ CL10B222KC8WPJ □ CL10B472KC8WPJ □ CL10B103KC8WPJ □ CL10B223KC8VPJ □ CL10B473KC8VPJ □ Remark 16 No. Thickness Max. (mm) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 1.45 10 16 16 16 25 25 25 50 50 50 50 50 50 50 50 50 100 100 100 100 TCC Capacitance Capacitance Tolerance Part Number X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R 1uF 1uF 2.2uF 4.7uF 220nF 1uF 10uF 15nF 22nF 47nF 100nF 220nF 330nF 470nF 1uF 4.7uF 10nF 47nF 22nF 100nF ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL21B105KPFVPJ □ CL21B105KOFVPJ □ CL21B225KOFVPJ □ CL21B475KOQVPJ □ CL21B224KAFVPJ □ CL21B105KAFVPJ □ CL21Y106KABVPJ □ CL21B153KBFWPJ □ CL21B223KBFWPJ □ CL21B473KBFWPJ □ CL21B104KBFWPJ □ CL21B224KBFVPJ □ CL21B334KBFVPJ □ CL21B474KBFVPJ □ CL21B105KBFVPJ □ CL21Y475KBYVPJ □ CL21B103KCCWPJ □ CL21B473KCFWPJ □ CL21B223KCFWPJ □ CL21B104KCFWPJ □ Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 8 9 10 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 1.90 10 16 16 25 25 25 50 50 50 50 X7R X7R X7R X7R X7R X7R X7R X7R X7R X7R 4.7uF 4.7uF 10uF 4.7uF 10uF 10uF 1uF 2.2uF 4.7uF 10uF ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL31B475KPHVPJ □ CL31B475KOHVPJ □ CL31B106KOHVPJ □ CL31B475KAHVPJ □ CL31B106KAKVPJ □ CL31B106KAHVPJ □ CL31B105KBHVPJ □ CL31B225KBHVPJ □ CL31B475KBHVPJ □ CL31Y106KBKVPJ □ Remark ■ Size : 3.20×2.50mm (inch : 1210) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 2.85 2.80 2.80 6.3 16 50 X7S X7R X7S 47uF 22uF 10uF ±20% ±10% ±10% CL32Y476MQVVPJ □ CL32B226KOJVPJ □ CL32Y106KBJVPJ □ Remark Product Lineup (High Bending Strength Capacitors_Failsafe) ■ Size : 1.60×0.80mm (inch : 0603) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 0.90 0.90 100 100 X7R X7R 10nF 22nF ±10% ±10% CL10B103KC8XPJ □ CL10B223KC8XPJ □ Remark ■ Size : 2.00×1.25mm (inch : 0805) ■ Size : 2.00×1.25mm (inch : 0805) Rated Voltage (Vdc) No. Premium Capacitors for Automotive Applications Product Line up (High Bending Strength Capacitors) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 1.45 1.45 50 100 X7R X7R 100nF 100nF ±10% ±10% CL21B104KBFXPJ □ CL21B104KCFXPJ □ Remark Remark Product Lineup (ESD Protection Capacitors) ■ 1.60×0.80mm (inch : 0603) No. Thickness Max. (mm) Rated Voltage (Vdc) TCC Capacitance Capacitance Tolerance Part Number 1 2 3 4 5 6 7 1.00 1.00 1.00 1.00 1.00 1.00 1.00 100 100 100 100 100 100 100 X7R X7R X7R X7R X7R X7R X7R 1nF 1.5nF 2.2nF 3.3nF 4.7nF 6.8nF 10nF ±10% ±10% ±10% ±10% ±10% ±10% ±10% CL10B102KC84PE □ CL10B152KC84PE □ CL10B222KC84PE □ CL10B332KC84PE □ CL10B472KC84PE □ CL10B682KC84PE □ CL10B103KC84PE □ Remark ※ □ mark means packing code. If you want to know the code or quantity in detail, please see page 21 17 Reliability Test Conditions Item Performance 1 Pre-and Post-Stress Electrical Test Appearance 2 High Temperature Exposure No abnormal exterior appearance Unpowered, 1000hrs@T = 125℃ Capacitance ≥ ‌ 30pF : Q≥ 1,000 Q ClassⅠ ＜ 30pF : Q≥ 400 + 20 X C (C : Capacitance) Rated Voltage ≥ ‌ 25V : 0.030 max Tanδ ClassⅡ ≥ 16V : 0.050 max *1) ≥ 10V : 0.075 max More than 10,000㏁ or 500㏁ X ㎌ IR (Whichever is smaller) *1) No abnormal exterior appearance Temperature Cycling More than 10,000㏁ or 500㏁ X ㎌ (Whichever is smaller) IR Destructive Physical Analysis Appearance *1) Biased Humidity Q Appearance 2 3 4 No abnormal exterior appearance 1000hrs 85℃ / 85%RH, Rated voltage and 1.3 ~ 1.5V, (add 100kohm resistor) 10 1 30±3 1 1000hrs @ TA=125℃, 200% Rated Voltage, *2) No abnormal exterior appearance Vibration Appearance 12 13 IR 7 External Visual 8 Physical Dimensions More than 1,000㏁ or 50㏁ X ㎌ (Whichever is smaller) ESD No abnormal exterior appearance Microscope (x10) Within the specified dimensions Using the calipers ※ *1) : Indicates typical specification. Please refer to individual specifications. *2) : Some of the parts are applicable in rated voltage × 150% or × 120%, Please refer to individual specifications. 95% of the terminations is to be soldered evenly and continuously Solderability Capacitance Q Tanδ Electrical 14 Characterization IR@25℃ IR@125℃ *1) No abnormal exterior appearance Within±2.5% or ±0.25pF, Capacitance ClassⅠ (Whichever is larger) Change ClassⅡ Within±10% Capacitance ≥ ‌ 30pF : Q≥ 1,000 Q ClassⅠ ≥ 30pF : Q≥ 400 + 20 X C (C : Capacitance) Rated Voltage ≥ ‌ 25V : 0.025 max Tanδ ClassⅡ ≥ 16V : 0.035 max *1) ≥ 10V : 0.050 max More than 10,000㏁ or 500㏁ X ㎌ IR (Whichever is smaller) *1) ClassⅠ Tanδ No abnormal exterior appearance Within±2.5% or ±0.25pF, Capacitance ClassⅠ (Whichever is larger) Change ClassⅡ Within±10% Capacitance ≥ ‌ 30pF : Q≥ 1,000 Resistance Q ClassⅠ ≥ 30pF : Q≥ 400 + 20 X C to Solder (C : Capacitance) Heat Rated Voltage ≥ ‌ 25V : 0.025 max Tanδ ClassⅡ ≥ 16V : 0.035 max *1) ≥ 10V : 0.050 max More than 10,000㏁ or 500㏁ X ㎌ IR (Whichever is smaller) *1) Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Capacitance ≥ ‌ 30pF : Q≥ 350 ≥ 10pF : Q≥ 275 + (15 / 2) X C Final Measurement ＜ 10pF : Q≥ 200 + 10 X C Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour (C : Capacitance) and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Rated Voltage ≥ ‌ 25V : 0.035 max ClassⅡ 16V : 0.050 max ≥ *1) ≥ 10V : 0.075 max Q 11 No abnormal exterior appearance Within±2.5% or ±0.25pF, Capacitance ClassⅠ (Whichever is larger) Change ClassⅡ Within±10% Capacitance ≥ ‌ 30pF : Q≥ 1,000 Q ClassⅠ ＜ 30pF : Q≥ 400 + 20 X C (C : Capacitance) Rated Voltage ≥ ‌ 25V : 0.025 max Tanδ ClassⅡ ≥ 16V : 0.035 max *1) ≥ 10V : 0.050 max More than 10,000㏁ or 500㏁ X ㎌ IR (Whichever is smaller) *1) Appearance 30±3 *1) Within±3.0% or ±0.3pF, Capacitance ClassⅠ (Whichever is larger) Change ClassⅡ Within±12.5% 18 Appearance Time(min.) Per EIA 469 More than 500㏁ or 25㏁ X ㎌ (Whichever is smaller) IR 6 1 Temperature(℃) Min. operating Temp.+0/ -3 25±2 Max. operating Temp.+3/ - 0 25±2 Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Capacitance ≥ ‌ 30pF : Q≥ 200 ClassⅠ ＜ 30pF : Q≥ 100 + (10/3) X C Final Measurement (C : Capacitance) Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour Rated Voltage ≥ ‌ 25V : 0.035 max and leave the capacitor in ambient condition for 24±2 hours ClassⅡ ≥ 16V : 0.050 max before measurement. Then perform the measurement *1) ≥ 10V : 0.075 max Tanδ High Temperature Operating Life Step No defects or abnormalities Within±2.5% or ±0.25pF, Capacitance ClassⅠ (Whichever is larger) Change ClassⅡ Within±12.5% 5 Final Measurement Leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Rated Voltage ≥ ‌ 25V : 0.030 max ClassⅡ ≥ 16V : 0.050 max *1) ≥ 10V : 0.075 max Tanδ 4 Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. 9 Capacitance ≥ ‌ 30pF : Q≥ 1,000 Final Measurement ClassⅠ ＜ 30pF : Q≥ 400 + 20 X C Leave the capacitor in ambient condition for 24±2 hours (C : Capacitance) before measurement. Then perform the measurement. Q Performance No abnormal exterior appearance Within±2.5% or ±0.25pF, Capacitance ClassⅠ (Whichever is larger) Change ClassⅡ Within±10% Capacitance ≥ ‌ 30pF : Q≥ 1,000 Mechanical Q ClassⅠ ＜ 30pF : Q≥ 400 + 20 X C Shock (C : Capacitance) Rated Voltage ≥ ‌ 25V : 0.025 max Tanδ ClassⅡ ≥ 16V : 0.035 max *1) ≥ 10V : 0.050 max More than 10,000㏁ or 500㏁ X ㎌ IR (Whichever is smaller) *1) 1000Cycles Within±2.5% or ±0.25pF, Capacitance ClassⅠ (Whichever is larger) Change ClassⅡ Within±10% 3 Item Appearance - Within±2.5% or ±0.25pF, Capacitance ClassⅠ (Whichever is larger) Change ClassⅡ Within±10% Appearance No. Test condition Test condition Three shocks in each direction should be applied along 3 mutually perpendicular axes of the test specimen (18 shocks) Peak value 1,500G Duration 0.5ms Wave Half sine Velocity 4.7m / sec Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Final Measurement Leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. 5g's for 20min., 12cycles each of 3 orientations, Use 8"× 5" PCB 0.031" Thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10~2000Hz. Reliability Test Conditions No. Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Final Measurement Leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Solder pot : 260±5℃, 10±1sec. Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Final Measurement Leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. AEC - Q200 - 002 Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Final Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. a) Preheat at 155℃ for 4 hrs, Immerse in solder for 5s at 235±5℃ b) Steam aging for 8 hrs, Immerse in solder for 5s at 235±5℃ c) Steam aging for 8 hrs, Immerse in solder for 120s at 260±5℃ solder : a solution ethanol and rosin Within specified tolerance The Capacitance / D.F. should be measured at 25℃, * ‌Capacitance shall be measured after the heat treatment of 150+0 Capacitance ≥ ‌ 30pF : Q≥ 1,000 ClassⅠ ＜ 30pF : Q≥ 400 + 20 X C / -10℃ for 1hr and leaving for 24±2hr at room temperature. (C : Capacitance) Class Capacitance Frequency Voltage 1000㎊↓ 1㎒±10% 0.5 ~ 5.0Vrms Rated Voltage ≥ ‌ 25V : 0.025 max Ⅰ ClassⅡ 1000㎊↑ ≥ 16V : 0.035 max 1㎒±10% 1.0±0.2Vrms *1) ≥ 10V : 0.050 max 10㎌↓ Ⅱ 10㎌↑ 120㎐±20% 0.5±0.1Vrms than 100,000㏁ or 1,000㏁ X ㎌ ClassⅠ More (Whichever is smaller) I.R. should be measured with a DC voltage not exceeding More than 10,000㏁ or 500㏁ X ㎌ Rated Voltage @25℃, @125℃ for 60 ~ 120 sec. ClassⅡ (Whichever is smaller) Dielectric Strength : 250% of the rated voltage for 1 ~ 5 seconds More than 10,000㏁ or 100㏁ X ㎌ The charge / discharge current is less than 50mA. ClassⅠ (Whichever is smaller) ClassⅡ Dielectric Strength More than 1,000㏁ or 10㏁ X ㎌ (Whichever is smaller) No dielectric breakdown or mechanical breakdown ※ *1) : Indicates typical specification. Please refer to individual specifications. 19 Reliability Test Conditions Item Performance Appearance No abnormal exterior appearance Test condition Bending to the limit for 60 seconds. Limit : ClassⅠ- 3mm ClassⅡ- 2mm *1) (Substrate for board flex test) Packaging Φ4.5 b ClassⅠ Within±5.0% or ±0.5pF, (Whichever is larger) c 40㎜ This specification applies to taping of MLCC When customers require, the specification may be changed under the agreement. Figure a Cover tape 100㎜ 15 Code(Inch) 05(0402) 10(0603) 21(0805) 31(1206) 32(1210) Board Flex Capacitance Change ClassⅡ Within±10% Packaging Specifications No. Packaging Specifications Dimension(mm) 1.0 × 0.5 1.6 × 0.8 2.0 × 1.25 3.2 × 1.6 3.2 × 2.5 1.6㎜ a 0.5 0.6 0.8 2.0 2.0 b 1.5 2.2 3.0 4.4 4.4 [unit : mm] c 0.6 0.9 1.3 1.7 2.6 Paper or Embossed tape Reel Material: Glass epoxy substrate Thickness: T=1.6㎜ Empty Section 200mm Chip mounting section Empty Section 280mm Loading 240mm Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Final Measurement Leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. END Start Unreeling Appearance 16 Terminal Strength (SMD) ClassⅠ No abnormal exterior appearance 18N, for 60±1 sec. * 0603(1608) -10N, 0402(1005) -2N Within±2.5% or ±0.25pF, (Whichever is larger) Initial Measurement Perform the heat treatment at 150℃ +0 / -10℃ for 1 hour and leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Capacitance Change ClassⅡ Within±10% Destruction value should be exceed Chip Length ≤ 2.5mm 17 Beam Load a) Chip Thickness > 0.5mm : 20N b) ‌Chip Thickness ≤ 0.5mm : 8N Chip Length ≥ 3.2mm a) Chip Thickness ≥ 1.25mm : 54.5N b) Chip Thickness < 1.25mm : 15N Final Measurement Leave the capacitor in ambient condition for 24±2 hours before measurement. Then perform the measurement. Quantity Type Beam speed Chip Length ≤ 2.5mm, 0.50±0.05mm / sec. Chip Length ≥ 3.5mm, 2.50±0.25mm / sec. Capacitance shall be measured by the steps shown in the following table. Step 1 2 3 4 5 ClassⅠ 0±30ppm / ℃ 18 Capacitance Tempera- Capacitance ture Change Characteristics Temperature(℃) 25±2 Min. operating temp.±2 25±2 Max. operating temp.±2 25±2 ■ Class I Temperature Coefficient shall be calculated from the formula as below C2 - C1 Temp. Coefficient = ×106[ppm /℃] C1×△T C1 : Capacitance at step 3 C2 : Capacitance at 125℃ △T : 125℃ - 25℃ = 100℃ ClassⅡ Within±15% ■ Class II Capacitance change shall be calculated from the formula as below C2 - C1 ×100(%) △C = C1 C1 : Capacitance at step 3 C2 : Capacitance at step)2 or step 4 [unit : pcs] Size Code Inch(mm) Chip Thickness Taping Type Pitch Plastic 7 inch reel Plastic 10 inches reel Plastic 13 inches reel 0402 (01005) 0.2 mm PAPER 2mm 20k - 100K 0603 (0201) 0.3 mm PAPER 2mm 10K - 50K 1005 (0402) 0.5 mm PAPER 2mm 10K - 50K 1608 (0603) 0.8 mm PAPER 4mm 4K 10K 15K / 10K T≤0.85 mm PAPER 4mm 4K 10K 15K / 10K T≥1.0 mm EMBOSSED 4mm 2K 6K 10K T≤0.85 mm PAPER 4mm 4K 10K 10K T≥1.0 mm EMBOSSED 4mm 2K 4K 10K T≤1.6 mm EMBOSSED 4mm 2K 4K 10K T≥2.0 mm EMBOSSED 4mm 1K 4K 4K T≤1.6 mm EMBOSSED 8mm 2k - 8k T≥2.0 mm EMBOSSED 8mm 1k - 4k T≤2.0 mm EMBOSSED 8mm - - 4K T>2.0 mm EMBOSSED 8mm - - 2K T≥2.5 mm EMBOSSED 8mm - - 2K 2012 (0805) MLCC 3216 (1206) 3225 (1210) 4520 (1808) 4532 (1812) 5750 (2220) ※ *1) : Indicates typical specification. Please refer to individual specifications. If you want more detaiedl imformation, Please Visit Samsung Electro - mechanics website ( www.semlcr.com ) 20 21 Packaging Specifications Tape Size Cardboard(Paper) tape : 4mm pitch Embossed(Plastic) tape Feeding Hole Feeding Hole Chip inserting Hole Chip Inserting Hole D D E E A F A F W t1 P2 P0 P1 W B B t P0 t0 P2 P1 [unit : mm] Size Inch(mm) A B 0603 (1608) 1.00 ±0.10 1.90 ±0.10 0805 (2012) 1.55 ±0.10 2.30 ±0.10 1206 (3216) 2.05 ±0.10 3.60 ±0.10 W F 8.00 ±0.30 E 3.50 ±0.05 P1 1.75 ±0.10 P2 4.00 ±0.10 2.00 ±0.05 P0 4.00 ±0.10 D Φ1.50 +0.10/-0 t 1.10 Below ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances. Cardboard(Paper) tape : 2mm pitch Feeding Hole Chip inserting Hole D E A F W B t P2 P0 P1 [unit : mm] Size Inch(mm) A B 1005 (0402) 0.25 ±0.02 0.46 ±0.02 0.25 ±0.02 0201 (0603) 0.38 ±0.03 0.68 ±0.03 0.35 ±0.03 0402 (1005) 0.62 ±0.05 1.12 ±0.05 0204 (0510) 0.62 0.05 /-0.10 1.12 0.05 /-0.10 W 8.00 ±0.30 F 3.50 ±0.05 E 1.75 ±0.10 P1 2.00 ±0.05 Packaging Specifications Tape Size P2 2.00 ±0.05 P0 4.00 ±0.10 D Φ1.50 0.10 /-0.03 t [unit : mm] Size Inch(mm) A B W F E P1 P2 P0 D 01005 (0402) 0.23 ±0.02 0.45 ±0.02 4.00 ±0.05 1.80 ±0.02 0.90 ±0.05 1.00 ±0.02 1.00 ±0.02 2.00 ±0.03 Φ0.80 ±0.04 015008 (5025) 0.32 ±0.03 0.58 ±0.03 0603 (1608) 1.05 ±0.15 1.90 ±0.15 0805 (2012) 1.45 ±0.20 2.30 ±0.20 1206 (3216) 1.90 ±0.20 3.50 ±0.20 1210 (3225) 2.80 ±0.20 3.60 ±0.20 1808 (4520) 2.30 ±0.20 4.90 ±0.20 1812 (4532) 3.60 ±0.20 4.90 ±0.20 2220 (5750) 5.50 ±0.20 6.20 ±0.20 0204 (0510) 0.62 0.05 /-0.10 1.12 0.05 /-0.10 0306 (0816) 1.10 ±0.20 1.90 ±0.20 Φ1.50 0.1 /-0.03 2.00 ±0.05 8.00 ±0.30 t1 t0 0.35 Below 0.50 Below 3.50 ±0.05 4.00 ±0.10 2.50 Below 2.00 ±0.05 1.75 ±0.10 12.0 ±0.30 5.60 ±0.05 8.00 ±0.10 8.00 ±0.30 3.50 ±0.05 4.00 ±0.10 4.00 ±0.10 Φ1.50 0.10 /-0 0.60 Below 3.80 Below 2.50 Below ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances. 0.60 ±0.05 0.37 ±0.03 ※ The A, B in the table above are based on normal dimensions. The data may be changed with the special size tolerances. 22 23 Packaging Specifications BOX package Packaging Specifications Tape Size Packaging Label Reel Size E REEL & Box Type Label includes the information as below. C 1) Chip size C B 2) Temperature Characteristics D 3) Nominal Capacitance 4) Model Name 5) LOT Number & Reel Number 6) Q’ty t A W [unit : mm] Symbol Tape Width A B C D E W t 4mm Φ178±2.0 MINΦ50 Φ13±0.5 21±0.8 2.0±0.5 5±0.5 1.2±0.2 Box Packaging MINΦ50 Φ13±0.5 21±0.8 2.0±0.5 10±1.5 0.9±0.2 2) Avoid any damages during transportation by car, airplane and ship. MINΦ50 Φ13±0.5 21±0.8 2.0±0.5 13±0.5 1.2±0.2 MINΦ70 Φ13±0.5 21±0.8 2.0±0.5 10±1.5 1.8±0.2 MINΦ70 Φ13±0.5 21±0.8 2.0±0.5 10±1.5 1.8±0.2 MINΦ70 Φ13±0.5 21±0.8 2.0±0.5 13±0.5 2.2±0.2 8mm 7”Reel 12mm 8mm 10”Reel 8mm 13”Reel 12mm Φ178±2.0 Φ178±2.0 Φ258±2.0 Φ330±2.0 Φ330±2.0 1) Double packaging with the paper type of inner box and outer box. 3) Remark information of contents on inner box and outer box ※ If special packaging is required, please contact us. 7" Box packaging [Unit : mm] • Inner Box (7" x 5 REEL) • Inner Box (7" x 10 REEL) 30±1.0 30±2.0 Cover tape peel-off force Peel-off force 10 g.f ≤ peel-off force ≤ 70 g.f 185±1.0 185±2.0 66±1.0 Measurement Method 185±1.0 Cover Tape’s Pulling Strength Top Tape 165 ~ 180。 122±2.0 300mm / min. 185±2.0 • Outer Box (7" x 20 REEL) • Outer Box (7" x 60 REEL) Paper or Embossed Tape Bottom Tape 195±5.0 215±5.0 285±5.0 Unreeling Direction 187±5.0 410±5.0 370±5.0 - Taping Packaging design : Packaging design follows IEC 60286-3 standard. (IEC 60286-3 Packaging of components for automatic handling - parts 3) * If the static electricity of SMT process causes any problems, please contact us. 24 25 Application Manual Product Characteristic data 13” Box packaging • Inner Box (13" × 4 REEL) • Outer Box (13" × 20 REEL) 1. Capacitance 30±1.0 The capacitance is the ratio of the change in an electric charge according to voltage change. Due to the fact that the capacitance may be subject to change with the measured voltage and frequency, it is highly recommended to measure the capacitance based on the following conditions. 337±1.0 1-1. Measure capacitance with voltage and frequency specified in this document. Regarding the voltage/frequency condition for capacitance measurement of each MLCC model, please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document. 348±5.0 339±5.0 66±1.0 ■ Class Ⅰ 0402 (1005) 0805 (2012) 1210 (3225) 1812 (4532) Capacitance Size(T) (mm) Temp. 0.20 C0G Weight (mg/pc) Size(L/W) Inch(mm) 0.082 0201 (0603) Size(T) (mm) Temp. Weight (mg/pc) 0.30 C0G 0.233 0.30 X7R 0.285 0.20 X7R 0.083 0.20 X5R 0.093 0.30 X5R 0.317 0.50 C0G 1.182 0.80 C0G 4.615 0.80 X7R 5.522 0603 (1608) 0.50 X7R 1.559 0.50 X5R 1.560 0.80 X5R 5.932 0.65 C0G 7.192 1.25 C0G 28.086 1.25 X7R 16.523 1.60 X7R 54.050 1.25 X5R 16.408 1.60 X5R 45.600 2.50 X7R 116.197 1.25 C0G 47.382 2.50 X5R 121.253 1.25 X7R 63.136 1.25 X7R 96.697 1.60 X7R 260.897 The weight of product is typical value per size, for more details, please contact us. 1206 (3216) 1808 (4520) 2220 (5750) ■ Class Ⅱ Frequency Voltage ≤ 1,000 pF 1 MHz ± 10% Capacitance Frequency Voltage 1 kHz ± 10% 1.0 ± 0.2 Vrms 120 Hz ± 20% 0.5 ± 0.1 Vrms 1 kHz ± 10% 0.5 ± 0.1 Vrms > 1,000 pF Chip Weight 1005 (0402) The following table shows the voltage and frequency condition according to the capacitance range. [The voltage and frequency condition according to MLCC the capacitance range] 336±5.0 337±1.0 Size(L/W) Inch(mm) Packaging Specifications Packaging Specifications ≤ 10 pF > 10 pF Exception* 1 kHz ± 10% 0.5 ~ 5 Vrms Capacitance shall be measured after the heat treatment of 150 + 0/-10℃ for 1hr, leaving at room temperature for 24±2hr. (Class Ⅱ) 1-2. It is recommended to use measurement equipment with the ALC (Auto Level Control) option. The reason is that when capacitance or measurement frequency is high, the output voltage of measurement equipment can be lower than the setting voltage due to the equipment limitation. Note that when capacitance or measurement frequency is excessively high, the measurement equipment may show ALC off warning and provide a lower output voltage than the setting voltage even with ALC option selected. It is necessary to ensure the output voltage of measurement equipment is the same as the setting voltage before measuring capacitance. 1-3. ‌Capacitance value of high dielectric constant (Class II) MLCC changes with applied AC and DC voltage. Therefore, it is necessary to take into account MLCC’s AC voltage characteristics and DC-bias voltage characteristics when applying MLCC to the actual circuit. 1-4. The capacitance is in compliance with the EIA RS-198-1-F-2002. 2. Tan δ (DF) 2-1. An ‌ ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of electrode. DF (Dissipation Factor) is defined as the ratio of loss energy to stored energy and typically being calculated as percentage. 2-2. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy. The equation can be described as 1/DF. Normally the loss characteristic of Class I MLCC is presented in Q, since the DF value is so small whereas the loss characteristic of Class II MLCC is presented in DF. 2-3. It ‌ is recommended to use Class I MLCC for applications to require good linearity and low loss such as coupling circuit, filter circuit and time constant circuit. 26 27 5-2. When ‌ selecting MLCC, it is necessary to consider the heat characteristics of a system, room temperature and TCC of MLCC, since the applied temperature may change the capacitance of MLCC. 3. Insulation Resistance Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties. Insulation resistance is defined as the ratio of a leakage current to DC voltage. 5-3. In addition, Bias TCC of MLCC should be taken into account when DC voltage is applied to MLCC. 3-1. ‌When applying DC voltage to MLCC, a charging current and a leakage current flow together at the initial stage of measurement. While the charging current decreases, and insulation resistance (IR) in MLCC is saturated by time. Therefore, insulation resistance shall be measured 1 minute after applying the rated voltage. 6. Self-heating Temperature It is necessary to design the system, with considering self-heating generated by the ESR (Equivalent Series Resistance) of MLCC when AC voltage or pulse voltage is applied to MLCC. Application Manual Application Manual 6-1. ‌When MLCC is used in an AC voltage or pulse voltage circuit, self-heating is generated when AC or pulse current flows through MLCC. Short-circuit may be occurred by the degradation of MLCC’s insulating properties. 4. Capacitance Aging The aging characteristic is that the high dielectric (Class II) MLCC decreases capacitance value over time. It is also necessary to consider the aging characteristic with voltage and temperature characteristics when Class II MLCC is used in circuitry. 4-1. In ‌ general, aging causes capacitance to decrease linearly with the log of time as shown in the following graph. Please check with SEMCO for more details, since the value may vary between different models. Capacitance Change(%) 4-2. After ‌ heat treatment (150°C, 1hour), the capacitance decreased by aging is recovered, so aging should be considered again from the time of heat treatment. 6-2. The ‌ reliability of MLCC may be affected by MLCC being used in an AC voltage or pulse voltage circuit, even the AC voltage or the pulse voltage is within the range of rated voltage. Therefore, make sure to check the following conditions. 1) ‌The surface temperature of MLCC must stay within the maximum operating temperature after AC or Pulse voltage is applied. 2) The rise in increase by self-heating of MLCC must not exceed 20°C Temperature Rise (℃) 100 C0G X7R X5R 1 10 100 1,000 10,000 100,000 10 10KHz 100KHz 500KHz 1000KHz 1 Time(h) 0 [ Example of Capacitance Aging ] * Sample : C0G, X7R, X5R 1 2 3 4 5 Ripple Current (Arms) [ Example of Ripple current ] * Sample : X5R 10uF, Rated voltage 6.3V 5. Temperature Characteristics of Capacitance (TCC) Please consider temperature characteristics of capacitance since the electrical characteristics such as capacitance changes which is caused by a change in ceramic dielectric constant by temperature. 20 20 0 0 -20 -20 △C(%) △C(%) 5-1. ‌It is necessary to check the values specified in section “C. Reliability test Condition–Temperature Characteristics” for the temperature and capacitance change range of MLCC. -40 -60 -80 -60 -80 -100 DC Voltage = 3.15 Vdc -100 -55 28 -40 -35 -15 5 25 45 65 85 -55 -35 -15 5 25 45 65 85 Temperature (℃) Temperature (℃) [ Example of Temperature Characteristics (X5R) ] * Sample : 10uF, Rated voltage 6.3V [ Example of Bias TCC ] * Sample : 10uF, Rated voltage 6.3V 105 125 29 7. DC & AC Voltage Characteristics 8. Impedance Characteristic It is required to consider voltage characteristics in the circuit since the capacitance value of high dielectric constant MLCC(Class II) is changed by applied DC & AC voltage. Electrical impedance (Z) of MLCC is the measurement of the opposition that MLCC presents to a current (I) when a voltage (V) is applied. It is defined as the ratio of the voltage to the current (Z=V/I). Impedance extends the concept of resistance to AC circuits and is a complex number consisting of the real part of resistance (R) and the imaginary part of reactance (X) as Z=R+jX. Therefore, it is required to design circuit with consideration of the impedance characteristics of MLCC based on the frequency ( Z = R + jX ) 7-1. Please ‌ ensure the capacitance change is within the allowed operating range of a system. In particular, when high dielectric constant type MLCC (Class II) is used in circuit with narrow allowed capacitance tolerance, a system should be designed with considering DC voltage, temperature characteristics and aging characteristics of MLCC. 20 8-1. MLCC ‌ operates as a capacitor in the low frequency and its reactance (XC) decreases as frequency increases ( X_C=1/j2πfC ) where f is frequency and C is capacitance. The resistance (ESR; Equivalent Series Resistance) of MLCC in the low frequency mainly comes from the loss of its dielectric material. 0 -20 △C(%) Application Manual Application Manual 8-2. MLCC ‌ operates as an inductor in the high frequency and the inductance of MLCC is called ESL (Equivalent Series Inductance). The reactance (XL) of MLCC in the high frequency increases as frequency increases ( X_L=j2πf∙ESL ). The resistance (ESR) of MLCC in the high frequency mainly comes from the loss of its electrode metal. -40 -60 -80 8-3. ‌SRF (Self Resonant Frequency) of MLCC is the frequency where its capacitive reactance (XC) and inductive reactance(XL) cancel each other and the impedance of MLCC has only ESR at SRF. -100 0 1 2 3 4 5 6 8-4. The impedance of MLCC can be measured by a network analyzer or an impedance analyzer. When using the network analyzer, please note that the small-signal input may lead to the impedance of low capacitance caused by the AC voltage characteristic of MLCC. DC Voltage(V) [ Example of DC Bias characteristics ] * Sample : X5R 10uF, Rated voltage 6.3V Impedance IZI, ESR 7-2. It ‌ is necessary to consider the AC voltage characteristics of MLCC and the AC voltage of a system, since the capacitance value of high dielectric constant type MLCC (Class II) varies with the applied AC voltage. 100 (Capacitor region) 40 IZI, ESR [Ohm] 10 30 20 △C(%) -10 0 (Inductor region) SRF IZI 1 ESR 0.1 -10 -20 0.01 0.01 -30 0.1 1 10 100 1000 10000 Frequency (MHz) -100 0 0.5 1.0 1.5 AC Voltage(Vrms) 2.0 [ Example of Impedance characteristics ] * Sample : X5R 1uF, Rated voltage 6.3V [ Example of AC voltage characteristics ] * Sample : X5R 10uF, Rated voltage 6.3V 30 31 Electrical & Mechanical Caution 2-2. Effect of EOS (Electrical Overstress) · ‌Electrical Overstress such as a surge voltage or EOS can cause damages to MLCC, resulting in the electrical short failure caused by the dielectric breakdown in MLCC. 1. Derating MLCC with the test voltage at 100% of the rated voltage in the high temperature resistance test are labeled as “derated MLCC.” For this type of MLCC, the voltage and temperature should be derated as shown in the following graph for the equivalent life time of a normal MLCC with the test voltage at 150% of the rated voltage in the high temperature resistance test. · ‌Please use caution not to apply excessive electrical overstress including spike voltage MLCC when preparing MLCC for testing or evaluating. (1) Surge 1-1. The derated MLCC should be applied with the derating voltage and temperature as shown in the following graph. 1-2. ‌The “Temperature of MLCC” in the x-axis of the graph below indicates the surface temperature of MLCC including selfheating effect. The “Voltage Derating Ratio” in the y-axis of the graph below gives the maximum operating voltage of MLCC with reference to the maximum voltage (Vmax) as defined in section “3-2. Applied Voltage.” When the overcurrent caused by surge is applied to MLCC, the influx of current into MLCC can induce the overshooting phenomenon of voltage as shown in the graph below and result in the electrical short failure in MLCC. Therefore, it is necessary to be careful to prevent the influx of surge current into MLCC. (2) ESD (Electrostatic Discharge) Since the voltage of the static electricity is very high but the quantity of electric charge is small compared to the surge, ESD can cause damage to MLCC with low capacitance as shown in the following graph, whereas surge with lots of electric charge quantity can cause damages to even high capacitance MLCC. 100% 80% 1000 Measured Voltage of MLCC (53 Vmax) (Max. Temp. of MLCC) 40% Operating Max. Voltage * Voltage Derating Ratio = Rated Voltage of MLCC 20% Voltage of MLCC is higher than Surge voltage by overshooting. 0% 0 20 40 60 80 100 120 140 Temperature of MLCC (℃) [Example of derating graph for derated MLCC] * Vmax ≤ Derated Voltage * Only the Derating marked models Time [ Example of Surge applied to MLCC ] * Simulation for ESD 8kV Voltage of MLCC (V) 85℃ 105℃ 125℃ 60% High Stress for Low cap. MLCC Voltage of Surge (21 Vmax) Voltage Voltage Derating Ratio · ‌Down time of MLCC is varied with the applied voltage and the room temperature and a dielectric shock caused by EOS can accelerate heating on the dielectric. Therefore, it can bring about a failure of MLCC in a market at the early stage. Application Manual Application Manual 100 10 ( ESD 8kV ) 1 Voltage by ESD 0.1 0.01 0.001 0.01 0.1 1 10 100 Capacitancd (㎌) [ Example of ESD applied to MLCC ] 2. Applied Voltage The actual applied voltage on MLCC should not exceed the rated voltage set in the specifications. 3. Vibration 2-1. Cautions by types of voltage applied to MLCC Please check the types of vibration and shock, and the status of resonance. Manage MLCC not to generate resonance and avoid any kind of impact to terminals. When MLCC is used in a vibration environment, please make sure to contact us for the situation and consider special MLCC such as Soft-term, etc. · ‌For DC voltage or DC+AC voltage, DC voltage or the maximum value of DC + AC voltage should not exceed the rated voltage of MLCC. · ‌For AC voltage or pulse voltage, the peak-to-peak value of AC voltage or pulse voltage should not exceed the rated voltage of MLCC. · Abnormal voltage such as surge voltage, static electricity should not exceed the rated voltage of MLCC. 4. Shock Types of Voltage Applied to the Capacitor v Max 0 32 0 Time Time v Max v Max 0 DC+Pulse Voltage Voltage v Max DC+AC Voltage 2 Voltage DC+AC Voltage 1 Voltage AC Voltage Voltage Voltage DC Voltage Time 0 Time 5. Piezo-electric Phenomenon v Max 0 Mechanical stress caused by a drop may cause damages to a dielectric or a crack in MLCC Do not use a dropped MLCC to avoid any quality and reliability deterioration. When piling up or handling printed circuit boards, do not hit MLCC with the corners of a PCB to prevent cracks or any other damages to the MLCC. Time MLCC may generate a noise due to vibration at specific frequency when using the high dielectric constantMLCC (Class Ⅱ) at AC or Pulse circuits. MLCC may cause a noise if MLCC is affected by any mechanical vibrations or shocks 33 Process of Mounting and Soldering 1. Mounting 2. Caution before Mounting 1-1. Mounting position 2-1. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from the reel. It is recommended to locate the major axis of MLCC in parallel to the direction in which the stress is applied. 2-2. Check the capacitance characteristics under actual applied voltage. 2-3. Check the mechanical stress when actual process and equipment is in use. Application Manual Application Manual 2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly. Heat treatment must be done prior to measurement of capacitance. 2-5. Check the solderability of MLCC that has passed shelf life before use. 2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC. Not recommended Recommended 3. Cautions during Mounting with Mounting (pick-and-place) Machines 1-2. Cautions during mounting near the cutout Please take the following measures to effectively reduce the stress generated from the cutting of PCB. Select the mounting location shown below, since the mechanical stress is affected by a location and a direction of MLCC mounted near the cutting line. 3-1. Mounting Head Pressure Excessive pressure may cause cracks in MLCC. It is recommended to adjust the nozzle pressure within the maximum value of 300g.f. Additional conditions must be set for both thin film and special purpose MLCC. 3-2. Bending Stress When using a two-sided substrate, it is required to mount MLCC on one side first before mountin on the other side due to the bending of the substrate caused by the mounting head. Support the substrate as shown in the picture below when MLCC is mounted on the other side. If the substrate is not supported, bending of the substrate may cause cracks in MLCC. ④ ② Cutting line ① ③ ※ Relate mechanical stress ②>① ③>① ④>① Nozzle force 1-3. Cautions during mounting near screw If MLCC is mounted near a screw hole, the board deflection may be occurred by screw torque. Mount MLCC as far from the screw holes as possible. support pin 3-3. Suction nozzle Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of the nozzle. This may cause cracks in MLCC due to the excessive force during mounting. If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during positioning. A regular inspection such as maintenance, monitor and replacement for the suction nozzle and mounting claw should be conducted. Not recommended 34 Recommended 35 4-4. Optimum solder flux for reflow soldering 4. Reflow soldering MLCC is in a direct contact with the dissolved solder during soldering, which may be exposed to potential mechanical stress caused by the sudden temperature change. Therefore, MLCC may be contaminated by the location movement and flux. For the reason, the mounting process must be closely monitored. Method •‌Overly the thick application of solder pastes results in an excessive solder fillet height. This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which may cause cracks in MLCC. •Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to isolate from PCB •Check if solder has been applied uniformly after soldering is completed. Classification Overall heating Infrared rays Hot plate VPS(Vapor phase) Local heating Air heater Laser Light beam Reflow soldering Too Much Solder large stress may cause cracks Application Manual Application Manual Not enough solder Weak holding force may cause bad connections or detaching of the capacitor •It is required to design a PCB with consideration of a solder land pattern and its size to apply an appropriate amount of solder to MLCC. The amount of the solder at the edge may impact directly on cracks in MLCC. 4-1. Reflow Profile · Reflow Soldering Conditions Soldering Temp.(℃) 260 + 0 / -5℃ 10 sec. max. Pre - heating 5. flow soldering Gradual Cooling in the air 217℃ 5-1. Flow profile · Flow Soldering Conditions Pre - heating 200℃ Soldering Temp.(℃) 150℃ △T ⅰ) 3216 and below : 150℃ max 60~120sec. 60~150sec. Time (sec.) 4-2. Reflow temperature The following quality problem may occur when MLCC is mounted with a lower temperature than the reflow temperature recommended by a solder manufacturer. The specified peak temperature must be maintained after taking into consideration the factors such as the placement of peripheral constituent and the reflow temperature. •Drop in solder wettability •Solder voids •Potential occurrence of whisker •Drop in adhesive strength Gradual Cooling in the air Pre - heating Temp.(℃) Use caution not to exceed the peak temperature (260℃) and time (30sec) as shown. Pre-heating is necessary for all constituents including the PCB to prevent the mechanical damages on MLCC. The temperature difference between the PCB and the component surface must be kept to the minimum. As for reflow soldering, it is recommended to keep the number of reflow soldering to less than three times. Please check with us when the number of reflow soldering needs to exceed three times. Care must be exercised especially for the ultrasmall size, thin film and high capacitance MLCC as they can be affected by thermal stress more easily. 260±3℃ 5 sec. max. 120sec.min Time (sec.) Take caution not to exceed peak temperature (260℃) and time (5sec) as shown. In case of flow soldering, only 1608(0603inch), 2012(0805inch), 3216(1206inch) case size are recommended to use. Please contact us before use the type of high capacitance and thin film MLCC for some exceptions that may be caused. 5-2. Caution before Flow soldering •When a sudden heat is applied to MLCC, the mechanical rigidity of MLCC is deteriorated by the internal deformation of MLCC. Preheating all the constituents including PCB is required to prevent the mechanical damages on MLCC. The temperature difference between the solder and the surface of MLCC must be kept to the minimum. •If the flow time is too long or the flow temperature is too high, the adhesive strength with PCB may be deteriorated by the leaching phenomenon of the outer termination, or the capacitance value may be dropped by weak adhesion between the internal termination and the outer termination. •Drop in self-alignment properties •Potential occurrence of tombstones 4-3. Cooling Natural cooling with air is recommended. 36 37 6. Soldering Iron 7. Cleaning Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature soldering iron tip may come into a direct contact with the ceramic body of MLCC due to the carelessness of an operator. Therefore, the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. 7-1. In general, cleaning is unnecessary if rosin flux is used. 6-1. How to use a soldering Iron •‌In order to minimize damages on MLCC, preheating MLCC and PCB is necessary. A hot plate and a hot air type preheater should be used for preheating •Do not cool down MLCC and PCB rapidly after soldering. •‌Keep the contact time between the outer termination of MLCC and the soldering iron as short as possible. Long soldering time may cause problems such as adhesion deterioration by the leaching phenomenon of the outer termination. Variation of Temp. ΔT ≤ 130 Soldering Temp.(℃) Pre-heating Time(sec) Soldering Time(sec) Cooling Time(sec) 300±10℃ max * Control Δ T in the solder iron and preheating temperature. ≥60 ≤4 - When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the performance of MLCC. This means that the cleansing solution must be carefully selected and should always be new. 7-2. Cautions for cleaning MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong during cleaning. When high pressure cleaning equipment is used, test should be done for the cleaning equipment and its process before the cleaning in order to avoid damages on MLCC. Application Manual Application Manual 8. Cautions for using electrical measuring probes •Confirm the position of the support pin or jig when checking the electrical performance of MLCC after mounting on the PCB. •Watch for PCB bending caused by the pressure of a test-probe or other equipment. •If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may be damaged. Condition of Iron facilities Wattage Tip diameter Soldering time 20W max 3㎜ max 4sec max •Avoid PCB flexing by using the support pin on the back side of the PCB. •Place equipment with the support pin as close to the test-probe as possible. •Prevent shock vibrations of the board when the test-probe contacts a PCB. * Caution - Iron tip should not contact with ceramic body directly Lead-free solder: Sn-3.0Ag-0.5CU 6-2. How to use a spot heater Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and the PCB, which is likely to lessen the thermal shocks. For a high density PCB, a spot heater can prevent the problem to connect between a solder iron and MLCC directly. •‌If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the thermal stress. Follow the conditions set in the table below to prevent this problem. •The spot heater application angle as shown in the figure is recommended to create a suitable solder fillet shape Not recommended Test Pin Recommended 5㎜ ≤ Distance Hot Air Application angle 45℃ 9. Printed Circuit Board Cropping No zz le 400℃ ≥ 10s > He at er Hot Air Temperature Nozzle Outlet Application Time Test Pin •Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC on the PCB. •The stress as shown may cause cracks in MLCC when cutting the board. •Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit. •Avoid these types of stresses applied to MLCC. 45。 [Bending] [Twisting] 6-3. Cautions for re-work •‌Too much solder amount will increase the risk of PCB bending or cause other damages. •‌Too little solder amount will result in MLCC breaking loose from the PCB due to the inadequate adhesive strength. •‌Check if the solder has been applied properly and ensure the solder fillet has a proper shape. 9-1. Cautions for cutting PCB Check a cutting method of PCB in advance. The high density board is separated into many individual boards after the completion of soldering. If the board is bent or deformed during separation, MLCC may be cracked. Carefully select a separation method that minimizes the deformation of the PCB. * Soldering wire below 0.5mm is required for soldering. 38 39 10-5. Fastening screw 10. Assembly Handling 10-1. Cautions for PCB handling Hold the edges of the board mounted with MLCC with both hands since holding with one handmay bend the board. Do not use dropped boards, which may degrade the quality of MLCC. When attaching a shield on a board, the board may be bent during a screw tightening work Pay attention to the following conditions before performing the work. •Plan the work to prevent the board from bending •Use a torque driver to prevent over-tightening of the screw. 10-2. Mounting other components Pay attention to the following conditions when mounting other components on the back side of The board after MLCC has been mounted on the front side. When the suction nozzle is placed too close to the board, board deflection stress may be applied to MLCC on the back side, resulting in cracks in MLCC. Check if proper value is set on each chip mounter for a suction location, a mounting gap and a suction gap by the thickness of components. •Since the board may be bent by soldering, use caution in tightening the screw. Application Manual Application Manual 11. Adhesive selection Pay attention to the following if an adhesive is used to position MLCC on the board before soldering. 11-1. Requirements for Adhesives Nozzle •They must have enough adhesive strength to prevent MLCC from slipping or moving during the handling the board. •They must maintain their adhesive strength when exposed to soldering temperatures. Force •They should not spread when applied to the PCB. •They should have a long pot life. •They should hardened quickly. •They should not corrode the board or MLCC materials. •They should be an insulator type that does not affect the characteristic of MLCC. •They should be non-toxic, not harmful, and particularly safe when workers touch the adhesives. 10-3. Board mounting components with leads If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder joint may be cracked. Pay attention to the following: •Reduce the stress on the board during insertion by increasing the size of the lead insertion hole. •Insert components with leads into the board after fixing the board with support pins or a dedicated jig. •Support the bottom side of the board to avoid bending the board. •Check the status of the height of each support pin regularly when the support pins are used. 11-2. Caution before Applying Adhesive Check the correct application conditions before attaching MLCC to the board with an adhesive. If the dimension of land, the type of adhesives, the amount of coating, the contact surface areas, the curing temperature, or other conditions are not appropriate, it may degrade the MLCC performance. 11-3. Cautions for selecting Adhesive Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded. In addition, MLCC may be cracked by the difference in contractile stress caused by the different contraction rate between MLCC and the adhesive. 11-4. Cautions for the amount of applied adhesive and curing temperature •The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the mounting defect in MLCC •‌Excessive use of the adhesive may cause a soldering defect, loss of electrical connection, incorrect curing, or slippage of a mounting position, thereby an inflow of the adhesive onto theland section should be avoided. •‌If the curing temperature is too high or the curing time is too long, the adhesive strength will be degraded. In addition, oxidation both on the outer termination (Sn) of MLCC and the surface of the board may deteriorate the solderability. Not recommended Recommended 10-4. Socket and / or connector attach / detach Since the insertion or removal from sockets and connectors may cause the board to bent, make sure that MLCC mounted on the board should not be damaged in this process. Force 12. Flux 12-1. The ‌ excessive amount of flux generates excessive flux gases which may deteriorate solderability. Therefore, apply the flux thin and evenly as a whole. 12-2. Flux ‌ with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not done properly. Therefore, use flux with a halogen content of 0.1% max. 12-3. Strong acidic flux can degrade the MLCC performance 12-4. Check the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the mounting process. 40 41 13. Coating 4. Land dimension 13-1. Crack caused by Coating The recommended land dimension is determined by evaluating the actual SET and a board. A crack may be caused in the MLCC due to amount of the resin and stress of thermal contraction of the resin during coating process. During the coating process, the amount of resin and the stress of thermal contraction of the resin may cause cracks in MLCC. The difference of thermal expansion coefficient between the coating, or a molding resin may cause destruction, deterioration of insulation resistance or dielectric breakdown of MLCC such as cracks or detachment, etc. BW c T W L 13-2. Recommended Coating material •A thermal expansion coefficient should be as close to that of MLCC as possible. •A silicone resin can be used as an under-coating to buffer the stress. •The resin should have a minimum curing contraction rate. •The resin should have a minimum sensitivity (ex. Epoxy resin). Chip Size [mm] a [mm] b [mm] c [mm] (a+2b) min (a+2b) max ± 0.05 0.35~0.40 0.37~0.47 0.50~0.55 1.09 1.34 ± 0.07 0.37~0.42 0.37~0.47 0.52~0.58 1.11 1.36 ± 0.10 0.40~0.45 0.37~0.47 0.55~0.60 1.14 1.39 ± 0.15 0.40~0.45 0.40~0.50 0.60~0.65 1.20 1.45 ± 0.20 0.45~0.50 0.40~0.50 0.65~0.70 1.25 1.50 ± 0.30 0.45~0.50 0.42~0.52 0.70~0.75 1.29 1.54 ± 0.40 0.50~0.55 0.45~0.55 0.75~0.80 1.40 1.65 ± 0.10 0.50~0.55 0.60~0.65 0.80~0.85 1.70 1.85 ± 0.15 0.55~0.60 0.62~0.67 0.85~0.90 1.79 1.94 ± 0.20 0.60~0.65 0.65~0.70 0.90~0.95 1.90 2.05 ± 0.25 0.65~0.70 0.70~0.75 0.95~1.00 2.05 2.20 ± 0.30 0.70~0.75 0.75~0.80 1.00~1.05 2.20 2.35 ±0.10 0.70~0.75 0.75~0.80 1.25~1.30 2.20 2.35 ±0.15 0.75~0.80 0.80~0.85 1.30~1.35 2.35 2.50 ±0.20 0.80~0.85 0.85~0.90 1.35~1.40 2.50 2.65 ±0.25 0.85~0.90 0.95~1.00 1.40~1.45 2.75 2.90 ±0.30 0.90~0.95 1.05~1.10 1.45~1.50 3.00 3.15 ±0.20 1.70~1.90 0.85~1.00 1.60~1.80 3.40 3.90 ±0.30 1.80~2.00 0.95~1.10 1.70~1.90 3.70 4.20 - 2.00~2.40 1.00~1.40 1.80~2.20 4.00 5.20 Chip Size [mm] Chip Tol. [mm] a [mm] b [mm] c [mm] (a+2b) min (a+2b) max 1608 - 0.60~1.00 0.60~0.80 0.60~0.80 1.80 2.60 2012 - 1.00~1.20 0.80~1.20 0.80~1.20 2.60 3.60 3216 - 2.00~2.40 1.00~1.20 1.00~1.40 4.00 4.80 1005 Design 1608 When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the drop in insulation resistance. Therefore, it is required to install safety equipment such as a fuse to prevent additional accidents when MLCC is short-circuited, otherwise, electric short and fire may occur. This product is not a safety guaranteed product.. 2. PCB Design 2-2. MLCC crack by PCB material type A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal expansion and contraction, resulting in cracks in MLCC. Even though MLCC is mounted on a board with a fluorine resin or on a single-layered glass epoxy, cracks in MLCC may occur. b Chip Tol. [mm] •‌Do not use strong acid substances due to the fact that coating materials inducing a family of halogen substances and organic acid may corrode MLCC. 2-1. Unlike ‌ lead type components, SMD type components that are designed to be mounted directly on the board are fragile to the stress. In addition, they are more sensitive to mechanical and thermal stress than lead type components. a Reflow Footprint •‌The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is used in a high humidity condition. 1. Circuit design Application Manual Application Manual 2012 3216 3225 3. Design system evaluation 3-1. Evaluate ‌ the actual design with MLCC to make sure there is no functional issue or violation of specifications of the finished goods. 3-2. ‌Please note that the capacitance may differ based on the operating condition of the actual system since Class 2 MLCC capacitance varies with applied voltage and temperature. 3-3. Surge ‌ resistance must be evaluated since the excessive surge caused by the inductance of the actual system may apply to MLCC. 3-4. Note the actual MLCC size and the termination shape. 42 Flow Footprint 43 Others 1. Storage environment 6. Transportation 1-1. Recommendation for temperature/humidity The performance of MLCC may be affected by transportation conditions. Even taping and packaging materials are designed to endure a long-term storage, they should be stored with a temperature of 0~40°C and an RH of 0~70% otherwise, too high temperatures or humidity may deteriorate the quality of the product rapidly. As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is, the better the solderability is. As the temperature difference may cause dew condensation during the storage of the product, it is a must to maintain a temperature control environment 1-2. Shelf Life An allowable storage period should be within 6 months from the outgoing date of delivery in consideration of solderability. As for products in storage over 6 months, please check solderability before use. 6-1. MLCC shall be protected from excessive temperature, humidity and a mechanical force during transportation. During transportation, the cartons shall not be deformed and the inner packaging shall be protected from excessive external forces. Application Manual Application Manual 6-2. Do not apply excessive vibrations, shocks or excessive forces to MLCC. •‌If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack. •‌When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a tweezer, etc, MLCC may crack or become short-circuited. 6-3. MLCC may crack and become non-functional due to the excessive shocks or dropping during transportation. 2. Caution for corrosive environment As corrosive gases may deteriorate the solderability of MLCC outer termination, it is a must to store MLCC in an environment without gases. MLCC that is exposed to corrosive gases may cause its quality issues due to the corrosion of plating layers and the penetration of moisture. 3. Equipment in operation 7. Notice Some special products are excluded from this document. Please be advised that this is a standard product specification for a reference only. We may change, modify or discontinue the product specifications without notice at any time. So, you need to approve the product specifications before placing an order. Should you have any question regarding the product specifications, please contact our sales personnel or application engineers. 3-1. Do not touch MLCC directly with bare hands to prevent an electric shock or damage. 3-2. The ‌ termination of MLCC shall not be contacted with a conductive object (short –circuit). Do not expose MLCC to conductive liquid containing acidic or alkaline material. 3-3. Do not use the equipment in the following conditions. (1) Exposure to water or oil (2) Exposure to direct sunlight (3) Exposure to Ozone or ultra-violet radiation. (4) Exposure to corrosive gas (e.g. hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas) (5) Exposure to vibration or mechanical shock exceeding specified limit (6) Exposure to high humidity 3-4. If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug from the power source. If the equipment is not switched off or unplugged, serious damage may occur due to the continuous power supply. Please be careful with the high temperature in this condition. 4. Waste treatment In case of scrapping MLCC, it is incinerated or buried by a licensed industrial waste company. When scrapping MLCC, it is recommended to incinerate or bury the scrappage by a licensed industrial waste company. 5. Operating temperature The operating temperature limit is determined by the specification of each models. 5-1. Do not use MLCC over the maximum operating temperature. Pay attention to equipment’s temperature distribution and the seasonal fluctuation of ambient temperature. 5-2. The surface temperature of MLCC cannot exceed the maximum operating temperature including self-heating effects. 44 45 Certifications Homepage http://www.Samsungsem.com ISO 14001 OHSAS18001 SEMCO web-site Certifications ISO9001 & IATF 16949 SEMCO web - site supports all technical data & information for our partner. Certificate of Registration QUALITY MANAGEMENT SYSTEM - IATF 16949:2016 This is to certify that: Samsung Electro-Mechanics Co., Ltd. Tianjin 80 Xiaqing Road The Western Economic and Technological Development Zone Tianjin 300462 China Product catalog Certificate operates a Quality Management System which complies with the requirements of IATF 16949:2016 for the following scope: Certificate of Registration The design and manufacture of multi layer ceramic capacitors. QUALITY MANAGEMENT SYSTEM - IATF 16949:2016 This is to certify that: For and on behalf of BSI: Managing Director Korea, Jongho Lee operates a Quality Management System which complies with the requirements of IATF 16949:2016 for the following scope: BSI Certificate Number: 91430-012 IATF Number: 0328004 Page: 1 of 2 Certification Date: 2018-09-04 Samsung Electro-Mechanics Co., Ltd. Tianjin 80 Xiaqing Road The Western Economic and Technological Development Zone Tianjin 300462 China Latest Issue: 2019-04-04 The design and manufacture of multi layer ceramic capacitors. Expiry Date: 2021-09-03 This certificate was issued electronically and remains the property of BSI and is bound by the conditions of contract. An electronic certificate can be authenticated online. Printed copies can be validated at www.bsigroup.com/ClientDirectory or telephone +82 2 777 4123. IATF Contracted Office: BSI Assurance UK Limited, registered in England under number 7805321 at 389 Chiswick High Road, London W4 4AL, UK. For and on behalf of BSI: BSI Group Korea, 8F Taehwa Bldg. 29, Insadong 5-gil, Jongno-gu, Seoul, 03162, Korea A Member of the BSI Group of Companies. Managing Director Korea, Jongho Lee BSI Certificate Number: 91430-012 IATF Number: 0328004 Page: 1 of 2 Certification Date: 2018-09-04 Latest Issue: 2019-04-04 Expiry Date: 2021-09-03 This certificate was issued electronically and remains the property of BSI and is bound by the conditions of contract. An electronic certificate can be authenticated online. Printed copies can be validated at www.bsigroup.com/ClientDirectory or telephone +82 2 777 4123. IATF Contracted Office: BSI Assurance UK Limited, registered in England under number 7805321 at 389 Chiswick High Road, London W4 4AL, UK. Sony Green Partner BSI Group Korea, 8F Taehwa Bldg. 29, Insadong 5-gil, Jongno-gu, Seoul, 03162, Korea A Member of the BSI Group of Companies. QC 080000 IECQ HSPM 2018 / 8 / 3 グリーンパートナー環境品質認定通知書 Notification of Green Partner Certification Attn ： サムスン電機ジャパン（株） 御中 SAMSUNG ELECTRO-MECHANICS JAPAN Co,. Ltd. 拝啓 貴社益々ご清栄のこととお慶び申しあげます。 平素は、弊社環境品質保証活動に多大なるご協力を賜り、お礼申し上げます。 貴社のグリーンパートナー環境品質認定手続きが完了しましたのでご通知申し上げます。 今後とも弊社環境品質保証活動にご協力を賜りますようお願い致します。 Product Search Thank you for your kind support on Sony Green Partner Activities. We would like to inform you that Green Partner Certification has been authorized. Your continuous cooperation on Sony environmental quality assurance activities is highly appreciated. Environment 認定範囲 / Scope of Green Partner Certification ファクトリー マニュファクチャラー名称 工場名称 コード （英文） （英文） Factory Code 監査期限 MC Name FC Name Expiry Date FC003853 Dongguan Samsung Electro-Mechanics Co.,Ltd. (No Factory Name) 2020/05/31 FC005435 Samsung Electro-Mechanics (Thailand) Co.,Ltd. (No Factory Name) 2020/05/31 FC003780 Samsung Electro-Mechanics Co.,Ltd. (No Factory Name) 2020/05/31 FC005432 Samsung Electro-Mechanics Co.,Ltd. Busan plant 2020/05/31 FC009143 Samsung Electro-Mechanics Co.,Ltd. Sejong plant 2020/05/31 FC005431 Samsung Electro-Mechanics Co.,Ltd. Suwon Plant 2020/05/31 FC005434 Samsung Electro-Mechanics Philippines,Inc. (No Factory Name) 2020/05/31 FC005437 Tianjin Samsung Electro-Mechanics Co.,Ltd. (No Factory Name) 2020/05/31 Technical tool ソニーグローバルマニュファクチャリング＆オペレーションズ(株) Sony Global Manufacturing & Operations Corporation 調達物流 IPO 部門 / Procurement, Logistics and IPO Division グリーンパートナー事務局 / Green Partner Secretariat Quality System Certification status for each factory site 46 Certification Busan (Korea) Tianjin (China) IATF 16949 BSI IATF16949 91430-001 BSI IATF16949 91430-012 Date Validity 2019-04-04 ~ 2021-06-18 2019-04-04 ~ 2021-09-03 ISO 14001 KE191620 098_18_E1_012_R1_L Date Validity 2019-06-10 ~ 2022-06-24 2018-04-15 ~ 2021-04-14 OHSAS 18001 098_18_S1_002_R1_L Date Validity 2018-04-15 ~ 2021-03-12 QC 080000 IECQ-H_ULTW_10.0018 IECQ-H_ULTW_10.0021 Date Validity 2019-07-17 ~ 2022-07-19 2019-07-25 ~ 2022-07-26 ISO5001 18213-1 098_18_En1_021_R2_L Date Validity 2019-05-17 ~ 2021-08-3019 2018-12-26 ~ 2021-08-30 ISO 45001 KS19017 TBD('20.May) Date Validity 2019-06-10 ~ 2022-06-09 Web Library The software of "LCR Web Library" provides the characteristics of SEMCO’s products on the website. (http://weblib.samsungsem.com /) - S-parameter and Spice Model of MLCC, Inductor and Bead. - The acoustic noise data of MLCC - Capacitance of MLCC according to Temperature and DC bias 47 Disclaimer & Limitation of Use and Application The products listed in this Specification sheet are NOT designed and manufactured for any use and applications set forth below. Please note that any misuse of the products deviating from products specifications or information provided in this Spec sheet may cause serious property damages or personal injury. We will NOT be liable for any damages resulting from any misuse of the products, specifically including using the products for high reliability applications as listed below. If you have any questions regarding this 'Limitation of Use and Application', you should first contact our sales personnel or application engineers. ① Aerospace/Aviation equipment ② Medical equipment ③ Military equipment ④ Disaster prevention/crime prevention equipment ⑤ Power plant control equipment ⑥ Atomic energy-related equipment ⑦ Undersea equipment ⑧ Traffic signal equipment ⑨ Data-processing equipment ⑩ Electric heating apparatus, burning equipment ⑪ Safety equipment ⑫ Any other applications with the same as or similar complexity or reliability to the applications 48 49 MEMO 50 www.Samsungsem.com 51 www.semlcr.com Passive components sales offices Head office Maeyoung-ro 150 (Maetan-dong) Yeongtong-gu, Suwon-city, Gyeonggi Province, Korea 16674 Tel : +82-31-210-5114 America Sales Office Sanjose Office Samsung Electromechanics America Inc. 3655 North First Street SanJose, CA, 95134 TEL : +1 408 544 4000 E-mail : soo8212.lee@samsung.com Detroit Office Samsung Electromechanics America Inc. 4121 N Atlantic Blvd. Auburn Hills, MI, 48326 TEL : +1-713-395-5198 E-mail : eric.beaty@samsung.com Europe Sales Office Frankfurt office Samsung Electro-Mechanics GmbH, Kolnerstr. 12 65760 Eschborn Germany TEL : + 49-6196-66-7259 E-mail : benjamin.blume@samsung.com Munich Office Samsung Electro-Mechanics GmbH, Reichenbachstrasse 2 85737 Ismaning Germany Tel : +49-6196-66-7237 E-mail : dimitri.hahn@samsung.com Stuttgart Office Samsung Electro-Mechanics GmbH, Leitzstrasse 45 70469 Stuttgart Germany Tel : +49-711-490-66281 E-mail : laura.careno@samsung.com Asia Sales Office Shenzhen Office 14F, Tower A, SCC Building, Junction of Houhai Blvd. and Haide 1st Rd. Nanshan District, Shenzhen, China, 518064 TEL : +86-755-8608-5984 E-mail : danny.huang@samsung.com Shanghai Office 13F, Building B, No 1065 Zhongshan Rd.(W) Changning District, Shanghai, China, 200051 TEL : +86-21-2051-5813 E-mail : cecilia.wang@samsung.com Chongqing Office Chongqing IFS Tower 1, Qingyun Road No. 1 Jiangbei District, Chongqing, China, 400023 TEL : +86-23-6711-9168(#6347) E-mail : elvis.xu@samsung.com Beijing Office 14F Room C1C2, China Merchants Tower, No.118 Jianguo Rd. Chaoyang District, Beijing, China, 100022 TEL : +86-10-6566-8100(#6622) E-mail : iris.wang@samsung.com Taipei Office 9F-1, No.399 Rueykuang Rd. Neihu District, Taipei, Taiwan, 11492 TEL : +886-2-2656-8375 E-mail : peter.tung@samsung.com Tokyo Office Shinagawa Grand Tower 9F, Kounan 2-16-4 Minato-ku,Tokyo, Japan, 108-0075 TEL : +81-3-6369-6452 E-mail : hikota.suga@samsung.com Singapore Office 3 CHURCH STREET #23-01 SAMSUNG HUB Singapore 049483 TEL : +65-6933-2636 E-mail : jessica.benegildo@samsung.com Passive components manufacturing sites Busan Plant (Korea) Noksan Saneopjungro 333 (Songjeong-dong), Gangseo-gu, Busan 46754 Tel : +82-51-970-7114, 8114 Tianjin Plant (China) 80, Xiaqing road, TEDA west district, Tianjin, China TEL : +86-22-2830-3333(3500) All information indicated in this catalog is as of November 2019 * The specifications and designs contained herein may be subject to change without notice. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Samsung Electro-Mechanics: CL10B102KB85PNC CL10B222KB85PNC CL10B103KC85PNC CL21B104KBC5PNL CL21C221JB61PNL CL31B105KBH5PNE CL21B223KC65PNC CL21B473KBC5PNL CL32Y106KLJ4PNE CL10B102KB85PNL CL21B473KCCWPND CL21C221GB61PNC CL21B224KBF4PNE CL31B104KCPWPNE CL05B104KA54PNC CL21B104KCC5PND CL21B152KB6WPNC CL21B105KOF4PNF CL31B225KBH4PNF CL10B104KB85PNL CL21B103KB6WPND CL10B152KB85PNC CL21B105KAF4PNF CL21B473KBC5PNC CL21B472KC65PNC CL10B473KB85PNL CL31B104KBC5PNC CL32B475KBJ4PNF CL31B104KBPWPNE CL21B683KBC5PNC CL10B471KC85PNC CL10B471KC85PNL CL10Y225KQ84PNC CL21B152KB65PNC CL21B223KB65PNC CL21B104KBCWPNL CL21B104KBF5PNE CL21C101JB61PND CL32Y476MPVVPJE CL21B102KB65PND CL21B334KBF4PNF CL21B103KB6WPNC CL21C102JCC1PNC CL05B104KO54PND CL21B105KOF4PNE CL31B225KBH4PNE CL05B104KO54PNC CL10B221KC85PNC CL21B334KBF4PNE CL10B103KB85PND CL10B332KB85PNC CL10B104KO85PNC CL21B472KB65PND CL21B224KBF4PNG CL21B473KBCWPNC CL21B683KBCWPNC CL32B475KBJ4PNE CL10B683KB85PNC CL21B105KOF4PNG CL21C102JBC1PNC CL21C820JC61PNC CL21B104KBCWPNC CL10B105KO84PNC CL10B103KB85PNC CL10B223KB85PNC CL21B223KC6WPNC CL21B102KB6WPNC CL21C101JC61PNC CL10B472KB85PNC CL31B224KBPWPNE CL31B105KAP5PNE CL21C100JB61PNC CL21C221JB61PNC CL21C680JC61PNC CL21B683KBC5PNL CL21B102KB65PNC CL10B104KB85PNC CL21B474KBF4PNG CL10B104KB85PND CL21C222JBC1PNC CL21C681JCC1PNC CL10B473KB85PNC CL31B334KBH5PNF CL21B105KAF4PNG CL21B103KC6WPNC CL21B222KB6WPNC CL21B473KCCWPNC CL21C220JB61PNC CL21B104KCC5PNC CL31B225KAH4PNE CL21B105KAF4PNE CL21C121JB61PNC CL21B104KBC5PNC CL10B153KB85PNC CL21C331JB61PNC CL21C820JB61PNC CL21B103KB65PNC CL21C120JB61PNC CL21C101JB61PNC CL21B223KB6WPNC