M378T5263AZH3

Apr. 2010 DDR2 SDRAM Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved. -1- Product Guide 1. DDR2 SDRAM MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 Apr. 2010 DDR2 SDRAM Memory 9 10 11 K4 TXXXXXXX-XXXX SAMSUNG Memory DRAM DRAM Type Density Bit Organization Speed Temp & Power Package Type Revision Interface (VDD, VDDQ) # of Internal Banks 1. SAMSUNG Memory : K 8. Revision M A B C D E F G H I Q R : 1st Gen. : 2nd Gen. : 3rd Gen. : 4th Gen. : 5th Gen. : 6th Gen. : 7th Gen. : 8th Gen. : 9th Gen. : 10th Gen. : 17th Gen. : 18th Gen. 2. DRAM : 4 3. DRAM Type T : DDR2 SDRAM 4. Density 56 : 256Mb 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 5. Bit Organization 04 06 07 08 16 26 27 :x4 : x 4 Stack : x 8 Stack :x8 : x16 : x 4 Stack (JEDEC Standard) : x 8 Stack (JEDEC Standard) 9. Package Type Z J H M T B : : : : : : FBGA (Lead-free) FBGA DDP (Lead-free) FBGA (Lead-free & Halogen-free) FBGA DDP (Lead-free & Halogen-free) FBGA DSP (Lead-free & Halogen-free, Thin) FBGA (Lead-free & Halogen-free, Flip Chip) 10. Temp & Power 6. # of Internal Banks 3 : 4 Banks 4 : 8 Banks C : Commercial Temp.( 0°C ~ 95°C) & Normal Power L : Commercial Temp.( 0°C ~ 95°C) & Low Power Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage 7. Interface ( VDD, VDDQ) Q : SSTL_18 (1.8V, 1.8V) 11. Speed CC : DDR2-400 D5 : DDR2-533 E6 : DDR2-667 F7 : DDR2-800 E7 : DDR2-800 (200MHz @ CL=3, tRCD=3, tRP=3) (266MHz @ CL=4, tRCD=4, tRP=4) (333MHz @ CL=5, tRCD=5, tRP=5) (400MHz @ CL=6, tRCD=6, tRP=6) (400MHz @ CL=5, tRCD=5, tRP=5) -2- Product Guide 2. DDR2 SDRAM Component Product Guide 2.1 SDRAM Density Banks Part Number K4T51043QI 512Mb I-die Apr. 2010 DDR2 SDRAM Memory Package & Power, Temp. (-C/-L) & Speed HCE7/F7/E6 HCE7/F7/E6 HCF8/E7/F7/E6 HC(L)E7/F7/E6 HC(L)E7/F7/E6 HC(L)E7/F7/E6 HC(L)E7/F7/E6 HC(L)E7/F7/E6 HC(L)E7/F7/E6 BCE7/F7/E6 BCE7/F7/E6 BCE7/F7/E6 HC(L)F7/E6 HC(L)F7/E6 Org. 128M x 4 64M x 8 32M x 16 256M x 4 128M x 8 64M x 16 256M x 4 128M x 8 64M x 16 256M x 4 128M x 8 64M x 16 512M x 4 256M x 8 PKG 60 ball FBGA 84 ball FBGA 60 ball FBGA 84 ball FBGA 60 ball FBGA 84 ball FBGA 60 ball FBGA 84 ball FBGA 68 ball FBGA Avail. 4Banks K4T51083QI K4T51163QI K4T1G044QQ Now 1Gb Q-die 8Banks K4T1G084QQ K4T1G164QQ K4T1G044QE Now 1Gb E-die 8Banks K4T1G084QE K4T1G164QE K4T1G044QF Now Now Jun. ’10 May. ’10 Now 1Gb F-die 8Banks K4T1G084QF K4T1G164QF 2Gb A-die 8Banks K4T2G044QA K4T2G084QA -3- Product Guide 3. DDR2 SDRAM Module Ordering Information 1 2 3 4 5 6 7 8 9 10 Apr. 2010 DDR2 SDRAM Memory 11 12 13 MXXXTXXXXXXX-XXXX Memory Module DIMM Type Data bits DRAM Component Type Depth # of Banks in Comp. & Interface Bit Organization 1. Memory Module : M 2. DIMM Type 3 : DIMM 4 : SODIMM 3. Data Bits 78 : 91 : 92 : 93 : 95 : 70 : x64 x72 x72 x72 x72 x64 240pin Unbuffered DIMM 240pin ECC unbuffered DIMM 240pin VLP Registered DIMM 240pin Registered DIMM 240pin Fully Buffered DIMM 200pin Unbuffered SODIMM 8. Component Revision M B D F I R : : : : : : 1st Gen. 3rd Gen. 5th Gen. 7th Gen. 10th Gen. 18th Gen. A C E G Q : : : : : 2nd Gen. 4th Gen. 6th Gen. 8th Gen. 17th Gen. AMB Vendor Speed Temp & Power PCB Revision Package Component Revision 9. Package Z J Q H M E B : : : : : : : FBGA(Lead-free) FBGA DDP (Lead-free) FBGA QDP (Lead-free) FBGA (Lead-free & Halogen-free) FBGA DDP (Lead-free & Halogen-free) FBGA QDP (Lead-free & Halogen-free) FBGA (Lead-free & Halogen-free, Flip Chip) 4. DRAM Component Type T : DDR2 SDRAM 5. Depth 32 : 32M 64 : 64M 28 : 128M 56 : 256M 51 : 512M 1G : 1G 33 65 29 57 52 1K : 32M (for 128Mb/512Mb) : 64M (for 128Mb/512Mb) : 128M (for 128Mb/512Mb) : 256M (for 512Mb/2Gb) : 512M (for 512Mb/2Gb) : 1G (for 2Gb) 10. PCB Revision 0 : Mother PCB 2 : 2nd Rev. 4 : 4th Rev. 1 3 A S : : : : 1st Rev. 3rd Rev. Parity DIMM Reduced PCB 6. # of Banks in comp. & Interface 5: 6: 4Banks & SSTL-1.8V 8Banks & SSTL-1.8V 11. Temp & Power C : Commercial Temp.( 0°C ~ 95°C) & Normal Power L : Commercial Temp.( 0°C ~ 95°C) & Low Power Y : Commercial Temp.( 0°C ~ 95°C) & Low Voltage 12. Speed CC : DDR2-400 D5 : DDR2-533 E6 : DDR2-667 F7 : DDR2-800 E7 : DDR2-800 7. Bit Organization 0 3 4 6 7 8 9 : : : : : : : x4 x8 x16 x 4 Stack (JEDEC Standard) x 8 Stack (JEDEC Standard) x 4 Stack x 8 Stack (200MHz @ CL=3, tRCD=3, tRP=3) (266MHz @ CL=4, tRCD=4, tRP=4) (333MHz @ CL=5, tRCD=5, tRP=5) (400MHz @ CL=6, tRCD=6, tRP=6) (400MHz @ CL=5, tRCD=5, tRP=5) 13. AMB Vendor For FBDIMM : Intel 5 6, 8 : IDT 3, 4 : Montage NOTE : PC2-6400(DDR2-800), PC2-5300(DDR2-667) PC2-4200(DDR2-533), PC2-3200(DDR2-400) -4- Product Guide 4. DDR2 SDRAM Module Product Guide 240Pin DDR2 Unbuffered DIMM Org. 64Mx 64 Density 512MB Part Number M378T6464QZ(H)3 M378T6464EHS M378T2863QZ(H)S 128Mx 64 1GB 128Mx 72 M378T2863EHS M378T2863FBS M391T2863QZ(H)3 M391T2863EH3 M391T2863FB3 M378T5663QZ(H)3 256Mx 64 2GB 256Mx 72 M378T5663EH3 M378T5663FB3 M391T5663QZ(H)3 M391T5663EH3 M391T5663FB3 512Mx 64 512Mx 72 4GB M378T5263AZ(H)3 M391T5263AZ(H)3 Speed CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CF7/E6 CF7/E6 256M x 8 * 16pcs 256M x 8 * 18pcs 128M x 8 * 18pcs 128M x 8 * 16pcs 128M x 8 * 9pcs 128M x 8 * 8pcs Composition 64M x 16 * 64M x 16 * 4pcs 4pcs Comp. Version 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 2Gb 2Gb Q-die E-die Q-die E-die F-die Q-die E-die F-die Q-die E-die F-die Q-die E-die F-die A-die A-die Apr. 2010 DDR2 SDRAM Memory Internal Banks 8 Rank 1 1 PKG 84 ball FBGA Height 30mm Avail. Now 8 1 60 ball FBGA 30mm Now Jun. ’10 Now Jun. ’10 Now 60 ball FBGA Jun. ’10 Now Jun. ’10 8 1 8 2 30mm 8 2 68 ball FBGA 30mm Now -5- Product Guide 200Pin DDR2 SODIMM Org. Density Part Number M470T6464QZ(H)3 64Mx 64 512MB M470T6464EHS M470T6554IH3 M470T2864QZ(H)3 128Mx 64 1GB M470T2864EH3 M470T2863EH3 M470T2863FB3 M470T5663QZ(H)3 256Mx 64 2GB M470T5663EH3 M470T5663FB3 512Mx 64 4GB M470T5267AZ(H)3 Speed C(L)E7/F7/E6 C(L)E7/F7/E6 CE6 C(L)E7/F7/E6 C(L)E7/F7/E6 C(L)E7/F7/E6 CE7/F7/E6 C(L)E7/F7/E6 C(L)E7/F7/E6 CE7/F7/E6 C(L)F7/E6 st.512M x 8 * 8pcs 128M x 8 * 16pcs Composition 64M x 16 * 32M x 16 * 64M x 16 * 4pcs 8pcs 8pcs Comp. Version 1Gb 1Gb 512Mb 1Gb 1Gb 128M x 8 * 8pcs 1Gb 1Gb 1Gb 1Gb 2Gb Q-die E-die I-die Q-die E-die F-die Q-die E-die F-die A-die Apr. 2010 DDR2 SDRAM Memory Internal Banks 8 4 Rank 1 2 2 PKG Height Avail. 84 ball FBGA 84 ball FBGA 30mm Now 8 1 60 ball FBGA 60 ball FBGA 30mm Now May. ’10 Now May. ’10 8 2 30mm 8 2 83 ball FBGA 30mm Now -6- Product Guide 240Pin DDR2 Registered DIMM Org. Density Part Number Speed Composition Comp. Version Apr. 2010 DDR2 SDRAM Memory Internal Banks Rank PKG Height Avail. M393T2863QZ(H)3 128Mx 72 1GB M393T2863QZ(H)A M393T2863FB3 M393T5663QZ3 M393T5663QZ(H)A 256Mx 72 2GB M393T5660QZ3 M393T5660QZ(H)A M393T5660FB3 M393T5160QZ3 M393T5160QZ(H)A 512Mx 72 4GB M393T5160FB3 M393T5260AZ(H)A M393T1G60QJ(M)A 1Gx 72 8GB M393T1K66AZ(H)A CD5/CC CE7/F7/E6 CE7/F7/E6 CD5/CC CE7/F7/E6 CD5/CC CE7/F7/E6 CE7/F7/E6 CD5/CC CE7/F7/E6 CE7/F7/E6 CF7/E6 CE6/D5 CF7/E6 512M x 4 * 18pcs DDP 512M x 4 * 36pcs st.1G x 4 * 18pcs 256M x 4 * 36pcs 256M x 4 * 18pcs 128M x 8 * 18pcs 128M x 8 * 9pcs 1Gb 1Gb Q-die F-die 8 8 1 1 2 60 ball FBGA 30mm Now Jun. ’10 1Gb Q-die 8 1 60 ball FBGA 30mm Now 1Gb 1Gb 1Gb 2Gb 1Gb 2Gb F-die Q-die F-die A-die Q-die 8 A-die 2 8 1 4 60 ball FBGA 68 ball FBGA 63 ball FBGA 83 ball FBGA Jun. ’10 Now 30mm Jun. ’10 Now 2 30mm Now -7- Product Guide 240Pin DDR2 VLP Registered DIMM Org. Density Part Number Speed Composition Comp. Version Apr. 2010 DDR2 SDRAM Memory Internal Banks Rank PKG Height Avail. 64Mx 72 128Mx 72 512MB 1GB M392T6553GZA M392T2863QZ(H)A M392T2863FBA M392T5660QZ(H)A CF7/E6 CF7/E6 CE7/F7/E6 CF7/E6 CE7/F7/E6 CF7/E6 CE7/F7/E6 CF7/E6 CE6/D5 64M x 8 * 9pcs 128M x 8 * 9pcs 512Mb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb 1Gb G-die Q-die F-die Q-die F-die Q-die F-die Q-die Q-die 4 8 1 1 60 ball FBGA 60 ball FBGA 18.3mm 18.3mm Now Now Jun. ’10 Now 256Mx 72 2GB M392T5660FBA M392T5663QZ(H)A M392T5663FBA 256M x 4 * 18pcs 1 8 2 8 8 2 4 63 ball FBGA 65 ball FBGA 18.3mm 18.3mm 60 ball FBGA 18.3mm Jun. ’10 Now Jun. ’10 Now Now 128M x 8 * 18pcs DDP 512M x 4 * 18pcs QDP 1G x 4 * 18pcs 512Mx 72 1Gx 72 4GB 8GB M392T5160QJ(M)A M392T1G60QQ(E)A -8- Product Guide 240Pin DDR2 Fully Buffered DIMM(1.8V) Org. 64Mx 72 Density 512MB Part Number M395T6553GZ4 Speed CE7/F7/E6 CE6 CE7/F7/E6 M395T2863QZ(H)4 128Mx 72 1GB M395T2863FB4 CE7/F7/E6 CE6 CE7/F7/E6 CE7/F7/E6 M395T5663QZ(H)4 256Mx 72 2GB M395T5663FB4 CE7/F7/E6 CE6 CE7/F7/E6 CE7/F7/E6 M395T5160QZ(H)4 CE6 CE6 M395T5160FB4 M395T5163QZ(H)4 M395T5163FB4 M395T5263AZ(H)4 CE7/F7/E6 CE7/F7/E6 CE7/F7/E6 CF7/E6 CF7/E6 CE6/F7 CF7/E6/D5 CF7/E6 AMB 6 : IDT C1 5 : Intel D1 6 : IDT C1 8: IDT L4 5 : Intel D1 6 : IDT C1 8: IDT L4 6 : IDT C1 8: IDT L4 5 : Intel D1 3: Montage D3 6 : IDT C1 8: IDT L4 6 : IDT C1 8: IDT L4 5 : Intel D1 3: Montage D3 6 : IDT C1 8: IDT L4 8: IDT L4 6 : IDT C1 8: IDT L4 6 : IDT C1 8: IDT L4 8: IDT L4 6 : IDT C1 8: IDT L4 256M x 8 * 18pcs 128M x 8 * 36pcs 256M x 4 * 36pcs 1Gb 1Gb 1Gb 2Gb 1Gb 128M x 8 * 18pcs 1Gb 1Gb 128M x 8 * 9pcs 1Gb 1Gb Composition 64M x 8 * 9pcs Comp. Version 512Mb Apr. 2010 DDR2 SDRAM Memory Internal Banks 4 Rank 1 PKG 60 ball FBGA Height 30.35mm Avail. Now G-die Q-die 8 F-die 1 60 ball FBGA Now 30.35mm Jun. ’10 Q-die 8 F-die 2 60 ball FBGA Now 30.35mm Jun. ’10 Q-die 2 60 ball F-die Q-die F-die A-die 4 68 ball FBGA 63 ball FBGA 83 ball FBGA 30.35mm 8 FBGA 30.35mm Now 512Mx 72 4GB Jun. ’10 Now Jun. ’10 Now 2 M395T1G60QJ(M)4 1Gx 72 8GB M395T1K66AZ(H)4 DDP 512M x 4 * 36pcs 1Gb Q-die 8 4 Now st.1G x 4 * 18pcs 2Gb A-die 2 -9- Product Guide 240Pin DDR2 Fully Buffered DIMM(1.55V) Org. Density Part Number Speed AMB Composition Comp. Version 1Gb Apr. 2010 DDR2 SDRAM Memory Internal Banks 8 Rank PKG 60 ball FBGA 60 ball FBGA 60 ball FBGA 68 ball FBGA 83 ball FBGA Height Avail. 128Mx 72 1GB M395T2863QZ(H)4 YE6 8: IDT L4 64M x 8 * 18pcs Q-die 1 30.35mm Now 256Mx 72 2GB M395T5663QZ(H)4 M395T5160QZ(H)4 YE6 YE6 YE6 YE6 8: IDT L4 8: IDT L4 8: IDT L4 8: IDT L4 128M x 8 * 18pcs 256M x 4 * 36pcs 128M x 8 * 36pcs 256M x 8 * 18pcs 1Gb Q-die 8 2 2 30.35mm Now 512Mx 72 4GB M395T5163QZ(H)4 M395T5263AZ(H)4 1Gb Q-die 8 4 2 30.35mm Now 2Gb A-die 1Gx 72 8GB M395T1K66AZ(H)4 YE6 8: IDT L4 st.1G x 4 * 18pcs 2Gb A-die 8 2 30.35mm Now - 10 - Product Guide 5. Package Dimension 60Ball FBGA for 1Gb Q-die (x4/x8) 9.00 ± 0.10 0.80 x 8 = 6. 40 0.80 9 8 7 6 5 1.60 4 3 2 1 B # A1 INDEX MARK A Apr. 2010 DDR2 SDRAM Memory 9.00 ± 0.10 #A1 A B C D 11.00 ± 0.10 11.00 ± 0.10 E F G H J K L 1.60 0.80 0.80 x 10 = 8.00 0.10MAX 0.35±0.05 1.10±0.10 (0.95) (1.90) Bottom Top 84Ball FBGA for 1Gb Q-die (x16) 9.00 ± 0.10 0.80 x 8 = 6. 40 0.80 9 8 7 6 5 1.60 4 3 2 1 9.00 ± 0.10 B #A1 # A1 INDEX MARK A 0.10MAX A B C D E 0.80 x 14 = 11.20 F G H J K L M N P R (0.95) (1.90) 1.60 0.80 13.00 ± 0.10 13.00 ± 0.10 0.35±0.05 1.10±0.10 Bottom Top - 11 - 0.50±0.05 0.50±0.05 Product Guide 60Ball FBGA for 1Gb E-die (x4/x8) Apr. 2010 DDR2 SDRAM Memory 7.50 ± 0.10 0.80 x 8 = 6. 40 (Datum A) A # A1 INDEX MARK B 3 2 1 #A1 7.50 ± 0.10 3.20 0.80 9 A B C D E F H J K L (0.95) 0.80 G 8 7 6 5 1.60 4 (Datum B) 0.80 0.80 x 10 = 8.00 4.00 9.50 ± 0.10 9.50 ± 0.10 0.10MAX 0.35±0.05 1.10±0.10 MOLDING AREA 60-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B (1.90) Bottom Top 84Ball FBGA for 1Gb E-die (x16) 7.50 ± 0.10 0.80 x 8 = 6. 40 3.20 0.80 (Datum A) A # A1 INDEX MARK B 3 2 1 #A1 7.50 ± 0.10 1.60 6 5 4 9 A B C D E F G H K L M N P R J 8 7 (Datum B) 0.80 0.80 x 14 = 11.20 12.50 ± 0.10 0.80 4.00 12.50 ± 0.10 0.10MAX 0.35±0.05 1.10±0.10 (0.95) 84-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B MOLDING AREA (1.90) Bottom Top - 12 - Product Guide 60Ball FBGA for 1Gb F-die (x4/x8) Apr. 2010 DDR2 SDRAM Memory 7.50 ± 0.10 0.80 x 8 = 6. 40 (Datum A) A # A1 INDEX MARK B 3 2 1 #A1 7.50 ± 0.10 3.20 0.80 9 A B C D E F H J K L (0.30) 0.80 G 8 7 6 5 1.60 4 (Datum B) 0.80 0.80 x 10 = 8.00 4.00 9.50 ± 0.10 9.50 ± 0.10 0.10MAX 0.37±0.05 1.10±0.10 MOLDING AREA 60-∅0.48 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B (0.60) Bottom Top 84Ball FBGA for 1Gb F-die (x16) 7.50 ± 0.10 0.80 x 8 = 6. 40 3.20 0.80 (Datum A) A # A1 INDEX MARK B 3 2 1 #A1 7.50 ± 0.10 1.60 6 5 4 9 A B C D E F G H K L M N P R J 8 7 (Datum B) 0.80 0.80 x 14 = 11.20 12.50 ± 0.10 0.80 5.60 12.50 ± 0.10 0.10MAX 0.37±0.05 1.10±0.10 (0.30) MOLDING AREA 84-∅0.48 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B (0.60) Bottom Top - 13 - Product Guide 68Ball FBGA for 2Gb A-die (x4/x8) 11.00 ± 0.10 0.80 x 8 = 6.40 3.20 0.80 9 (Datum A) A B C (Datum B) D F G 0.80 x 18 = 14.40 8.00 H J K L N P R T U V W (0.95) 68-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0.2 M A B (1.90) 0.80 M 18.00 ± 0.10 7.20 E 8 7 1.60 6 5 4 3 2 1 # A1 INDEX MARK #A1 Apr. 2010 DDR2 SDRAM Memory 11.00 ± 0.10 0.10MAX 18.00 ± 0.10 MOLDING AREA 0.35 ± 0.05 1.10 ± 0.10 Bottom Top - 14 -