M378B1G73AH0

May. 2010 DDR3 SDRAM Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved. -1- Product Guide 1. DDR3 SDRAM MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 May. 2010 DDR3 SDRAM Memory 9 10 11 K4 BXXXXXXX-XXXX SAMSUNG Memory DRAM DRAM Type Density Bit Organization Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) # of Internal Banks 1. SAMSUNG Memory : K 7. Interface ( VDD, VDDQ) 6 : SSTL (1.5V, 1.5V) 2. DRAM : 4 8. Revision 3. DRAM Type B : DDR3 SDRAM M A B C D E F G H : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen : 8th Gen : 9th Gen 4. Density 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 9. Package Type 5. Bit Organization 04 : x 4 08 : x 8 16 : x16 Z H J M : : : : FBGA (Lead-free) FBGA (Halogen-free & Lead-free) FBGA (Lead-free, DDP) FBGA (Halogen-free & Lead-free, DDP) 10. Temp & Power C : Commercial Temp.( 0°C ~ 85°C) & Normal Power L : Commercial Temp.( 0°C ~ 85°C) & Low Power Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V) 6. # of Internal Banks 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks 11. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 (400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) -2- Product Guide 2. DDR3 SDRAM Component Product Guide Density Banks Part Number K4B1G0446E K4B1G0846E 1Gb E-die 8Banks K4B1G1646E K4B1G0446E K4B1G0846E K4B1G0446F 1Gb F-die 8Banks K4B1G0846F K4B1G0446F K4B1G0846F K4B2G0446B K4B2G0846B 2Gb B-die 8Banks K4B2G1646B K4B2G0446B K4B2G0846B K4B2G0446C 2Gb C-die 8Banks K4B2G0846C K4B2G0446C K4B2G0846C DDP 2Gb E-die 8Banks K4B2G0446E K4B2G0846E K4B4G0446A 4Gb A-die May. 2010 DDR3 SDRAM Memory Package & Power, Temp. (-C/-L) & Speed HC(L)F7/F8/H9/K0 HC(L)F7/F8/H9/K0 HC(L)F7/F8/H9/K0 HYF7/F8/H9 HYF7/F8/H9 HC(L)F8/H9/K0 HC(L)F8/H9/K0 HY(L)F8/H9 HY(L)F8/H9 HC(L)F7/F8/H9 HC(L)F7/F8/H9 HC(L)F7/F8/H9 HYF7/F8/H9 HYF7/F8/H9 HC(L)F8/H9/K0 HC(L)F8/H9/K0 HY(L)F8/H9 HY(L)F8/H9 MC(L)F7/F8/H9 MC(L)F7/F8/H9 HC(L)F8/H9/K0 HC(L)F8/H9/K0 HY(L)F8/H9/K0 HY(L)F8/H9/K0 MC(L)F7/F8/H9 MC(L)F7/F8/H9 MC(L)F7/F8/H9 MC(L)F7/F8/H9 Org. 256M x 4 128M x 8 64M x 16 256M x 4 128M x 8 256M x 4 128M x 8 256M x 4 128M x 8 512M x 4 256M x 8 128M x 16 512M x 4 256M x 8 512M x 4 256M x 8 512M x 4 256M x 8 512M x 4 256M x 8 1G x 4 512M x 8 1G x 4 512M x 8 1G x 4 512M x 8 1G x 4 512M x 8 1.35V 1.5V 1.35V 1.5V VDD Voltage PKG 78 ball FBGA 96 ball FBGA 78 ball FBGA Now Avail. NOTE 1.5V 78 ball FBGA 1.35V 78 ball FBGA 96 ball FBGA 78 ball FBGA Now Now 1.5V 78 ball FBGA 1.35V 78 ball FBGA Now 1.5V Now 8Banks K4B2G0846A K4B4G0446A K4B2G0846A 1.5V 78 ball FBGA Now 1.35V 78 ball FBGA 78 ball FBGA DDP 4Gb B-die 8Banks K4B4G0446B K4B2G0846B K4B4G0446C K4B2G0846C 1.5V Now DDP 4Gb C-die 8Banks 1.5V Feb.’10 * NOTE : 1.35V product is 1.5V operatable. -3- Product Guide 3. DDR3 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 May. 2010 DDR3 SDRAM Memory 11 12 MXXXBXXXXXXX-XXX Memory Module DIMM Type Data bits DRAM Component Type Depth # of Banks in Comp. & Interface Bit Organization 1. Memory Module : M 8. Component Revision M : 1st Gen. B : 3rd Gen. D : 5th Gen. F : 7th Gen. Speed Temp & Power PCB Revision Package Component Revision 2. DIMM Type 3 : DIMM 4 : SODIMM 3. Data Bits 71 : 78 : 91 : 92 : 93 : x64 x64 x72 x72 x72 204pin Unbuffered SODIMM 240pin Unbuffered DIMM 240pin ECC unbuffered DIMM 240pin VLP Registered DIMM 240pin Registered DIMM A C E G : : : : 2nd Gen. 4th Gen. 6th Gen. 8th Gen. 9. Package : FBGA(Lead-free) Z : FBGA(Lead-free & Halogen-free) H : FBGA(Lead-free, DDP) J M : FBGA(Lead-free & Halogen-free, DDP) 10. PCB Revision 0 : None 2 : 2nd Rev. 4 : 4th Rev. 1 : 1st Rev. 3 : 3rd Rev. S : Reduced Layer 4. DRAM Component Type B : DDR3 SDRAM (1.5V VDD) 5. Depth 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G : 1G 2G : 2G 33 65 29 57 52 1K 2K : 32M (for 128Mb/512Mb) : 64M (for 128Mb/512Mb) : 128M (for 128Mb/512Mb) : 256M (for 512Mb/2Gb) : 512M (for 512Mb/2Gb) : 1G (for 2Gb) : 2G (for 2Gb) 11. Temp & Power C : Commercial Temp.( 0°C ~ 85°C) & Normal Power Y : Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V) 6. # of Banks in comp. & Interface 7: 8Banks & SSTL-1.5V 12. Speed F7 : DDR3-800 F8 : DDR3-1066 H9 : DDR3-1333 K0 : DDR3-1600 (400MHz @ CL=6, tRCD=6, tRP=6) (533MHz @ CL=7, tRCD=7, tRP=7) (667MHz @ CL=9, tRCD=9, tRP=9) (800MHz @ CL=11, tRCD=11, tRP=11) NOTE: PC3-6400(DDR3-800),PC3-8500(DDR3-1066), PC3-10600(DDR3-1333), PC3-12800(DDR3-1600) 7. Bit Organization 0 : x4 3 : x8 4 : x16 -4- Product Guide 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product) 240Pin DDR3 Unbuffered DIMM Org. 128Mx 64 Density 1GB Part Number M378B2873EH1 M378B2873FH0 M391B2873EH1 M391B2873FH0 M378B5673EH1 256Mx 64 2GB M378B5673FH0 M378B5773CH0 M391B5673EH1 256Mx 72 2GB M391B5673FH0 M391B5773CH0 512Mx 64 4GB M378B5273BH1 M378B5273CH0 M391B5273BH1 M391B5273CH0 M378B1G73AH0 M391B1G73AH0 Speed CF8/H9 CF8/H9/K0* CF8/H9 CF8/H9/K0* CF8/H9 CF8/H9/K0* CF8/H9/K0* CF8/H9 CF8/H9/K0* CF8/H9/K0* CF8/H9 CF8/H9/K0* CF8/H9 CF8/H9/K0* CF8/H9/K0* CF8/H9/K0* Raw Card A(1Rx8) Composition 128M x 8 * 8 pcs 128M x 8 * 8 pcs 128M x 8 * 9 pcs 128M x 8 * 9 pcs 128M x 8 * 16 pcs 128M x 8 * 16 pcs 256M x 8 * 8 pcs 128M x 8 * 18 pcs 128M x 8 * 18 pcs 256M x 8 * 9 pcs 256M x 8 * 16 pcs 256M x 8 * 16 pcs 256M x 8 * 18 pcs 256M x 8 * 18 pcs 512M x 8 * 16 pcs 512M x 8 * 18 pcs Comp. Version 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 1Gb 1Gb 2Gb 2Gb 2Gb 2Gb 2Gb 4Gb 4Gb E-die F-die E-die F-die E-die F-die C-die E-die F-die C-die B-die C-die B-die C-die A-die A-die May. 2010 DDR3 SDRAM Memory Internal Banks 8 Rank 1 PKG 78 ball FBGA 78 ball FBGA 78 ball FBGA Height 30mm Avail. Now NOTE 128Mx 72 1GB D(1Rx8) 8 1 30mm Now B(2Rx8) A(1Rx8) E(2Rx8) D(1Rx8) B(2Rx8) 8 8 2 1 2 1 30mm Now 8 78 ball FBGA 78 ball FBGA 78 ball FBGA 78 ball FBGA 78 ball FBGA 30mm Now 8 2 30mm Now 512Mx 72 1Gx 64 1Gx 72 4GB 8GB 8GB E(2Rx8) B(2Rx8) E(2Rx8) 8 8 8 2 2 2 30mm 30mm 30mm Now Now Now * NOTE : K0(1600Mbps) will be available by ES level 4.2 240Pin DDR3 Unbuffered DIMM (1.35V Product) 240Pin DDR3 Unbuffered DIMM Org. 128Mx 72 Density 1GB Part Number M391B2873EH1 M391B2873FH0 M391B5673EH1 256Mx 72 2GB M391B5673FH0 M391B5773CH0 512Mx 72 1Gx 72 4GB 8GB M391B5273BH1 M391B5273CH0 M391B1G73AH0 Speed YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 Raw Card D(1Rx8) Composition 128M x 8 * 9 pcs 128M x 8 * 9 pcs 128M x 8 * 18 pcs 128M x 8 * 18 pcs 256M x 8 * 9 pcs 256M x 8 * 18 pcs 256M x 8 * 18 pcs 512M x 8 * 18 pcs Comp. Version 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 2Gb 4Gb E-die F-die E-die F-die C-die B-die C-die A-die Internal Banks 8 Rank 1 PKG 78 ball FBGA 78 ball FBGA 78 ball FBGA 78 ball FBGA Height 30mm Avail. Now NOTE E(2Rx8) D(1Rx8) E(2Rx8) E(2Rx8) 8 8 8 8 2 1 2 2 30mm Now 30mm 30mm Now Now * NOTE : 1.35V product is 1.5V operatable. -5- Product Guide 4.3 204Pin DDR3 SoDIMM (1.5V Product) 204Pin DDR3 SODIMM Org. Density Part Number M471B2873EH1 128Mx 64 1GB M471B2874EH1 M471B2873FHS M471B5673EH1 256Mx 64 2GB M471B5673FH0 M471B5773CHS 512Mx 64 1Gx 64 4GB 8GB M471B5273BH1 M471B5273CH0 M471B1G73AH0 Speed CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 Raw Card B(1Rx8) A(2Rx16) B(1Rx8) F(2Rx8) B(1Rx8) F(2Rx8) F(2Rx8) Composition 128M x 8 * 8 pcs 64M x 16 * 8 pcs 64M x 16 * 8 pcs 128M x 8 * 16 pcs 128M x 8 * 16 pcs 256M x 8 * 8 pcs 256M x 8 * 16 pcs 256M x 8 * 16 pcs 512M x 8 * 16 pcs Comp. Version 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 2Gb 4Gb E-die E-die F-die E-die F-die C-die B-die C-die A-die May. 2010 DDR3 SDRAM Memory Internal Banks 8 8 8 8 8 8 8 Rank 1 2 1 2 1 2 2 PKG 78 ball FBGA 96 ball 78 ball FBGA 78 ball FBGA 78 ball FBGA 78 ball FBGA Height Avail. NOTE 30mm Now 30mm Now 30mm 30mm Now Now 4.4 204Pin DDR3 SoDIMM (1.35V Product) 204Pin DDR3 SODIMM Org. 128Mx 64 256Mx 64 Density 1GB 2GB Part Number M471B2873FHS M471B5673FH0 M471B5773CHS M471B5273BH1 M471B5273CH0 M471B1G73AH0 Speed YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 Raw Card B(1Rx8) F(2Rx8) B(1Rx8) F(2Rx8) F(2Rx8) Composition 128M x 8 * 8 pcs 128M x 8 * 16 pcs 256M x 8 * 8 pcs 256M x 8 * 16 pcs 256M x 8 * 16 pcs 512M x 8 * 16 pcs Comp. Version 1Gb 1Gb 2Gb 2Gb 2Gb 4Gb F-die F-die C-die B-die C-die A-die Internal Banks 8 8 8 8 8 Rank 1 2 1 2 2 PKG 78 ball FBGA 78 ball FBGA 78 ball FBGA 78 ball FBGA Height 30mm 30mm Avail. Now Now NOTE 512Mx 64 1Gx 64 4GB 8GB 30mm 30mm Now Now * NOTE : 1.35V product is 1.5V operatable. -6- Product Guide 4.5 240Pin DDR3 Registered DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Org. 128Mx 72 Density 1GB Part Number M393B2873EH1 M393B2873FH0 M393B5673EH1 M393B5673FH0 256Mx 72 2GB M393B5670EH1 M393B5670FH0 M393B5773CH0 M393B5173EH1 M393B5173FH0 M393B5170EH1 512Mx 72 4GB M393B5170FH0 M393B5273BH1 M393B5273CH0 M393B5270BH1 M393B5270CH0 M393B1G70EM1 M393B1K73BH1 1Gx 72 8GB M393B1K73CH0 M393B1K70BH1 M393B1K70CH0 M393B2K70BM1 2Gx 72 16GB M393B2K70CM0 M393B2G70AH0 M393B2G73AH0 4Gx 72 32GB M393B4G70AH0 Speed CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8 CF8 CF8/H9 CF8/H9 CF8/H9 CF8 F(4Rx4) CF8/H9 CF8/H9 CF8/H9 CF8/H9 E(2Rx4) H(4Rx8) AB(4Rx4) F(4Rx4) H(4Rx8) C(1Rx4) B(2Rx8) Raw Card A(1Rx8) Composition 128M x 8 * 9 pcs 128M x 8 * 9 pcs 128M x 8 * 18 pcs 128M x 8 * 18 pcs 256M x 4 * 18 pcs 256M x 4 * 18 pcs 256M x 8 * 9 pcs 128M x 8 * 36 pcs 128M x 8 * 36 pcs 256M x 4 * 36 pcs 256M x 4 * 36 pcs 256M x 8 * 18 pcs 256M x 8 * 18 pcs 512M x 4 * 18 pcs 512M x 4 * 18 pcs DDP x 4 * 36 pcs 512M 256M x 8 * 36 pcs 256M x 8 * 36 pcs 512M x 4 * 36 pcs 512M x 4 * 36 pcs DDP x 4 * 36 pcs 1G DDP x 4 * 36 pcs 1G 1G x 4 * 36 pcs 512M x 8 * 36 pcs DDP x 4 * 36 pcs 2G Comp. Version 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 2Gb 2Gb 1Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 4Gb 4Gb 4Gb E-die F-die E-die F-die E-die F-die C-die E-die F-die E-die F-die B-die C-die B-die C-die E-die B-die C-die B-die C-die B-die May. 2010 DDR3 SDRAM Memory Internal Banks 8 Rank 1 PKG 78 ball FBGA Height 30mm Avail. Now NOTE B(2Rx8) 2 8 1 78 ball FBGA 30mm Now C(1Rx4) A(1Rx8) H(4Rx8 E(2Rx4) 4 2 8 2 78 ball FBGA 30mm Now 1 4 4 78 ball FBGA 8 30mm Now E(2Rx4) 2 4 C-die A-die A-die A-die 8 8 2 4 4 78 ball FBGA 30mm Now 78 ball FBGA 30mm Now -7- Product Guide 4.6 240Pin DDR3 Registered DIMM (1.35V Product) 240Pin DDR3 Registered DIMM Org. 128Mx 72 Density 1GB Part Number M393B2873EH1 M393B2873FH0 M393B5673EH1 M393B5673FH0 256Mx 72 2GB M393B5670EH1 M393B5670FH0 M393B5773CH0 M393B5173EH1 M393B5173FH0 M393B5170EH1 512Mx 72 4GB M393B5170FH0 M393B5273BH1 M393B5273CH0 M393B5270BH1 M393B5270CH0 M393B1G70EM1 M393B1K73BH1 1Gx 72 8GB M393B1K73CH0 M393B1K70BH1 M393B1K70CH0 M393B2K70BM1 2Gx 72 16GB M393B2K70CM0 M393B2G70AH0 M393B2G73AH0 4Gx 72 32GB M393B4G70AH0 Speed YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8 YF8 YF8/H9 YF8/H9 YF8/H9 YF8 F(4Rx4) YF8/H9 YF8/H9 YF8/H9 YF8/H9 E(2Rx4) H(4Rx8) AB(4Rx4) Raw Card A(1Rx8) Composition 128M x 8 * 128M x 8 * 9 pcs 9 pcs Comp. Version 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 2Gb 2Gb 1Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 4Gb 4Gb 4Gb E-die F-die E-die F-die E-die F-die C-die E-die F-die E-die F-die B-die C-die B-die C-die E-die B-die C-die B-die C-die B-die C-die A-die A-die A-die May. 2010 DDR3 SDRAM Memory Internal Banks 8 Rank 1 PKG 78 ball FBGA Height 30mm Avail. Now NOTE B(2Rx8) 128M x 8 * 18 pcs 128M x 8 * 18 pcs 256M x 4 * 18 pcs 256M x 4 * 18 pcs 256M x 8 * 9 pcs 8 2 78 ball FBGA 30mm Now C(1Rx4) A(1Rx8) H(4Rx8) 8 1 128M x 8 * 36 pcs 128M x 8 * 36 pcs 256M x 4 * 36 pcs 256M x 4 * 36 pcs 256M x 8 * 18 pcs 256M x 8 * 18 pcs 512M x 4 * 18 pcs 512M x 4 * 18 pcs DDP x 4 * 36 pcs 512M 256M x 8 * 36 pcs 256M x 8 * 36 pcs 512M x 4 * 36 pcs 512M x 4 * 36 pcs DDP x 4 * 36 pcs 1G DDP x 4 * 36 pcs 1G 1G x 4 * 36 pcs 512M x 8 * 36 pcs DDP x 4 * 36 pcs 2G 8 4 E(2Rx4) 8 2 78 ball FBGA 30mm Now B(2Rx8) 8 2 C(1Rx4) F(4Rx4) H(4Rx8) 8 8 8 1 4 4 78 ball FBGA 30mm Now E(2Rx4) 8 2 8 4 78 ball FBGA 30mm Now 8 4 78 ball FBGA 30mm Now * NOTE : 1.35V product is 1.5V operatable. -8- Product Guide 4.7 240Pin DDR3 VLP Registered DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org. 128Mx 72 Density 1GB Part Number M392B2873EH1 M392B2873FH0 M392B5673EH1 M392B5673FH0 256Mx 72 2GB M392B5670EH1 M392B5670FH0 M392B5773CH0 M392B5170EM1 M392B5170FM0 512Mx 72 4GB M392B5273BH1 M392B5273CH0 M392B5270BH1 M392B5270CH0 M392B1K73BM1 M392B1K73CM0 1Gx 72 8GB M392B1K70BM1 M392B1K70CM0 M392B2G70AM0 2Gx 72 16GB M392B2G73AM0 CF8/H9 V(4Rx8) CF8/H9 N(2Rx4) CF8/H9 CF8/H9 N(2Rx4) Speed CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 N(2Rx4) CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8/H9 CF8 V(4Rx8) CF8/H9 L(2Rx8) Raw Card K(1Rx8) Composition 128M x 8 * 128M x 8 * 9 pcs 9 pcs Comp. Version 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 4Gb 4Gb E-die F-die E-die F-die E-die F-die F-die E-die May. 2010 DDR3 SDRAM Memory Internal Banks 8 Rank 1 PKG 78 ball FBGA Height 18.75mm Avail. Now NOTE L(2Rx8 128M x 8 * 18 pcs 128M x 8 * 18 pcs 256M x 4 * 18 pcs 256M x 4 * 18 pcs 128M x 8 * 9 pcs 2 8 78 ball FBGA 18.75mm Now M(1Rx4) K(1Rx8) 1 1 DDP x 4 * 18 pcs 512M DDP x 4 * 18 pcs 512M 256M x 8 * 18 pcs 256M x 8 * 18 pcs 512M x 4 * 18 pcs 512M x 4 * 18 pcs DDP x 8 * 18 pcs 512M DDP x 8 * 18 pcs 512M DDP x 4 * 18 pcs 1G DDP x 4 * 18 pcs 1G DDP x4 * 18 pcs 2G DDP x8 * 18 pcs 1G 2 F-die B-die C-die B-die C-die B-die 4 C-die 8 B-die 2 C-die A-die 8 A-die 4 2 Jun.’10 18.75mm Jun.’10 78 ball FBGA 18.75mm Now 8 2 78 ball FBGA 18.75mm Now M(1Rx4) 1 78 ball FBGA -9- Product Guide 4.8 240Pin DDR3 VLP Registered DIMM (1.35V Product) 240Pin DDR3 VLP Registered DIMM Org. 128Mx 72 Density 1GB Part Number M392B2873EH1 M392B2873FH0 M392B5673EH1 M392B5673FH0 256Mx 72 2GB M392B5670EH1 M392B5670FH0 M392B5773CH0 M392B5170EM1 M392B5170FM0 512Mx 72 4GB M392B5273BH1 M392B5273CH0 M392B5270BH1 M392B5270CH0 M392B1K73BM1 M392B1K73CM0 1Gx 72 8GB M392B1K70BM1 M392B1K70CM0 M392B2G70AM0 2Gx 72 16GB M392B2G73AM0 * NOTE : 1.35V product is 1.5V operatable. YF8/H9 V(4Rx8) YF8/H9 N(2Rx4) YF8/H9 YF8/H9 N(2Rx4) Speed YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8/H9 YF8 V(4Rx8) YF8 Raw Card K(1Rx8) Composition 128M x 8 * 9 pcs 128M x 8 * 9 pcs 128M x 8 * 18 pcs 128M x 8 * 18 pcs 256M x 4 * 18 pcs 256M x 4 * 18 pcs 512M x 4 * 9 pcs DDP x 4 * 18 pcs 512M 512M x 4 * 18 pcs 256M x 8 * 18 pcs 256M x 8 * 18 pcs 512M x 4 * 18 pcs 512M x 4 * 18 pcs DDP x 8 * 18 pcs 512M DDP x 8 * 18 pcs 512M DDP x 4 * 18 pcs 1G DDP x 4 * 18 pcs 1G DDP x4 * 18 pcs 2G DDP x8 * 18 pcs 1G Comp. Version 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 1Gb 1Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 2Gb 4Gb 4Gb E-die F-die E-die F-die E-die F-die C-die E-die F-die B-die C-die B-die C-die B-die May. 2010 DDR3 SDRAM Memory Internal Banks 8 Rank 1 PKG 78 ball FBGA Height 18.75mm Avail. Now NOTE L(2Rx8) 8 2 78 ball FBGA 18.75mm Now M(1Rx4) K(1Rx8) N(2Rx4) N(2Rx4) L(2Rx8) 8 1 8 2 8 2 78 ball 18.75mm FBGA Now M(1Rx4) 8 1 8 C-die B-die 8 C-die A-die 8 A-die 4 78 ball FBGA 2 18.75mm Now 2 4 78 ball FBGA Now 18.75mm Jun.’10 - 10 - Product Guide 5. RDIMM RCD Information 5.1 5.1 RCD Identification in JEDEC Description in Module Label 5.2 5.2 Label Example May. 2010 DDR3 SDRAM Memory Made in Korea M393B5170EH1-CH9 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P1 0920 5.3 RCD Information - Example Voltage 1.5V IDT Inphi 1.35V IDT LV DDR3 B0 M393B5170EH1-YF8 4GB 2Rx4 PC3L-8500R-07-10-E1-D2 LV DDR3 B0 LV GS02 C0 M393B5170EH1-CH9 M393B5170EH1-YF8 4GB 2Rx4 PC3-10600R-09-10-E1-D2 4GB 2Rx4 PC3L-8500R-07-10-E1-P1 Vendor Inphi Revision LV GS02 C0 Module P/N M393B5170EH1-CH9 JEDEC Description On Label 4GB 2Rx4 PC3-10600R-09-10-E1-P1 - 11 - Product Guide 6. Package Dimension May. 2010 DDR3 SDRAM Memory 78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4/x8) / 2Gb C-die (x4/x8) 0.10MAX #A1 B 7.50 ± 0.10 11.00 ± 0.10 1.10 ± 0.10 7.50 ± 0.10 0.80 x 8 = 6.40 (Datum A) 0.80 1.60 3.20 A #A1 INDEX MARK 987654321 A B C D E F G H J K L M N (0.95) MOLDING AREA (1.90) 4.80 (Datum B) 0.80 x 12 = 9.60 0.80 11.00 ± 0.10 78 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) 0.2 M A B Bottom Top 96Ball FBGA for 1Gb E-die (x16) A #A1 INDEX MARK B #A1 0.10MAX 7.50 ± 0.10 13.30 ± 0.10 1.10 ± 0.10 7.50 ± 0.10 0.80 x 8 = 6.40 0.80 1.60 3.20 987654321 A B C D E F G H J K L M N P R T (0.95) MOLDING AREA (1.90) (Datum A) 0.80 x 15 = 12.00 0.80 13.30 ± 0.10 96 - ∅0.45 Solder ball (Post Reflow ∅0.05 ± 0.05) 0.2 M A B Bottom Top - 12 - 0.50 ± 0.05 0.35 ± 0.05 (Datum B) 0.40 6.00 0.50 ± 0.05 0.35 ± 0.05 0.80 Product Guide 78Ball FBGA for 2Gb B-die (x4/x8) A 3.20 #A1 INDEX MARK #A1 B 9.00 ± 0.10 May. 2010 DDR3 SDRAM Memory (Datum A) 0.80 1.60 9.00 ± 0.10 987654321 A B C D E F G H J K L M N (0.95) MOLDING AREA (1.90) 4.80 (Datum B) 0.80 x 12 = 9.60 0.80 11.50 ± 0.10 0.80 11.50 ± 0.10 0.10MAX 0.35 ± 0.05 1.10 ± 0.10 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B Bottom Top 96Ball FBGA for 2Gb B-die (x16) A #A1 INDEX MARK 0.80 1.60 3.20 B #A1 9.00 ± 0.10 987654321 (Datum A) A B C D E F G H J K L M N P R T (0.95) MOLDING AREA (1.90) (Datum B) 6.00 0.80 x 12 = 12.00 0.40 0.80 13.30 ± 0.10 13.30 ± 0.10 0.10MAX 0.35 ± 0.05 1.10 ± 0.10 9.00 ± 0.10 96 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B Bottom Top - 13 - Product Guide 78Ball DDP for 1Gb E-die (x4/x8) May. 2010 DDR3 SDRAM Memory 0.80 x 8 = 6.40 (Datum A) 0.80 1.60 3.20 A #A1 INDEX MARK #A1 B 9.00 ± 0.10 987654321 A B C D E F G H J K L M N 4.80 (Datum B) 0.80 x 12 = 9.60 0.80 11.50 ± 0.10 0.80 11.50 ± 0.10 0.10MAX 0.35 ± 0.05 1.40 ± 0.10 9.00 ± 0.10 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B Bottom Top 78Ball DDP for 2Gb B-die (x4/x8) 0.80 x 8 = 6.40 (Datum A) 0.80 1.60 3.20 A #A1 INDEX MARK #A1 B 10.00 ± 0.10 987654321 A B C D E F G H J K L M N 4.80 (Datum B) 0.80 x 12 = 9.60 0.80 11.50 ± 0.10 0.80 11.50 ± 0.10 0.10MAX 0.35 ± 0.05 1.40 ± 0.10 10.00 ± 0.10 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B Bottom Top - 14 - Product Guide 78Ball DDP for 2Gb C-die (x4/x8) May. 2010 DDR3 SDRAM Memory 0.80 x 8 = 6.40 (Datum A) 0.80 1.60 3.20 A #A1 INDEX MARK #A1 8.00 ± 0.10 B 987654321 A B C (Datum B) D E F G H J K L M N 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B 4.80 0.80 x 12 = 9.60 11.00 ± 0.10 0.80 0.80 11.00 ± 0.10 0.10MAX 0.35 ± 0.05 1.40 ± 0.10 8.00 ± 0.10 BOTTOM VIEW TOP VIEW 78Ball for 4Gb A-die (x4/x8) 10.00 ± 0.10 0.80 x 8 = 6.40 (Datum A) 3.20 0.80 1.60 B #A1 INDEX MARK #A1 10.00 ± 0.10 987654321 A B C D E F G H J K L M N 4.80 (Datum B) 0.80 x 12 = 9.60 0.80 12.50 ± 0.10 78 - ∅0.45 Solder ball (Post Reflow ∅0.50 ± 0.05) 0.2 M A B (1.90) (0.95) MOLDING AREA 0.80 12.50 ± 0.10 0.10MAX 0.35 ± 0.05 1.10 ± 0.10 A BOTTOM VIEW TOP VIEW - 15 - Product Guide 7. Module Dimension x64/x72 240pin DDR3 SDRAM Unbuffered DIMM May. 2010 DDR3 SDRAM Memory Units : Millimeters 133.35 ± 0.15 (4X)3.00 ± 0.1 128.95 9.50 (for x64) (for x72) N/A (2) 2.50 54.675 A 47.00 B 71.00 2.30 17.30 ECC SPD (for x64) (for x72) N/A ECC 1.270 ± 0.10 5.00 2.50 ± 0.20 0.80 ± 0.05 3.80 1.50±0.10 2.50 0.2 ± 0.15 1.00 Detail A Detail B - 16 - 30.00 ± 0.15 Max 4.0 2x 2.10 ± 0.15 Product Guide x64 204pin DDR3 SDRAM Unbuffered SODIMM May. 2010 DDR3 SDRAM Memory Units : Millimeters 67.60 0.10 M C A B 63.60 Max 3.8 20.00 6 30.00 ± 0.15 SPD 1.00 ± 0.10 24.80 A 21.00 B 39.00 2X 1.80 0.10 M C A B (OPTIONAL HOLES) 2X 4.00 ± 0.10 0.10 M C A B 0.60 1.65 0.45 ± 0.03 4.00 ± 0.10 2.55 0.25 MAX 1.00 ± 0.10 Detail A Detail B - 17 - Product Guide x72 240pin DDR3 SDRAM Registered DIMM May. 2010 DDR3 SDRAM Memory Units : Millimeters 133.35 ± 0.15 128.95 9.76 10.9 18.92 32.40 18.93 (2X)3.00 C 9.74 Max 4.0 17.30 2.30 2.50 54.675 47.00 A B 71.00 30.00 ± 0.15 1.0 max 1.27 ± 0.10 9.50 Register 5.00 2.50 ± 0.20 0.80 ± 0.05 3.80 0.2 ± 0.15 10.9 0. 50 0.4 2.50 1.50±0.10 1.00 Detail A Detail B R Detail C 2x 2.10 ± 0.15 Address, Command and Control lines Register - 18 - Product Guide Registered DIMM Heat Spreader Design 1. FRONT PART Outside 133.15 ± 0.2 130.45 ± 0.15 11.9 31.4 29.77 May. 2010 DDR3 SDRAM Memory 9.26 R0.2 23.6 ± 0.15 25.6 ± 0.15 1+0/ -0.3 1 25.6 ± 0.15 1 0. R 0.65 ± 0.2 4.65± 0.12 0.15 1.3 2.6 ± 0.2 2 2 - 19 7.45 2 ± 0.1 127 ± 0.12 1.3 Inside 0.4 Green Line : TIM Attatch Line Reg. pedestal line 80.78 119.29 128.5 2. BACK PART Outside Inside Green Line : TIM Attatch Line Product Guide 3. CLIP PART 39.3 ± 0.2 29.77 Upper Bending Tilting Gap 0.1 ~ 0.3 May. 2010 DDR3 SDRAM Memory A B 1. 5 C R 0.5 4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) : Mono Package : 7.55mm, DDP Package 7.71mm (With Clip thickness) 132.95 ± 133.45 1.27 1.05 39.3 ± 0.2 D 19 ± 0.1 K text mark ’B’ or ’K’ punch press_stamp E (Clip open size) - 20 - 19 Product Guide x72 240pin DDR3 SDRAM VLP Registered DIMM May. 2010 DDR3 SDRAM Memory Units : Millimeters 133.35 ± 0.15 128.95 C 9.76 18.75 ± 0.15 20.92 32.40 Register Max 4.0 9.74 20.93 54.675 A 12.60 47.00 B 71.00 1.0 max 1.27 ± 0.10 SPD/TS 18.10 5.00 2.50 ± 0.20 0.80 ± 0.05 9.9 0.6 R 0. 50 3.80 1.50±0.10 2.50 1.00 0.2 ± 0.15 Detail A Detail B Detail C Register VTT SPD/TS Address, Command and Control lines - 21 - VTT VTT VTT Product Guide VLP Registered DIMM Heat Spreader Design 1. FRONT PART Outside 130.45 67 8.69 20.82 17.9 6.4 20.82 8.69 May. 2010 DDR3 SDRAM Memory 0.4 Driver IC(DP:0.18mm) DRIVER IC 0.18 -0/+0.1 Inside Driver IC(DP:0.18mm) 2. BACK PART Outside Driver IC(DP:0.18mm) Inside Driver IC(DP:0.18mm) - 22 - 14.3 Product Guide 3. CLIP PART May. 2010 DDR3 SDRAM Memory 7.4 ± 0.1 9.16 ± 0.12 35.82 7.4 ± 0.1 9.16 ± 0.12 Clip open size 3.2~4.5 9.16 0.1 SIDE-L FRONT SIDE-R 4. ASS’Y VIEW Reference thickness total (Maximum) : 7.71 (With Clip thickness) TIM Thickness 0.25 * Dimension Index Mono Min. A B C D E (Clip open size) 6.7 6.7 2.5 Typ. 43.9 6.8 5.8 6.8 Max. 6.9 6.9 3.6 Min. 7.2 7.2 2.6 DDP Note Typ. 44.4 7.3 6.3 7.3 Max. 7.4 7.4 3.8 - 23 - 7.71